Materials - Enabling Award

Materials - Improvement Award

Metrology / Test / Yield Award

Metrology / Test / Yield Device Award

Wafer Processing - FEOL Award

Wafer Processing - BEOL Award

Subsystems & Components Award

Subsystems & Components Enhancement Award

Fab Management Award

To Be Announced

Air Liquide Electronics
ToRuS: ALOHA’s Total Ruthenium Solution

ToRuS was developed in 2005 as a part of new ruthenium precursor development project in Air Liquide Corporate R&D Laboratories.

ToRuS is based on a carefully tuned proprietary formulation containing an inorganic ruthenium compound in a tailored solvent mixture. Its relatively high vapor pressure (10 Torr at 25°C) compared to other commonly available ruthenium precursors allows high deposition rates without the need for canister or line heating.

Several academic institutions, industrial consortia, and equipment makers in US, Asia, and Europe have evaluated ToRuS over the last 3 years. ToRuS has been successfully demonstrated to yield excellent quality ruthenium thin films by CVD and ALD with high deposition rates (1.8 Å/cycle by ALD) and good adhesion characteristics on a variety of substrates (Si, SiO2, SiN, SiC, Al2O3, Ta2O5, TaN, HfO2,and La2O3). Recently, a research team at Seoul National University has reported outstanding process performance, illustrating that highly pure ruthenium films with low resistivity (~20μΩ.cm for 20nm film), perfect step coverage in high aspect ratio features (> 95%, in AR 13), and superior thermal stability (Rapid Thermal Annealing at 750°C) can be obtained with ToRuS. Furthermore, high surface reactivity of ToRuS enables ALD at 150°C without incubation time.

ToRuS claims more than 30% reduction in material cost when compared with conventional organo-metallic ruthenium sources. In addition, high precursor efficiency in ToRuS based process results in further reduction in process cost of ownership. ToRuS is a non-flammable, non-corrosive, solution. It is an unregulated product for transportation purposes and has no obligatory labelling requirements for oral toxicity (confirmed by tests performed following the European Community, the OECD and the EPA Health Effects Tests guidelines).

Developing a cost effective Ruthenium metallization solution is a key challenge for various applications in the electronics industry. ToRuS is a proven enabler of advanced manufacturing technologies, providing elegant process solution, at the lowest cost of ownership, with proven performance. These differentiators have allowed a rapid adoption of ToRuS in production of Giant Magneto-Resistive (GMR) and Tunneling MagnetoResistive (TMR) read sensors by low temperature ruthenium ALD, and other novel applications requiring high purity ruthenium film deposition are being actively pursued by OEMs and industrial consortia worldwide. This product has promise for both the semiconductor and hard disk drive industries and has achieved recognition as an enabling material.

Agilent Technologies
Long-life DUV optical coatings

Agilent Technologies with their deep-UV optical coating, address the growing need for highly accurate and reliable beam delivery in leading-edge semiconductor photolithography systems.

Challenges for system designers include coating compaction and optic lifetime. The proprietary high-throughput UV coatings claim to increase component lifetime while minimising compaction. The long-lifetime optics reduce production costs by extending the time between required maintenance cycles and reducing system downtime. Reflectivity and damage-threshold testing have been successful and in independent tests Agilent has qualified multiple coating chambers, thus ensuring product availability

Agilent's vertically integrated design-to-production facility includes in-house fabrication (shaping, grinding and polishing) and coating (deep-UV to near-IR) capabilities. Comprehensive metrology and use of the latest equipment to monitor and control pressure, temperature and rate ensure accurate and repeatable production processes. AR coated calcium fluoride prisms offer an alternative to flat turning mirrors. Calcium fluoride is more robust than UV-grade fused silica, and has been shown to withstand billions of pulses without serious compaction issues. Al2O3/AlF3 or LaF3/MgF2 or similar thin-film anti-reflection coatings on the prisms have very low layer counts that allow very little compaction in the coating layer. By limiting the number of layers and mitigating compaction issues, the effective bandwidth of the thin film coating can be expanded to allow a much wider acceptance angle at the entrance and exit faces, improving the performance of the optical system.

Cabot Microelectronics Corporation
B6600 Series of CMP Slurries for Low K Devices

The B6600 barrier slurry platform builds on Cabot Microelectronics' CMP slurry technology and is the result of extensive research and development intended to deliver an integrated, best-in-class solution for copper barrier CMP at advanced technology nodes.

The B6600 barrier slurry platform is tunable, enabling the products to be easily customised to deliver excellent planarity and defect performance across a wide range of integration schemes. Technology advancements made by Cabot Microelectronics' scientists provide excellent low-K dielectric and copper removal rate control, resulting in superior electrical performance. The B6600 barrier slurry products are being produced and used worldwide for technology nodes from 90 nm through 45 nm.

Swagelok
CR-288 chemical concentration monitor

The Swagelok CR-288 concentration monitor addresses a requirement in the semiconductor industry for improved monitoring and control of liquid chemicals employed in device manufacturing. Installed in the process stream or at point-of-use where chemicals are delivered or blended, the technology delivers real-time, highly accurate measurements of the concentration and temperature of process fluids. The CR-288 is claimed to be the first compact device in the industry to provide in-line analysis of liquid chemical concentration. Designed specifically for the semiconductor industry, it is physically small, easy to install, and serviceable in the field. Proprietary software enables a technician to calibrate the unit for chemical mixtures used in semiconductor laboratory or manufacturing processes, including etching, wafer cleaning, and chemical mechanical planarization (CMP). The software provides a graphical readout that the technician may customise for data logging over time.

With the ability to monitor up to four separate fluid streams with one digital display unit, the device can help the industry reduce chemical consumption, improve process control and visibility, detect process problems, reduce wafer scrap, and improve productivity. In addition, it will facilitate point-of-use spiking, blending, and mixing and help ensure chemical and ultrapure water quality. The CR-288 employs an LED light source, a mirror, a sapphire and a photodiode-array detector to measure refraction. Light is beamed at a sapphire window that is in contact with the process liquid. A reading is taken as the light bounces back, enabling computer software to determine the index of refraction for the liquid in question. That index of refraction may then be compared to the index of refraction for the desired blend or concentration of chemicals. The only components that come into contact with the liquid are the sapphire window and the body of the sensor, which is made of ultrahigh purity modified PTFE. A thermocouple inside the optical fluidic cell takes a temperature reading. A liquid’s index of refraction is a function of concentration and temperature.

Applied Chemical Laboratories
Post etch residue remover

ACL-585 HiPER-Solv’ is a high performance etch residue solvent that claims to give a significant improvement in removal of post-etch hardened polymers and polymer residue from metal and via etch processes when compared with conventional hydroxylamine or solvent-amine products. ACL-585 is specifically formulated for advanced sub-90 nm design rules that incorporate high density plasma etch. The solvent is non-corrosive and environmentally benign.

HiPER-Solv dissolves hard to remove inorganic or organo-metallic polymers from post-metal and post-via etch layers that is claimed to be 2 to 3 times faster than conventional removers. Cleaning time is said to be reduced to 5 to 10 minutes compared with 20 to 40 minutes required by standard polymer removal recipes. ACL-585 works at a lower temperature (35°C to 65°C) compared with traditional HA and solvent-amine formulations that require process temperatures from 65°C to 80°C, according to the company.

ACL-585 enables the engineer to design and operate in a larger process window without sacrificing device performance. A critical feature claimed of ACL-585 is that it bridges the aluminium-to-copper transition, enabling the chemistry to readily clean polymers from aluminium and copper devices without causing corrosion. With an etch rate of less than 1Å/min for both copper and aluminium and being virtually inert to ultra low-k dielectric films, ACL-585 is claimed to eliminate redundant chemical distribution systems and facilitates multiple integration schemes.

Owing to its stable bath life, the efficacy is maintained 2 to 3 times longer than that of hydroxylamine removers. With its lower operating temperature there is a reduction in evaporation loss and a claimed reduction in tool ramp time. ACL-585 also eliminates costly disposal of segregated solvent waste streams associated with the use of hydroxylamine and fluorinated compounds. Requiring only a DI water rinse, this eliminates the cost, handling and disposal of post-strip rinse solutions or IPA; cost savings are claimed to be as much as 40 percent compared with traditional remover chemistry.

ACL-585 is designed for single wafer, batch immersion, and batch spray tool applications. It is 100 percent water soluble, non-flammable and free from ethylene glycols, ammonium fluoride, HF, NMP, DMSO, and hydroxylamine. With the move to “green manufacturing”, fabs require less harmful and safer materials to replace hazardous chemicals. ACLI products are supplied in certified, low particulate, low metal specialty containers.

K-Patents
Semicon Process Refractometer PR-33-S

The PR-33-S is K-Patents refractometer line for monitoring and measuring the liquid chemical concentrations throughout the whole semiconductor fabrication process, from chemical supplies to fab in-line and tool in-situ chemical quality control.

The PR-33-S is specifically designed for the ultra clean environments and integrated process tools. The PR-33-S monitors real time the chemical concentrations and provides an ethernet output signal and immediate feedback, if the chemical is not within the specifications. The concentration is determined by making an optical measurement of the solution’s refractive index. The advantage of this principle is that the same instrument can be used to measure any chemical.

