The two partners will assess the construction of a plant in Italy to manufacture panels using Sharp’s triple junction thin film technology. Sharp is entrusting Enel.si with the development of new photovoltaic fields in Italy for a total capacity of 161 MW
The Company’s board of directors held a meeting and approved a plan to repurchase up to US$1 billion (approximately NT$30.43 billion), or no more than 500 million shares, of the company’s common shares from the open market.
The company will establish its presence in Korea with the opening of a subsidiary to strengthen customer sales, service and support efforts and to augment existing R&D partnerships. Also to increase R&D and high volume manufacturing efforts.
Shake ups rock first quarter 2008 top 20 semiconductor supplier ranking. The biggest leaps were made by Qualcomm and Broadcom while NXP has its biggest decline.
Mattson Technology sets new standard with Alpine new photoresist strip product for BEOL and FEOL. Applications at sub 65 nanometre nodes. Initial system shipped to major semiconductor manufacturer in Taiwan
AMD senior Vice President of Manufacturing, Doug Grose, highlights operations’ efficiency in keynote address. Initiative to reduce AMD cycle time and get products to customers faster.
Intel, Samsung Electronics, TSMC reach agreement for 450mm Wafer manufacturing transition. The companies target common timeline for 450mm wafer pilot line readiness
What is a “Memristor”? And how could it provide better energy efficiency and even get close to the pattern matching capabilities of human brains? The answer could be the fourth missing building block of basic circuits. HP Labs can explain.