The PR-33-S consists of an ultra pure PTFE teflon sensor and an ethernet connection, connectors and cabling that any standard PoE switch can use for transmitting power to the sensor and data to a computer. The average payback time for this refractometer is 3-6 months.

MSG Lithoglas AG

Borosilicate glass is well known for its chemical inert behaviour and stability. It is temperature stable and hardly dissolves in most acids, bases and solvents. It is the close-to-perfect material for semiconductor packaging in respect to its electrical, chemical and physical properties. Through being successful in special applications like anodic bonding or glass-to-metal seals, the use of glass for mainstream packaging of semiconductors was limited by lacking CMOS process compatibility and other manufacturing limitations.

MSG Lithoglas AG has developed and implemented a deposition and structuring technology, which enables the production of microstructured borosilicate glass thin-films with a thickness of 100 nm to 30 µm on a large variety of substrates at temperatures well below 100 °C.

The deposition of the glass is done by a plasma-assisted e-beam evaporation process. It is a high rate deposition process with at the same time low substrates temperature. With the high deposition rate typical film thicknesses of 3 – 10 µm can be achieved easily and production can be run as a cost effective batch process. Thicker layers as thick as 100 µm have been demonstrated in R&D. They have proven to exhibit low stress in the deposited layers and leverage from their thermal expansion being matched to silicon.

The glass layer can be microstructured by lift-off. Since the deposition process is working at low temperatures standard photo resists can be used for masking.

As a mainstream application the glass thin-films are used for passivation of opto-semiconductors on Si or GaAs easily meeting harsh environment reliability requirements e.g. for automotive or space applications.

The high-volume Lithoglas process is CMOS-Backend compatible and runs e.g. on SEMI standard silicon device wafer, but also allows for processing of thin-film glass for a large variety of other applications incl. Ge, InP, SiC, LiNbO3, Borofloat or Pyrex, HTCC or LTCC substrates or even flexible substrates.

The combination of a low temperature deposition process with the excellent properties of glass being hermetic, chemically stable and robust enables a unique and revolutionary solution for the passivation of semiconductors or other sensitive devices.

The Lithoglas process is a unique approach bring wafer-level-packaging to a new level of reliability. It has the potential to replace polymers in harsh environment applications and to expand the conditions of use for low cost electronics.

The cost-effective, CMOS compatible process can act as a drop-in replacement of CVD or polymer passivation leveraging from existing infrastructure ensuring excellent and stable manufacturability. The technology approach is new and inventive, matching the requirements of advanced wafer-level packaging.

Advanced Metrology Systems (AMS)
IR3100N extended wavelength MBIR system

The IR3100N, is a model-based infrared (MBIR) reflectance metrology solution for measuring 3D structures. The IR3100N includes proprietary optics and an extended near infrared (NIR) measurement designed for highly automated measurements of product wafers at the 70nm node and below.

The IR3100N uses a proprietary optical source and detection system to extend the range of the tool to include the mid-infrared and near-infrared spectral ranges 500 to 11,000cm-1 (20 to 0.9µm) in a single measurement without sacrificing sensitivity, reproducibility, or data acquisition time. When combined with the pattern recognition capability of Cognex ‘PATMAX' and real-time auto-focus capability, the IR3100N is suited for online, highly automated measurements of product wafers at the 7nm node and below. This extended range enables more accurate and repeatable measurements of shallow structures such as Recess 2 or Recess 3 in DT DRAM applications, as well as significantly improved accuracy and repeatability for thin (20nm) epitaxial film measurements.

The IR3100N uses the AMS Series 3000 platform. This highly automated, E84 capable, dual loadport system can be configured for 200/300mm or 150/200mm mixed wafer size operation as well as standard dual 300mm FOUP, 200mm SMIF or open cassette systems. The loadports can be changed in the field to allow reconfiguration of the wafer handling system as customers change wafer sizes or automation needs. The automation backbone software is based on Peer Group's advanced PTO3 automation solution and has been tested in fabs worldwide.

Applied Materials Inc
FullVision System

Applied Materials ‘FullVision’ system enables real-time control of dielectric CMP processes for the 45nm node and beyond. The FullVision system couples Applied's patented window-in-pad technology with multiple-wavelength spectroscopy to deliver advanced in situ endpoint capability for a variety of dielectric materials, including oxide, STI and poly CMP applications. As films become thinner, CMP becomes increasingly difficult, requiring much more precise wafer-to-wafer process control to achieve acceptable yields. Using broadband spectral analysis, FullVision technology monitors individual polishing zones across the wafer that are claimed to provide twice the accuracy and repeatability of competitive systems on a wide variety of process steps – without compromising throughput.

The Applied Reflexion LK CMP system implements a full suite of endpoint methods, in-line metrology and advanced process control capabilities. Its patented window-in-pad technology enables real-time polish control of every wafer without compromising throughput. The FullVision in-situ endpoint system, for all stop-in and stop-on dielectric applications, uses broadband spectroscopy to significantly improve Cpk and minimize wafer scrap caused by drifts in consumable sets and incoming wafer variations. The system demonstrates high repeatability across all applications with less than 150 angstrom, 3-sigma endpoint accuracy on patterned wafers. A major advance over single wavelength endpoint technologies, the FullVision system offers improved measurement accuracy with a claimed 50 percent higher reliability for dielectric applications.

KLA-Tencor Corporation
Memory- and Logic-Specific Brightfield Inspection Systems

KLA-Tencors’ additions to the 28xx brightfield inspection platform, features specialised optical configurations that claim to solve the defect detection challenges of sub-55 nanometer (nm) memory and sub-45 nm logic chip manufacturers.

Both the 2810 system for memory and the 2815 system for logic use illumination technology to capture a range of defect types, including immersion lithography defects.

The systems' production throughput at sensitivity has more than doubled for many applications, compared with the previous 2800 system.

The specialised 2810 and 2815 brightfield inspection tools enable memory and logic chipmakers to focus their inspection strategies on yield-limiting defect types found in their particular leading-edge devices. With the sensitivity and flexibility to find all defects of interest on all critical layers, and two times the computing speed, the 2810 and 2815 contribute to faster ramps and accelerated time to market.

The 2815 system features hardware and algorithms that address defects specific to logic designs. Its optical modes are designed to enable defect type capture on the geometries and materials found in sub-45 nm logic devices.

For sub-55 nm memory applications, the 2810 inspection system features memory-specific optical modes and algorithms that detect bridges, voids and other defects on both array (repeating) and periphery (nonrepeating) structures.

Because the optimal inspection wavelength needed to capture all critical defects varies with material, pattern geometry and design rule, the 281x-series tools use a tunable full-spectrum illumination source covering deep ultraviolet (DUV), UV and visible wavelengths.

This technology claims optimal defect contrast, nuisance suppression and the high resolution required to detect critical defects on an extended range of layers, devices and design rules.

Features, common to both systems, reduce the inspector's recipe optimisation time by up to 50%, and the 281x system advancements in automated defect binning improve the quality of the defect Pareto, enabling faster identification and resolution of the root cause.

Nova Measuring Instruments Ltd.
NovaScan 3090 series

This system forms an advanced metrology platform for Critical Dimension (CD) control and profile measurements, and is designed so that it can operate both as an integrated metrology and stand alone platform for 200mm and 300mm systems, for 65nm IC manufacturing and beyond.

The NovaScan 3090CD is based on Nova’s earlier field proven technology platform, the NovaScan 3060CD system. NovaScan 3090CD is integrated in the exact same configuration as the NovaScan 3060CD system, thus offering customers an easy upgrade path. Equipped with a single polarized channel, from Deep-UV to Near-IR, the NovaScan 3090CD supports the measurement of 2D structures and enables 3D shape characterization. The system provides real-time measurement of CD, trench depth, photoresist height, thickness and shape of complex layer stacks. The reliable single channel system provides the highest throughput of an integrated system in the market, while maintaining the cleanliness and hermetic structure needed to operate in different process conditions. The system demonstrates a 2X performance improvement in metrology capabilities over the NovaScan 3060CD, with enhanced throughput capabilities, while integration and physical layout remain unchanged.

PDF Solutions
The Memory Yield Enhancement solution

Based on PDF Solutions' tools, methods, and services designed to accelerate yield ramps and optimise mature yields.

The Memory Yield Enhancement solution addresses the special challenges and constraints that memory IC manufacturers face as they strive to reduce the duration of new node ramps and achieve higher mature yields during mass production.

The Memory Yield Enhancement engagement encompasses deployment of PDF Solutions' ‘Characterization Vehicle' (CV) Infrastructure combined with enhanced product engineering tools and methods tailored for memory IC products, to more rapidly reduce yield loss due to random and systematic defectivity and process-design interactions. The result is a significant increase in the speed at which yield learning can occur during the process ramp, as well as enabling higher and more stable yields during subsequent mass production, the company claims. PDF Solutions' Integrated Yield Ramp (IYR) and Mass Production engagements also include a cross-functional team of engineers that works on-site collaboratively with the client to improve client profitability through accelerated yield learning and improved product performance at every stage of IC manufacturing, from early ramp through mass production. PDF Solutions' offering for the memory market includes the Back-End-Of-Line short-flow CV test chip as well as the patented Scribe CV, an array of highly-dense test structures that are placed directly in the scribe on product wafers to provide detailed information on variability in the manufacturing line.

Rudolph Technologies, Inc
Explorer Inspection Cluster

The Explorer Inspection Cluster claims fast, accurate and reliable macro inspection with flexible configuration of multi-surface inspection capabilities. The Explorer Architecture allows individual systems to be configured with any combination of wafer front, back, and edge module allowing the user to mix and match throughput and inspection type to best fit specific requirements and reduce cost-of-ownership.

The Explorer Architecture is a modular approach to wafer inspection consisting of one or more inspection modules with brightfield and darkfield illumination, a substrate handler, and software that coordinates the activities.

The Explorer Inspection Cluster is an edge and backside inspection system claiming low cost-of-ownership to the IC industry, while the NSX is used for high-volume inspection and metrology of next-generation production processes.

The Explorer’s edge and backside modules both use image-based inspection for a more in-depth data set than light scattering techniques.Controlling edge and backside defectivity has become one of the critical factors for enabling 45nm and 32nm processes, and the Explorer offers a combination of sensitivity and cost of ownership to address these issues. In addition, Discover data analysis software, offered as an option, further enhances efficiency by finding and classifying defect pattern signatures, eliminating the time-consuming task of classifying thousands of individual defects.

TEA Systems
Vector Raptor

TEA Systems software product enhances the control of overlay and registration in advanced semiconductor manufacturing to minimise the influence on critical feature dimensions and yield. Vector Raptor is a seventh generation overlay control tool specifically designed to address the unique problems now being introduced by Double Patterning and sub-45 nm process-node technology.

Vector Raptor (VR) provides an object-oriented, fully-interactive graphic interface for advanced control of overlay/registration with matching to any format feature-profile or film data. Common models are provided for all scanner tools and user-designed models can be added using the graphic interface of the VR Model Editor. These features combine to provide a new level of clarity in the precise resolution of each source of error and yield loss and its correction path. Vector Raptor is claimed to resolve the relative response of multiple feature designs, design-response to exposure and reticle-scan noise, the lens-slit signature, various contributions of the wafer-process separate from exposure-tool grid-corrections and the unique contributions of those wafer-process-sensitive perturbations of enhanced reticle designs (RET) that originate in the photomask manufacturing process.

Vector Raptor uses TEA Standard Data Format workbooks for storage of all overlay, registration and feature-profile data as well as analysis reports. TEA Systems products provide tools to import any format metrology data into the standard format workbooks. There is no charge for new-format updates.

Agilent Technologies HSTD
B1505A High Power Test System

The Agilent B1505A Power Device Analyzer / Curve Tracer claims to be the only single box solution available today with the capability to characterise high power devices from the sub-picoamp level up to 3000 volts and 20 amps. These capability covers evaluation for new power device using wide band gap materials such as silicon carbide (SiC) or gallium nitride (GaN). The B1505A has separate modules that support high-current (HCSMU) and high-voltage (HVSMU). The B1505A also supports a high-power SMU (up to 1 A/200 V) and a multi-frequency capacitance measurement unit (up to 5 MHz). Its ten-slot modular construction lets you configure the B1505A exactly the way you want.

The B1505A software environment allows users to check device characteristics and detect device faults with the easy convenience of a curve tracer. Just like on a curve tracer, the B1505A supports rotary knob control of the independent sweep variable for intuitive and real-time evaluation of parameters such as breakdown voltage. The measurement setup information and data can be automatically stored to the B1505A\'s built-in hard disk drive and transferred to USB memory sticks as well as other portable storage devices. It is also easy to print graphical measurement data and to copy and paste it into reports when the analysis results are summarized.

Qcept Technologies
ChemetriQ 3000 from Qcept Technologies

The ChemetriQ 3000 provides rapid, full-wafer, inline detection of non-visual defects (NVDs). NVDs include both organic and inorganic residues, metallic contaminants, process-induced charging, and watermarks. The ChemetriQ 3000 accomplishes this by employing a non-contact, non-destructive technology that detects work function variations on the surface of semiconductor wafers. These variations, which mark the presence of NVDs, are converted into image files using on-board software that can be easily ported to a fab’s existing analytical tools for enhanced defect classification. The ChemetriQ 3000 is sensitive to 5E9 atoms/cm2, which exceeds the requirements outlined in the ITRS Roadmap for metallic contamination detection down to the 22-nm node.

The company claim that with ChemetriQ 3000, semiconductor manufacturers can reduce their yield loss through improved process monitoring, and achieve faster yield ramps through accelerated process optimisation. For example, the ChemetriQ 3000 detects NVDs non-destructively in four minutes compared to up to six hours with destructive analytical methods, making it ideally suited for inline process monitoring.

The ChemetriQ 3000 is complementary to today’s existing optical inspection technologies, filling the inspection gap that exists today for a full-wafer, production solution that enables detection of NVDs. As the missing link in moving the detection of NVDs to a highly automated inline process, the ChemetriQ 3000 will allow chipmakers to broaden and expand their existing solution set to solve their NVD yield challenges.

In leading-edge semiconductor fabs, NVDs now account for as much as 30 percent of all defects. Since NVDs do not scatter light, they are undetectable by optical inspection systems. According to the latest edition of the ITRS Roadmap, the rapid sourcing of non-visual defects will become increasingly challenging—driving the need for affordable inspection techniques that go beyond optical microscopy and offer high resolution without sacrificing throughput. The company claim that the ChemetriQ 3000 platform is the only inline wafer inspection solution that can detect NVDs.

Wentworth Laboratories’
Megamax Vertical Probe Card

Wentworth Laboratories’ Megamax is a vertical probe card designed for the challenging combination of ultra-high current with standard pitch flip chip /bumped semiconductor devices commonly referred to as C4 devices.

Megamax is packaged in a patented construction that utilises Wentworth’s proprietary Saber Probe contact technology. Saber Probe is a photo-defined and chemically etched contact that delivers superior life performance and unsurpassed current carrying capability. The design synergy of Saber Probe contact technology in a Megamax construction delivers performance with easy field maintainability.

Megamax utilises patented contact and packaging technology to deliver robust performance. With flat tip contacts that were fine-tuned to a special hexagonal shape in cross-section, thus maximising current flow through a larger cross-section, Megamax accommodates flip chip/C4 applications requiring 170 micron pitch or higher, and delivers current carrying capability of 1.2 amp of current continuously for up to 2 minutes. Megamax can deliver sustained performance at higher current levels and with a tighter pitch as compared to competing technologies.

Megamax is capable of probing bumped devices with an excess of 16,000 bumps in a single or multi-die application, and can be interfaced to a multi-layer ceramic, multi-layer organic, or wired space transformer, or to direct dock PC boards. Wentworth provides turnkey solutions from concept to completed card, with custom designed interfaces to facilitate communications between the device, Megamax and the tester.

Megamax’ laminated construction gives easy access to individual Saber Probe contacts, thus allowing for the replacement of individual contacts without major disassembly. This feature is exclusive to Wentworth, and it enables users to perform on-site repair and maintenance on Megamax vertical probe cards. Megamax claims to improve overall cost of test as redundancy and its associated expenses are reduced, longer life cycles are achieved, and users can maintain Megamax on-site, a productivity advantage. Wentworth vertical probe cards perform to such high levels, they are guaranteed for 1,000,000 touchdowns during the first year of ownership.

Applied Materials, Inc
Applied Producer BLOk PECVD

The Applied Producer BLOk (Barrier Low k) PECVD (Plasma-Enhanced Chemical Vapor Deposition) system provides ultra low k copper barrier and etch stop films for damascene interconnect applications. With the Producer's Twin Chamber architecture, each wafer undergoes a patented in-situ copper oxide removal process prior to BLOk deposition, ensuring adhesion to copper and superior electromigration performance.

BLOk films enable reductions in the capacitance of the dielectric film stack, while maintaining etch selectivity and electrical performance, for continued RC scaling. Proven surface preparation and initiation layer processes enable BLOk II to be readily integrated with Black Diamond and BD II films, ensuring a smooth generational transition for 45nm and beyond devices.

Intevac
Lean Etch’ platform

Intevac's Lean Etch claims the first ever wafer processing system built with lean principles. The Lean Etch system's parallel architecture utilises two sets of twin linear robots to replace the large, central handler commonly found on all cluster tools. The linear platform eliminates dependency on a single, central handler and enables faster wafer transport and higher space utilisation. Additionally, a wide, central service aisle significantly eases serviceability by providing 360 degree access to the mainframe and chamber backside. Designed for manufacturability, the Lean Etch has a modular design that facilitates production ramp-ups at minimum cost. The design allows for both single sided (3 chamber) and dual sided configurations (6 chamber), for higher availability, and superior productivity. The system's compact footprint and high throughput effectively optimises clean room space and reduces total cost of ownership.

The Lean Etch chamber offers advanced capabilities for dielectric etch applications. The combination of T-source design with instant-on technology and pulsing capability claims superior etch process control, a large process window; higher etch rates, a continuous vertical profile and high PR selectivity.

Lam Research Corporation
2300 Motif Post-lithography Pattern Enhancement System

The 2300 Motif post-lithography pattern enhancement system is designed for cost-effective production of next-generation feature sizes using current lithography technology. Employing a proprietary plasma-assisted process, the system delivers controlled photoresist hole and space CD shrinks of up to 100 nm, creating features as small as 10 nm, demonstrating extendibility to the 22 nm node and beyond.

To shrink feature sizes, the 2300 Motif deposits a thin film coating on printed photoresist holes and spaces. The film is typically the thickness of the desired feature shrink. Using current lithography and mask technology, the photoresist holes and spaces are printed at a large enough size to optimise exposure latitude and minimize distortion. The shrink process is applied after lithographic patterning to reduce printed features to the desired size prior to etching. After etch, the film deposited by Motif is removed during the photoresist strip step.

The film deposited by Motif enhances etch plasma resistance, resulting in reduced line roughening and distortion during pattern shrinking and transfer, providing excellent CD uniformity, typically equivalent to or better than incoming lithography. In addition, the Motif process can be tuned for a range of feature sizes in the pattern.

Nikon Corporation
NSR-S310F

The NSR-S310F is an advanced ArF scanner for high volume manufacturing of 65 nm or smaller devices. The system uses Nikon Tandem Stage technology to increase throughput, improve alignment accuracy, and enhance long-term stability. With the throughput increased to 174 wafers per hour – a 20% increase over the previous generation Nikon scanner – cost of ownership is significantly reduced. The Tandem Stage also helps improve alignment accuracy to better than 7 nm.

The projection optics (0.92 NA) and illumination system provide superior image quality and CD control across the wafer with the low aberration and flare levels. Nikon’s fourth generation polarization control system, POLANO, and optional infrared aberration control (IAC) provide further imaging benefits.

Novellus
Vector Extreme

VECTOR Extreme is a 300 mm PECVD system designed for memory fabs with high throughput requirements. Capable of processing up to 250 wafers-per-hour, VECTOR Extreme features a central wafer process chamber with a dual handling robot that allows the integration of up to three PECVD process modules on a single system Employing Novellus' multi-station sequential processing (MSSP) architecture, the VECTOR Extreme's process modules retain hardware transparency with VECTOR Express for ease of process integration between platforms. In comparison to industry benchmarks, the system improves capital productivity by greater than 25%, and shows a commensurate reduction of greater than 40% in the number of tools required in the fab.

VECTOR Extreme is also available in an ashable hard mask configuration, the VECTOR Extreme AHM.

Tokyo Electron (TEL)
CELLESTA +

CELLESTA+, is TEL’s 300mm single wafer cleaning tool.

Based on TEL’s coater/developer CLEAN TRACKTM LITHIUS ProTM platform, the CELLESTA+ claims high reliability, process performance and throughput for the most advanced critical cleans for the 45nm technology node and beyond. The advanced single wafer cleaning system has a 12 process spin chamber configuration, enabling a high throughput of 333 wafers per hour. The system also includes two features to reduce overall system footprint and maximise performance: a compact spin unit design and onboard chemical supply.

Firstly, TEL's advanced IPA drying technology eliminates the generation of watermarks which are typically associated with HF-last processes and pattern collapse damage that is typically associated with surface tension gradient drying techniques on high aspect ratio features, such as DRAM capacitors. Secondly, CELLESTA+ has an enhanced atomised spray (AS3), which provides a large process window for high particle removal efficiency (PRE) with no pattern or surface structure damage.

ULVAC Technologies
Enviro Optima

Enviro Optima is a 300mm resist strip system offering 3 loadports. Combined with fast new wafer handling robotics, the company claims Enviro Optima's straightforward design results in the highest throughput with the smallest footprint (67wph/m2) for systems under $1 million.With less cleanroom space required, this resist strip system promises the lowest CoO, which is achieved by providing high throughput at lower total system cost. The Enviro Optima is designed for all resist strip work including high dose implant, residue removal, and surface preparation applications.

• Quick resist removal rates of >10µm/min
• Comparable in size to a typical 200mm system
• Smallest 300mm resist strip system offering 3 loadports on the market
• Throughput with the smallest footprint (67wph/m²) for systems under $1 million.

Axcelis Technologies
Optima XE

The Optima XE high-energy ion implanter, is the final component of Axcelis’ Optima single wafer suite of tools, which provides a complete range of energy levels from 10keV to 4MeV. The Optima XE is designed to provide a broad energy range to perform all isolation and retrograde well implants for advanced devices. With its new single wafer endstation, it can also perform medium current implants.

The Optima XE uses Axcelis' production-proven RF Linac high-energy spot beam technology, ensuring that all points across the wafer see the same beam at the same angle, resulting in improved process control and yields. To meet CoO targets, the system has a throughput of up to 400 wafers/hour, which is due in part to its claim of having the widest single-charge operating range. Optima XE also combines Axcelis' RF Linac high-energy spot beam technology with a high-speed, state-of-the-art single wafer endstation capable of significantly improved throughput. The Optima XE offers flexibility, covering a wide range of energy levels from 10keV to 4MeV.

Jenoptik Automatisierungstechnik GmbH
VOTAN G Semi

VOTAN G Semi, is a wafer dicing system that utilises Thermal Laser Separation (TLS). The system was developed as an alternative to established mechanical dicing saws and other laser dicing technologies to deliver a highly precise cutting edge. It is especially well suited for applications with special demands on edge quality – like optical devices or power devices with vertical current flow.

TLS-Wafer-Dicing by JENOPTIK Automatisierungstechnik GmbH is a full separation technology for semiconductor materials. The Thermal Laser Separation (TLS) process thermally induces mechanical stress in the material using a laser to perform the dicing process.

The Equipment
The JENOPTIK-VOTAN Semi 300 is a complete dicing equipment for back-end class 6 clean rooms. The JENOPTIK-VOTAN Semi 300 processes film frame mounted wafers (150 mm - 300 mm; 6“ - 12“) fully automatic. The optional handling operates one/two magazines. The JENOPTIK-VOTAN Semi 300 – including the laser – is a low maintenance equipment. The tool comes with our patent pending edge protection stretch technology and a couple of control and measurement tools (alignment camera, kerf-check microscope, code scanner).

• water free gas cooling
• SECS/GEM interface

• Higher yield as a result of the zero kerf in combination with the increased bending strength of the diced dies (no chipping or micro cracks occur).
• Higher throughput by the unrivalled dicing speed (up to 300 mm/s) for thin wafers (50 ... 250 µm).
• Reduced cost of ownership because of the ablation free process – neither protection or cleaning steps nor consumables are required.
• The excellent edge quality in combination with other advances can be used for new and improved products like power devices, MEMS, optical devices or RFID.

SOKUDO
RF3T Coat/Develop System

The RF3T system, the company's highest productivity, lowest cost-of-ownership (CoO) coat/develop track system targeted for the full range of lithography applications. This system extends the capabilities of SOKUDO's established RF3 platform to achieve 200 wafer per hour (wph) throughput, keeping pace with the fastest lithography scanners while maintaining process transparency.

To achieve a 10% throughput improvement over the RF3S, the RF3T system features additional parallel process modules and higher efficiency wafer transport. The develop cell has been reconfigured for eight develop modules in the same platform footprint to provide 60% higher develop and rinse process capability than the previous system. A novel wafer coating dispense system significantly reduces chemical consumption, the largest contributor to track operating cost. Combined, these features provide lower CoO and higher process performance for lithography applications.

STATS ChipPAC
Flip Chip Package-in-Package (fcPiP)

STATS ChipPAC’s Flip Chip Package-in-Package (fcPiP) is an innovative family of 3D packages that stack minimally packaged die and bare die into a single molded package. A pre-tested Internal Stacking Module (ISM) Land Grid Array (LGA) and one or more bare die are stacked with at least one bare die connected to the substrate using flip chip interconnection. The flip chip die is underfilled using a special fine fillet underfilling process. The ISM is inverted and attached to the top surface of the Flip Chip device leaving exposed bond fingers for subsequent wirebond interconnection to the base substrate. The wirebondable bare die is attached onto the top surface of the ISM-LGA. Finally both the ISM-LGA and bare die are wirebonded to a common base substrate. This is followed by a single step overmolding process.

A typical fcPiP integrates an ASIC or DSP logic device (generally with flip chip interconnection) with memory die(s) (in the ISM configuration) and analog die(s) (in bare die configuration), the latter two interconnected to the common substrate using wire bond interconnection. A typical package could have a footprint of 15x15 mm, 1.4mm maximum thickness and incorporate a 0.5 or 0.4mm ball pitch.

3D packaging is driven by wireless and consumer products that require package level functional integration in the smallest footprint, lowest profile and lowest cost. Stacked die packages for Flash, SRAM and DRAM memories in an FBGA package footprint using wirebond interconnection are widely available today. However, with the onset of more complex device designs, two new challenges have arisen: (a) higher I/O density and performance requirements on logic chips dictate the use of flip chip interconnection, and (b) the complexity of memory chips makes it difficult to obtain them in “known good die (KGD)” form.

fcPiP addresses these concerns: the use of flip chip interconnection for the logic die addresses the need for high I/O density and low parasitics, while the procurement of memory in the form of pre-tested ISM packages ensures that the memory devices are “known good.”

An additional benefit is the high level of reliability made possible by the overmolded structure which is typically superior to flip chip–only packages. In addition, the fcPiP configuration obviates certain problems associated with the competing configuration known as fcPoP, such as warpage management and SMT process difficulties associated with mounting the PoP top and bottom packages.

Ziptronix, Inc.
Direct Bond Interconnect Technology

Ziptronix’s patented Direct Bond Interconnect (DBI®) technology provides a solution to the challenge of economical 3D integration of advanced semiconductors. DBI enables reliable, repeatable, low cost wafer-to-wafer or chip-to-wafer bonding without the need for high temperature compression techniques that can lower yields and raise processing costs.

A key feature in Ziptronix’s technology is the ability to use nickel as a DBI metal that reliably interconnects to copper, tungsten or aluminum TSVs, while providing for adequate planarity of the oxide/metal interface to achieve a strong, reliable bond. This process supports both backside and frontside interconnects, and resolves the fundamental problem of non-planar surface depression (dishing), that typically occurs with copper.

The Ziptronix DBI process can be implemented for face-to-face or back-to-face configurations in wafer-to-wafer or chip-to-wafer formats to achieve high density 3D interconnects (up to 108/cm2) and is scalable to sub 1-micron pitch with improved alignment and placement tools. Ziptronix has demonstrated 3-micron and 1.5-micron pitch interconnects using existing alignment tools.

Ziptronix’s 3D IC technology is available for license to OEMs/IDMs, such as manufacturers of high-performance imaging systems and sensor arrays, mobile electronics, consumer electronics and portable gaming systems; to foundries seeking to implement TSV technology and to OSATs (Outsourced Semiconductor Assembly & Test) vendors.

Ziptronix is providing the final part of the equation – a high throughput, low temperature oxide bond technology that achieves a metal connection without requiring a low throughput, high temperature thermal compression.

Ziptronix 3D integration technology can be implemented at the OEM/IDM, foundry, or OSAT level of the semiconductor supply chain.

Ziptronix 3D IC technology enables wafers to be bonded at low temperatures, with out the need for expensive alignment tools or pressure/thermal chambers.

Aerotech, Inc
PlanarHD Air-Bearing Stage

The PlanarHD air-bearing stage has been designed specifically to maximise wafer processing throughput by providing up to 2 m/s scan velocity and 5 g acceleration. The design utilises a highly engineered mechanical structure that increases air-bearing stiffness and decreases moving mass. In addition, the locations of the centre of force and the centre of mass have been optimised to eliminate parasitic forces that can result in throughput reducing error motions.

To further enhance stage performance, the PlanarHD uses air-on-air lateral preload on both the X and Y axes. This preload method uses opposing positive-pressure air films to balance the bearing lift and preload forces. The dynamic bearing force balancing method gives the PlanarHD maximum stiffness, which provides faster turnaround and minimal settling time.

Unlike monolithic L-designs that rely on only a single vacuum preloaded gantry axis, the Aerotech gantry axis is a dual air-bearing H-bridge design that incorporates dual linear motors and dual linear encoders. This further improves turnaround performance while providing the added benefit of orthogonality/yaw control. Faster turns means higher throughput and smaller stage footprint, while orthogonality control means that process swaths are parallel over the entire wafer surface.

Both linear encoder and laser interferometer options are available. The PlanarHD incorporates three high-accuracy linear encoders, one for the bridge axis and two for the gantry axis, as standard. Each encoder is mounted so that the scale centerline is as close to the working plane as possible to reduce Abbe errors. Both encoder materials and mounting methods have been chosen to specifically address thermal-induced accuracy errors.

A key to PlanarHD performance is the use of Aerotech’s BLM series brushless linear servomotors. The BLM series linear motors utilize an ironless forcer that provides zero cogging motion with no attractive forces, resulting in extremely smooth motion. In addition, BLM series linear motors generate the highest force per unit volume of any competitive motor design. The PlanarHD also includes both air and water cooling thermal management options.

The PlanarHD is coupled to Aerotech’s advanced Automation 3200 control system. The Automation 3200 is a 100% digital system with high performance FireWire networked drives. The fully digital architecture makes it possible to optimize the current, velocity, and position servo loops for maximum performance. Advanced trajectory generation capabilities, such as multi-block look-ahead, minimize geometry errors during fast turnaround, while our Position Synchronized Laser Firing Output (PSO) functionality automatically adjusts the laser pulse frequency to match the stage speed to maintain optimal system performance.

Every component and design feature of the PlanarHD has been selected to provide the highest possible dynamic performance for wafer processing applications requiring extremely high throughput while maintaining very tight geometric characteristics.

Edwards
iXH series of vacuum pumps

Semiconductor manufacturing processes, such as atomic layer deposition (ALD), and compound semiconductor processes, such as gallium nitride, are creating challenges for vacuum pump technology in terms of powder handling, hydrogen flow, fluorine plasma cleans, ammonia flows and pre cursor reactions.

The iXH has been specifically designed to meet these challenges with enhanced purge flow, temperature-controlled operating range, light gas performance and corrosive gas resistance. Its extended capabilities also promise improved CoO by lengthening pump life and helping to deliver lower utility costs.”

According to Edwards, ALD processes typically deposit less than 10% of the pre curser on the wafer, thus increasing the potential for deposition in the pump. To manage such challenging conditions, the iXH offers improved thermal control and increased torque. With its larger exhaust stages and the Gas Buster inlet purge, the iXH is also designed to deal with extreme powder processes with TEOS flows above 5 g/min.

For manufacturing compound semiconductors, such as those based on gallium nitride, where large flows of hydrogen and ammonia are required, the iXH pump mechanism has been optimised to handle hydrogen and to better withstand the corrosive effects of ammonia.

The iXH also features Active Utility Control (AUC), which includes an idle mode for periods when the pump is not in use. This can reduce utility costs by more than 10% compared to the previous generation of Edwards’s harsh process pumps.

An additional feature is its modular design.

GF Piping Systems
Type 567 Butterfly Valve

The Type 567 Butterfly Valve from was introduced by GF Piping Systems in March 2008 with large diameter sizes up to 12 inches. The corrosion-resistant valve incorporates a double eccentric operating principle that provides improved wear and easier operation over traditional eccentric style butterfly valves. Typical applications include industrial water treatment and waste water systems. Central to the valve’s double eccentric disk design is the off-centre shaft that allows the disc to completely disengage from the disc seal, even when partially open. This reduces seal friction and improves seal wear characteristics, resulting in longer service life, minimal maintenance and better protection against pressure surges. The double eccentric design also lowers the torque required to operate the valve, making for easy manual operation and use of smaller actuators at a significantly reduced cost. With no gap between the disc and the seal, particles wash away, preventing potential build-up that can obstruct flow.

The Type 567 also features a specially engineered body seal with a Q-shaped O-ring that eliminates the need for flat gaskets and is compatible with any flange adaptor design, including those with serrated faces. The wetted inner body, plus the disc and bearings, are made of the same material as the corresponding pipe material for improved fit and corrosion and chemical resistance. The Type 567 is one of the few large-size butterfly valves on the market that offers 150 psi. The valve is offered with a variety of modular components for optimum flexibility. Examples include manual valves with hand lever- or gear-operated wheel, electric or pneumatic actuation, positioner for throttle or flow control, and EPDM or FPM seals, five types of limit switches, and fine adjustment option for additional flexibility of disc angle control. Both manual and actuated versions include electronic feedback, important for more sophisticated fluid handling systems.

Hach Ultra
MET ONE 6000

The MET ONE 6000 Series Remote Airborne Particle Counter promises accurate and reliable continuous particle monitoring. With a sensitivity range of 0.2 to 5.0µm at 0.1 cfm flow rate and 0.5 to 10µm at 1.0 cfm flow rate, the MET ONE 6000 has been designed to meet the specific needs of cleanroom operations within the semiconductor, hard disk drive and flat panel display industries. The MET ONE 6000 offers diagnostic features that provide reduced troubleshooting and downtime-related costs. Built with ‘Long Life Laser’ technology, the Met One 6000 offers improved product quality, reliability and performance for remote particle counting. With communication options such as RS485 Serial Modbus, Ethernet, Analog, Pulse and RS232, the MET ONE 6015 is easy to integrate with any facility monitoring system and enables future upgrading as the communication needs of a facility change. These communication choices and an array of mechanical installation options also reduce downtime related to instrument removal and re-installation during routine calibration and preventative maintenance work.

InnerSense
The SmartWafer

SmartWafer runs through the equipment and records vibrations and acceleration along its route. After completing the recording process, the data is downloaded via an external reading station into a PC. The data is then synchronised with the equipment sequence of events and compared to the historic "good" fingerprint.

Any abnormal signals indicate and pinpoint bad mechanical components or alignments which are causing particles, defects or scratches on the wafer

SmartWafer Analysis Software
Acceleration: Low frequency signals are used to capture and report overall acceleration levels in the X and Y axis. Vibration: The high frequency capability enables the SmartWafer to capture detailed information caused by bearing wear, physical contact like rubbing which may shed particles or any undesirable motion of the wafer or other nearby mechanisms. Vibrations are captured in all axes. Data Analysis: Advanced pattern recognition algorithms are used to analyze traces and allow two plots to be overlaid for comparison and superimposed with time events for easy tracking. Data download: Typically less than 30secs. Software compatibility: Microsoft Windows, 2000, XP and Vista.

SPC - Statistical Process Control
SPC functionality: Pre-defined mechanical events are measured and quantified. A data point is created during each monitor to create a database that is used along with statistical rules to flag abnormal mechanical events. It can also be used to compare the performance of similar tools.

NEHP
Pre-designed utility modules

NEHP’s family of modules claim to help tool installers dramatically decrease the time, cost and complexity of a fab installation. The new line features a full range of pre-manufactured utility modules that streamline site process piping tool installation. NEHP claims its modules have been proven to reduce the time, cost, footprint and amount of on-site labour required for installation while increasing safety.

NEHP modules replace complicated and costly stick-built gas and water support systems with pre-designed units that fit conveniently into the fab room floor or sub-fab room, depending upon the application. This modular method for 200mm and 300mm tools was developed by NEHP for fast and easy integration into fabs pre-existing process while simplifying design, pre-purchase, and installation. The use of 3D drawings streamlines the engineering approval procedures while 2D submittal assists architectural planning and layouts. The company claims that overall modular systems reduce development costs by 22 percent and on a per-tool basis by 14 percent. NEHP modules are pre-designed and customised for specific tool types that include tools designed and built by, Applied Materials, ASML, Canon, DNS, FSI, Hitachi, KLA-Tencor, Kokusai, Lam Research, Nikon Precision, Novellus, SEZ Group, Tokyo Electron and Varian Semiconductor Associates.

The family of modules includes inert gas, process cooling water, de-ionized water, and chemical process floor modules for tool applications. Sub-fab applications like complete utility rack modules, vacuum and abatement modules, and a variety of general utility tool requirements are also available. The family of modules is engineered to be tool OEM specific.

Rohm and Haas Electronic Materials’
The ‘VisionPad’ 5000 CMP pad

The VisionPad was specifically designed for defectivity reduction in shallow trench isolation (STI) and interlayer dielectric (ILD) applications. The pad targets volume manufacturing of memory and logic chips at 65nm and below. Rohm and Haas developed the VisionPad 5000 with an optimised polymer and pore structure to improve the robustness of STI CMP processes. The VisionPad 5000 is claimed to achieve a 50 percent reduction in CMP-induced scratch and chatter marks over current materials. The pad is designed to produce improved results in overall planarization and when coupled with ceria-based polishing slurries, the removal rate is also enhanced.

The VisionPad 5000 features an advanced polymer specifically designed by CMP Technologies to lower defectivity on all types of commercial slurries. To achieve lower defectivity with good planarity, the VisionPad 5000 uses an energy absorbent polymer in a unique formulation. It has demonstrated performance factors that are equal to the industry standard IC1000 pad – including removal rate, dishing, erosion, process window and planarity - while reducing defectivity by at least 50 percent. Other features include a long pad lifetime and multiple grooving, sub-pad and adhesive configurations. Polishing and conditioning recommendations are also offered by Rohm and Haas. The VisionPad 5000 pads offer predictable pad-to-pad performance and stable operation throughout the process, according to the company.

TresArk,inc.
AutoLytics Slurry Monitor

The AutoLytics Slurry Monitor is an automated sampling advanced chemical monitoring system for the semiconductor industry. Using TreLytics spectral analysis, the AutoLytics system keep customers informed of exact slurry concentration in real time. With automated sampling, accurate inline analysis of the slurry concentration, and quick data feedback, the AutoLytics will prevent scrapping of wafers due to slurry mixes being outside of critical process parameters. Advanced software was developed that allows capture and analysis of primary data and the loading of new calibration MODELS without stopping the manufacturing process. The AutoLytics has serial and TCP/IP communication allowing alarms to be connected through dry contact, fab automation, HSMS, and SECS/GEM. Interfacing with Tres-Ark’s control software and a touch screen Graphic User Interface (GUI), the AutoLytics provide a complete, real time look into the chemical concentration, temperature and stability of your CMP process. A logging feature allows concentrations and recipes to be saved and analysed using provided calculation functions.

The AutoLytics Monitor is an automated sampling and monitoring system. The sampling frequency is a user defined parameter that can range from continuous sampling to sampling every “x” seconds, minutes or hours. The single sample system pulls a small stream from the CMP process every “x” amount of time, analysing percent solids and the concentration of other analytes specific to the type of slurry. The system reports back the time stamped values in real-time, as well as slurry flow, slurry temperature, and error reporting. The sample will go to drain, so there is no interruption to the CMP process.

Advanced Energy Industries
‘Paramount' RF-power delivery system

Advanced Energy Industries’ ‘Paramount' RF-power delivery system platform is power-delivery accuracy and control for increasingly complex film stacks and fine feature sizes. The 3kW Paramount system is suited for both etch and deposition processes in semiconductor, FPD, MEMS and solar photovoltaic manufacturing.

Device fabrication processes feature anti-reflective coatings, hard masks, cap layers and stop layers in their recipes. Process designers must account for these layers and accurately etch or deposit the primary layer that may comprise multiple compositions and doping profiles. The Paramount platform has been engineered to accommodates these complexities with ultra-accurate power control and delivery across the full output range - both on and off 50 ohm - for seamless process transitions in etch, strip, PECVD, HDP-CVD, PVD and PEALD. Where pulsing is required to enable next-generation process steps, the Paramount system's optional pulse and pulse synchronization features offer the widest pulse-frequency range available, according to the company. The system is able to keep pace - in real time - with the most abrupt plasma-impedance changes, and therefore enables faster transitions, shorter process steps and reduced process times. Optional frequency tuning is performed virtually instantaneously (within msec)

The half-rack, 3kW RF power supply's impedance measurement is claimed to rival the accuracy of a network analyzer, enabling improved power delivery accuracy and control at 13.56 MHz fixed or variable frequencies. It is claimed to have accuracy, repeatability and process control for 50 ohm and non-50 ohm loads.

ATMI
‘AutoClean’ ion implanter

‘AutoClean’ from ATMI is a technology which claims to extend ion implant source life by more than 40 percent, increase tool predictability, and reduce operating costs. AutoClean is a complete system solution comprised of a chemical reagent (xenon difluoride), sub-atmospheric solid delivery system, customer specific process recipes and extensive application support. This combination has proven highly successful in tests and in real-world working conditions to effectively remove dopant materials from inside implanters. The result is improved ion source life, reduction in glitching, extended PM cycles, increased tool availability, and an overall reduction in operating costs of ion implanters.

The ATMI AutoClean solution is a safe and effective flow of a chemical reagent into the source region says the company. The reagent flows just like a process dopant, yet requires no plasma activation to produce a highly effective fluorinating agent to clean all contacted surfaces in the source, even those not contacted by plasma. Automated recipes can be implemented to run the AutoClean process at regular intervals, or manually initiated for error recoveries and species changes. As a result, the source region is cleaner and remains cleaner longer, extending source life in excess of 40%.

AutoClean has been validated and released for most major implant makes and models with little if any significant hardware or software changes. The cleaning reagent has proven effective for cleaning process residues created when running arsenic, phosphorus, and boron implant processes.

AutoClean is comprised of the chemical reagent, a non-pressurised solid source delivery cylinder and process recipes tailored to each customer application based on best known methods.

CyberOptics Semiconductor
Auto Gapping Sensor

The WaferSense AGS device is used to wirelessly measure critical gaps between showerheads and wafer pedestals in process chambers that perform chemical vapor deposition (CVD), physical vapor deposition (PVD) and etching.

The AGS allows process engineers to establish true parallelism between process showerheads and wafer pedestals or heaters to significantly improve uniformity during thin-film deposition/removal, sputtering and etch. The AGS improves die yield and significantly reduces staff and equipment downtime required for electrode gapping.

The AGS comes in a wafer-like form factor and travels through process equipment just like a semiconductor wafer. Once inside, it uses three non-contact distance sensors to measure real-time gaps between showerheads and pedestals.

The vacuum-compatible device then transmits the measurements wirelessly via a Bluetooth connection to a computer displaying the GUI of its companion software. Engineers review the AGS measurements and graphical display to make precise real-time adjustments to equipment and optimize their chamber processes.

Process engineers use the AGS’ precise real-time showerhead gap measurements to significantly improve process uniformity, as well as reduce -- from hours to effectively minutes -- the staff and equipment downtime for set up, preventative maintenance (PM) and troubleshooting tied to gapping. The AGS also gives engineers objective and reproducible gap data to establish process- and equipment-specific controls fab-wide.

The AGS claims to be the first wireless gap-measurement device available to fabs, and its creation is inline with the 300 Prime Initiative.

If the 300 Prime Initiative has shifted the focus of semiconductor fabs to productivity, efficiency and bottom-line profitability, the AGS helps 300mm fabs achieve their automation-focused objectives: The AGS enables fabs to set and monitor showerhead gaps with greater accuracy and efficiency. The wireless method adds more predictability, reliability and control to equipment to ensure wafers are processed in optimal conditions for optimal yield and throughput.

At 200mm fabs facing pressure to extend the productivity of their existing capital equipment, the AGS200 plays a key role in their efficient use of staff and process chambers by, again, significantly reducing downtime and improving process uniformity.

The company claims customer reports of 400% improvements in PM turn around times. At a leading technology centre up to 40% improvement in CVD film uniformity was achieved using AGS. At one of the world’s largest semiconductor manufacturers film uniformity was improved 36% after implementing the AGS to measure and adjust critical showerhead gaps!

The AGS represents an innovation in semiconductor manufacturing that gives process engineers a new way to precisely and efficiently set, adjust and check gaps between showerheads and pedestals to establish parallelism that’s essential for optimal wafer processing. Internally, we don’t believe that there’s a device or methodology that competes with or compares to the AGS and the AGS is displacing other methods of measuring showerhead gaps.

The AGS, with its wireless, capacitive-sensing design, is able to obtain real-time gap measurements in vacuum chambers under process-like conditions, allowing engineers, in minutes, to adjust showerheads or pedestals without opening up chambers.

A key differentiator between the AGS and existing gap-measurement methods is the AGS’ companion GapView software. The AGS’ three sensors each report separate readings in numerical and graphical form to set the exact gap required for a process. Each graphic is colour-coded on GapView’s GUI to reflect good readings. The interface makes it easy for engineers to quickly see when the gap is above, below or within the user-defined target gap range based on optimal process parameters.

Cymer
Gas Lifetime eXtension

The Gas Lifetime eXtension (GLX) product is a stand-alone upgrade for new and installed XLA laser systems. GLX is designed to increase scanner output and availability by extending the time between excimer laser gas exchanges by a factor of 10.

Memory device makers have particularly high system utilisation and require high levels of system uptime and availability. Laser gas exchanges typically occur two to three times each week (or every 100M pulses), with each exchange lasting approximately 20 minutes. Scanner downtime from frequent gas exchanges is reduced - with a GLX-enabled laser - by a factor of 10.

A 4kHz scanner system will typically see increases from 2600 to 7800 wafer passes, and a 6kHz scanner system from 2400 to 7500 wafer passes annually. Similar performance improvement is realized by logic- and foundry-based systems, according to the company.

GLX is an upgrade package consisting of both software and hardware to support increased intervals between gas exchanges for lithography laser systems. Additionally, the software component contains a new gas control algorithm designed to enhance gas management for the system.

Entegris
Torrento High-Flow Liquid Filters

Product Outline: Entegris’ Torrento family of high-flow liquid filters help improve liquid contamination control of nano-scale particles in wet etch and clean (WEC) manufacturing processes used in advanced semiconductor applications. Built on a combination of new membrane technology and an advanced ATE device construction, the Torrento filters provide high-yield, rapid bath clean-up cycles, extended filter life, allow for fast changeouts and increase cleanliness.

Problem: As semiconductor manufacturers drive their sub-45nm technology applications, contamination control becomes increasingly more difficult. The filter retention is extremely critical as the purity of the chemicals used in WEC can directly correlate to wafer yields. To remove increasingly smaller contamination particles, wafer fabricators found themselves using filters with smaller pores, which forced reduced filter flow and ultimately slowed wafer processing speed.

Solution: With the Torrento high-flux platform of WEC filters, semiconductor manufacturers can maintain ultra-high flow rates without sacrificing chemical purity at the 20nm rating. That’s because the Torrento 20nm filters use a specialized nondewetting Teflon membrane technology. Torrento filters also have a larger surface area than general use filters due to an advanced ATE device construction technology.

The combined effect is a filter that allows manufacturers to reduce particle-related wafer defects, decrease process cycle time, and increase filter life. The low filter resistance also is designed to reduce pump strokes and decrease wear and tear.

Applications: The capability to maintain flow rate at an extremely small pore size in outgassing chemistries such as SPM, SC1 and SC2 ensures the stable processing conditions needed for the high CpK results demanded at advanced technology nodes.

Platform: Torrento filters are available in cartridge and disposable formats to accommodate installation flexibility and upgrades. The disposable filter eliminates operator handling of the filter element, further minimizing contamination risk. The disposable design also reduces the potential operator exposure to chemicals during installation and disposal.

For Additional Information:
Jessica Eull
Padilla Speer Beardsley
612.455.1792
jeull@psbpr.com

Levitronix
BPS 600’ maglev pumps

The BPS 600 magnetically levitated pump technology was designed for demanding applications in the semiconductor industry such as CMP slurry delivery, copper electroplating and wafer cleaning at leading-edge process nodes. The patented impeller floats in a magnetic field only touching the fluid it is pumping, and can be fully integrated into a fully-closed loop electronic control system without the need of additional controller hardware.

The BPS 600 is ideal for CMP slurry delivery because it eliminates shear stress and mechanical contact which cause particle agglomeration. The moderate shear level to which the slurry is exposed in maglev pumps seems to have a beneficial effect on the slurry by breaking apart loose agglomerates. In copper electroplating applications, the solution cannot plate out and clog the pump. The closed loop electronic control makes the BPS 600 ideal for wafer cleaning. The pump can sense pressure and flow at the tool and adjust itself automatically. Continuous flow with no pulsation generates repeatable cleaning conditions.

The BPS 600 can be used for CMP slurry delivery, copper electroplating and wafer cleaning applications. The centrifugal pump has been designed with no bearings to wear out or seals to break down and fail. Based on the principles of magnetic levitation, the pump’s impeller is suspended, contact-free, inside a sealed casing and is driven by the magnetic field of the motor. The impeller and casing are both fabricated from chemical-resistant high purity fluorocarbon resins. Fluid flow rate and pressure are precisely controlled by electronically regulating the impeller speed. Two basic system configurations are available: a ‘stand-alone’ configuration consists of a controller with an integrated user panel to set the speed manually, while the ‘extended’ version consists of a controller with integrated PLC interface. This allows setting the speed by an external signal and enables precise flow or pressure control in connection with either a flow or a pressure sensor.

Nexen
Roller Pinion System for Linear and Rotary Motion Control

The Roller Pinion System (RPS) provides zero backlash, very high positional accuracy, unlimited length or diameters, very high speeds, 99% efficiency, high rigidity, low noise, low maintenance, corrosion resistance, and long life. This opens up new design possibilities and provides the capability to achieve much higher levels of performance in machine designs.

Zero Backlash /High Precision
The RPS’s innovative meshing action provides zero backlash and positional accuracy up to ± 20 um [± 0.00079 in.] in both directions by maintaining opposing contact with two or more teeth at all times. Each tooth profile is precisely measured relative to the first to ensure that high positional accuracy is maintained and cumulative error is eliminated.

High Speed Capability
The RPS system can achieve speeds, up to 11 m/sec (36.1 ft/sec), that can normally only be obtained by linear motors while providing high positional accuracy. Even at these speeds, the extremely low friction design does not create heat or wear on components.

Unlimited Travel Length
The linear RPS system is modular in design with 1-meter and 1/2-meter segments that can be combined as needed to meet application requirements. Segments can also be cut to shorter lengths as needed. This greatly improves stocking, availability, cost, and replaceability. Segments are joined with a special tool that uses the rack teeth to transfer the positional accuracy of the previous rack to the next. Nexen can also provide solid ring gears up to one meter in diameter. Larger ring gear sizes will be segmented and can be virtually any diameter.

Aquest Systems
FabEX Transporter

Aquest Systems vehicle-free transport (VFT) technology, FabEX Transporter, can change the way existing or new fabs implement automation and enable both small lots and a possible wafer size transition.

The company's AMHS technology (Automated Materials Handling Systems ) can be deployed in new fabs, but was also designed to work with existing automation systems, so fabs constrained with current layouts and tools can add capacity without making major changes. Available with straight segments of varying lengths and "turn" segments (0-270° of rotation), stocker and overhead transport (OHT) I/O, the system mounts directly under the OHT. According to the company, the controls leverage current ASIC, VoIP, and Ethernet technologies.

The advantage of the VFT concept is the decoupling of transportation with the loading operation -- a concept in which "no-wait manufacturing" can be used to drive down cycle time.

Aquest Systems "no-wait productivity" system optimises material movement in a fab in areas that existing automated material handling systems (AMHS) with overhead transport are insufficient to keep up with productivity needs.

The FabEx NPI connects to installed stockers, OHT vehicles, and material control systems (MCS) and can be integrated with any fab's current AMHS without mechanical or software modifications, without requiring any changes to the existing AMHS, according to the company, and "with proper planning" requires no slowdowns or stoppages in production. Combining FabEx with existing AMHS lets fabs circumvent congestion by using an alternative route to move FOUPs at high speeds (>3 m/sec) between locations in the fab, cutting FOUP delivery times and thus increasing fab-wide transport capacity and productivity.

Asyst
Connectivity Software Solutions

Asyst's Connectivity Software Solutions Group (CSG) provides "data on demand" functionality for advanced manufacturing applications. Asyst CSG supplies customers with a suite of software products that simplify the complex challenges associated with data collection, tool connectivity, and equipment and fab automation. Asyst's 200mm and 300mm solutions have been designed and optimised to address the industry's ongoing challenges of increasing wafer size, decreasing geometries, minimal integration, and reduction in process variation.

Asyst CSG products and professional services provide competitive value and ROI by enabling:
Improved yields, product quality, and overall equipment effectiveness (OEE)
Reductions in process variability and manufacturing costs
Reduced connectivity integration effort and time to production

Asyst CSG also provides:
Industry standards compliance, both current and planned
Access to an extensive base of SEMI standards and industry domain expertise
Cross-industry manufacturing data acquisition and modelling capability
Asyst Connectivity Products support a variety of platforms and operating systems.

FEI Company
Remote Access Program for Interactive Diagnostics (RAPID)

This service claims to significantly speed service times and maximise system uptime.

With RAPID remote diagnostics FEI service engineers are able to run service test software and diagnostics on systems that are equipped for RAPID whenever a customer initiates a service call and the remote diagnostics protocol. With the program, tool settings can be checked and modified, and software can be patched and upgraded as needed. FEI engineers can also view images from the microscope and make performance assessments.

The remote diagnostics program, could solve many system problems remotely, eliminating the need for an on-site service call. If it is determined that replacement parts are needed, field engineers will be able to order them in advance of their service visit thus shortening the overall time to repair.

The RAPID remote diagnostics' connection is secure and can only be initiated from the customer's location. A secure portal located outside of FEI's main corporate network maintains a minimum number of outside ports and manages all connections between customer instruments and FEI remote service engineers. Customer systems are fully isolated from each other and communicate with the secure portal using an encrypted virtual private network (VPN) connection.

MASER Engineering
Fast board level interconnect test service

MASER Engineering has extended its test and diagnostic services with a tool for board level interconnect tests.

Modern Chip Scale and Ball Grid array packages are the most common package style for Integrated Circuits in consumer handheld equipment. The introduction of lead-free solder interconnects have resulted in a change in the contact reliability. The long history of leaded interconnects had to be replaced by new models of the failure mechanism and test data.

The first test results were also used to adjust the metallurgical properties and the assembly process. To have fast feedback, new test methods have been developed too. In addition to the conventional stress test, based on slow and fast temperature cycling tests, new techniques and systems were introduced for even faster accelerated stress tests.

A major player in hand held applications defined a bouncing drop test with a new designed drop test system. This test method uses continuously monitored daisy-chain devices and glitch detection during the 1500g shock impact. The drop test system has a specific construction to allow multiple drop endurance testing in a reasonable time.

MASER Engineering has made this test capability available to customers in order to evaluate the robustness of the SMD solder interconnect system of the chosen package. MASER Engineering demonstrated further impact on contact reliability due to the introduction of low-K oxides in sub 100nm technology devices. Thanks to the fast accelerated test method, this effect could be examined before the market introduction, thus saving big field return costs.

This tool for fast board level bending tests is added to the range of systems for mechanical stress test of solder interconnects. The core of the system is a precision sine movement of a two point bending tool. The daisy-chain devices are mounted on a mobile phone simulating PCB and connected to a resistor scanner system. The test board is supported at the two edges and pushed down at two points with a defined distance. The bending amplitude results a lateral mechanical force on the metal interconnections. The new system is able to maintain precision bending at 5 Hz for large amount of bending movements. The system can be programmed to bend until a specific failure mode in one or all devices on the PCB. A detailed failure analysis and SEM/EDX inspection will show the defect properties in the intermetallic layer that has cracked. Both the mechanical drop test and bending systems and the F/A tools are available to component suppliers and OEM companies that require detailed reliability data on their connection technology.

Numetrics Management Systems, Inc.,
NMX-ERP

NMX-ERP 3.0, is a suite of enterprise resource planning (ERP) software for integrated circuit (IC) development organisations. The software claims to significantly extend the company’s top-down project planning and risk measurement capabilities, handling chips designed in nodes down to 45 nm. Numetrics’ approach to project planning and risk measurement can give a powerful boost to the customer’s revenue, profits and market share. Projects finish on-time, within budget and with competitive cycle times. NMX-ERP incorporates a rich-client graphical user interface, a project plan synthesis engine, an XML interface to integrate with other enterprise tools

NMX-ERP 3.0 includes the following:

1) Complexity Calculation Engine: Numetrics’ complexity calculation engine leverages in-depth data mining of past generations of process technology nodes to establish a quantitative relationship between process node maturity and chip design complexity. The engine is calibrated on Numetrics’ full industry database of 1200 IC projects and support design styles including SoC, analog and mixed-signal, RF, ASICs, ASSPs, and advanced processors.

Project Plan Synthesis. New project plan synthesis engine generates estimates of duration and staffing required in each major phase of the IC development cycle. Users can perform “what-if” simulation on each phase, modulating either the duration or staffing to see the impact on the other.

XML-interface: NMX-ERP 3.0 offers enterprise-wide integration options for collecting, reporting, and archiving customers’ project data.

Quality Wise Knowledge Solutions QWiKS
QWiKS CBM/PHM

A real-time, visual predictive and preventive maintenance (PPM) system that could save semiconductor fabs thousands of dollars annually per tool was developed by Quality Wise Knowledge Solutions (QWiKS) in cooperation with ATDF, the Austin-based R&D foundry. The PPM system, called QWiKS CBM/PHM, combines condition-based maintenance (CBM) with prognostic health monitoring (PHM) to monitor and maintain semiconductor process equipment more effectively. PPM technology helps a production fab reduce unscheduled downtime by providing early warning of equipment failure.

The QWiKS system also includes tools for managing and improving tools’ performance tracking, which include real-time tool utilisation charts, a preventive maintenance module to link schedules, procedures and history to a single module, and EKB (equipment knowledge base)/tool repair knowledge base to archive history and knowledge for future repairs. An escalation module is available to automate the escalation process when tool downs become critical to the production process. A searchable tool maintenance comments facility allows users to find repair data as needed. The system also includes a failure mode effects analysis (FMEA) module to allow both process and equipment FMEAs to be implemented to ensure that the root causes of a failure are understood, addressed and corrected.

A search function within the module allows users to search for archive FMEA studies using keywords or a risk priority number (RPN). Also, an FMEA pattern signature function can capture the tool and process parameters associated with the root causes of a failure. Equipment or process diagnostic rules can be generated for detecting early sign of tool or process failures, or pinpointing the root causes of tool failure to reduce equipment repair time.

Surfect Technologies

Surfect Technologies has two development electroplating tool versions that leverage its Ascent 200mm and Leapfrog 300mm scalable plating tool platforms. These development tools are designed to enable more companies to enter and support the growing market for wafer level packaging by providing the basic metal deposition engines along with control and chemical delivery systems.

Surfect’s tool offerings are built around the industry’s only one-chamber plating tool, which rapidly scales through well-known copy-exact manufacturing methods to optimise both low-volume and high-volume plating solutions in the smallest space. Surfect’s tool is unique in that it combines traditional single-bath, multiple-tank plating approaches into a single-cell process with software recipe control of all metal deposition - all in a small footprint. The plating computer’s sensors enable accurate real-time monitoring and control while providing a development architecture to add statistical and chemistry monitoring routines.

Surfect is also developing and offering a library of process solutions enabling more complete wafer level interconnect solutions

March Plasma Systems
FlexTRAK-WR Plasma Etching System

The FlexTRAK-WR plasma etching system for advanced wafer processing is designed for high-throughput etching and ashing of semiconductor device (IC) wafers, MEMS device wafers, and solar cell and photovoltaic (PV) device wafers, up to 300mm (12 inch) in diameter. The patented high etch rate plasma chamber is designed to provide exceptional etch uniformity within wafer, and process repeatability wafer-to-wafer. The FlexTRAK-WR plasma etching system's three-axis symmetrical plasma chamber ensures all areas of the wafer are treated uniformly, while tight control over all process parameters ensures highly repeatable results. Wafer processing can be done from most types of open wafer cassettes and front opening unified pods (FOUP). The patented chamber design and control architecture enables short plasma cycle times with very low overhead, ensuring that throughput for each plasma application is maximized and cost of ownership is minimized. Typical applications inc lude a wide variety of etching and ashing steps for wafers, including those for back-end Wafer Level Packaging (WLP), MEMS device manufacturing, and the production of solar cells and photovoltaic (PV) devices. Plasma applications include ashing of photoresist (PR), BCB (benzocyclobutene), and polyimide (PI) layers, etching of silicon oxide and silicon nitride, sputtering (removal) of metal oxides such as aluminum oxide, copper oxide and nickel oxide, and removal of various organic and inorganic contaminants from the surface of wafers. The FlexTRAK-WR plasma etching system delivers all this performance in a compact, self-contained unit with a small footprint, and is capable of supporting a single process module or multiple process modules around a single material handing system. The FlexTRAK-WR plasma etching system provides all this capability at a very low cost of ownership and a low system price, compared to other comparable plasma etching systems.

The FlexTRAK-WR plasma etching system was developed to provide advanced wafer etching and ashing capabilities in a compact footprint, with a low system price and low cost of ownership. As capital budgets have shrunk, the FlexTRAK-WR plasma etching system has been widely adopted for IC, MEMS and PV device manufacturing. The FlexTRAK-WR plasma etching system is a combination of low price, high performance, small footprint, low cost of ownership, and advanced plasma etching and ashing capabilities.