Materials
- Enabling award - Air Liquide – Optimised precursor for Low T Si02 ALD
- Improvement award - Air Products - Bulk Speciality Gas Systems
Yield Management
- Best tool award - Carl Zeiss SMS – AIMS fab 193i
- Best Process Award - KLA Tencor Corporation – SpectraFx 200
Wafer Processing
- Best tool award - Aviza Technology Inc, – Sigma fx PVD System
- Best process award - IMEC – epitaxial GaN layers on 150mm silicon wafers
FMT Final Manufacturing
Sub System/Component Provider
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New system award - Advanced Energy Industries, Inc – AE EPV
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Improvement award - Aerotech, Inc – WaferMax Z
R & D Initiative of the Year 2006 sponsored by 
Outsourcing Company Of the Year
MEMS Innovation of the Year 2006
Education Initiative of The Year 2006 (in association with ISLI) 
Materials
The material requirements of manufacture microelectronic devices are as diverse as they are technically impressive. Whether it is the material used for wafers, packaging or new materials to further technological advancement, manufacturing depends on the timely delivery of materials with exceptional technical parameters.
Enabling award
Air Liquide - Optimised precursor for Low T Si02 ALD
Several applications requiring very low T (< 300°C) and conformal ALD deposition of high quality SiO2 films have recently appeared. Among the numerous examples are liners for STI, SiN/SiO2 dual spacers, metal gate capping, M1 capping, porous low-k pore sealing, etc... Another new application for silicon ALD precursors is the deposition of mixed oxides such as HfxSiyOz4 in DRAM capacitors, with extremely stringent conformality requirements when used in deep trench structures.
Usual silicon sources used in the semiconductor industry such as monosilane, TEOS, chlorosilanes (di, tri and tetra chlorosilane) or disilanes (disilane and hexachlorodisilane), either exhibit insufficient reactivity on the surface (no growth by ALD), or self decomposition (parasitic CVD), or tend to leave detrimental impurities (such as chlorides). Among newer and reactive silicon compounds are silanols such as TBOS (tris-tertiarybutoxysilanol HOSi(OtBu)3), and TICS (tetrakis-isocyanatosilane Si(NCO)4), but both suffer from being solids at room temperature.
The family that have so far attracted the most attention are aminosilanes as 3DMAS (SiH(NMe2)3) and 4DMAS ((Si(NMe2)4), that are supported by ALOHA(tm). However, it appears that better ligand selection can both improve the process performance and contribute to lower CoO. ALOHA(tm) has recently designed and selected through our Precursor Screening Program a new aminosilane, marketed under the name "SAM.24", which best fulfills all the requirements of the ideal SiO2 ALD precursor, namely:
* Self limited growth characteristics under a wide temperature range
* High growth per cycle by optimization of ligand steric hindrance
* Low film contamination, even at low T ([C] < 0,3 atomic% @ 250°C)
* High volatility
* Constant film properties and composition over a wide temperature range (WER change < 10% for films deposited between 200 and 300°C)
* Lower cost (materials) of ownership from a simpler synthesis process than usual aminosilanes
SAM.24 is currently supplied to several leading OEMs and IDM worldwide.
Xlow T SiO2 and SiN ALD is one of the hottest topic in new materials (although the materials is not really new), and this molecule brings a clear process benefit vs. the usually proposed one, especially regarding the film purity and range of the process window. In addition, it is cheaper!
http://www.airliquide.com
Improvement award
Air Products - Bulk Speciality Gas Systems
The Bulk Specialty Gas System (BSGS) provides a step change in the supply of high-volume specialty gases for semiconductor manufacturers by improving product consistency & reliability (saving money), manufacturing productivity (more uptime), and employee and facility safety (fewer cylinder changes).
For device manufacturers who are using high volumes of specialty gases the BSGS and the benefits it offers, helps manufacturers save money and makes their job easier. Air Products is the leader in providing BSGS technology to customers around the world with more systems installed than all competitors combined.
http://www.airproducts.com/electronics
Yield Management
Semiconductor manufacturing requires such rigid parameters that every minor improvement to the process can mean the difference between success and failure. Yield management has moved on from simple metrology and consulting to become a critical component of success in such a demanding manufacturing environment.
Best tool award
Carl Zeiss SMS – AIMS fab 193i
The proprietary technology of the Aerial Image Measurement System (AIMS™) emulates the imaging of a photomask in a wafer scanner. The AIMS™ serves to analyse possible failures of a photomask under the same conditions than a wafer scanner. This technology allows for fast and reliable prediction of wafer printability of defects, critical features (like dense patterns or contacts), and repairs on the masks without the need for time-consuming and costly wafer prints followed by wafer CD-SEM analysis.
Based on the performance optimised 2nd generation AIMS™ fab platform, AIMS™ fab 193i enables emulation of both dry and immersion 193nm lithography stepper/scanners with numerical apertures up to 0.93. By adjustment of numerical aperture, illumination type, and partial illumination coherence (Sigma), the system emulates steppers or scanners using any type of Binary, EAPSM, AAPSM, and CPL reticles. This means a high level of flexibility and application space of the system in mask shops and wafer fabs to analyse mask defects and to verify repair quality. Furthermore OPC strategies can be investigated under the same optical conditions as the 193 nm steppers/scanners in the wafer fab.
To address the latest developments in optical lithography, the AIMS™ fab 193i provides a linear polarisation capability in the illumination as will be implemented in upcoming generations of optical wafer scanners. Oriented horizontally or vertically to the mask edges polarisation effects of the mask itself can be investigated which is crucial to optimise designs and lithographic settings for upcoming mask designs. The AIMS™ fab 193i can be equipped optionally with a robotic reticle handling, allowing for fully automated reticle loading from SMIF pods or reticle box libraries. With its high level of automation and increased throughput, the system is also ready for a new class of fully automated measurement applications such as Global CDU Map for investigating CD uniformity across the photomask. Global CDU Map optimises efficiently the mask manufacturing and design process with respect to process tolerances and optical proximity effects. Furthermore it is a valuable tool in wafer fabs for CDU qualification of incoming photomasks without the need for pellicle removal (through-the-pellicle CDU qualification).
Based upon the detailed information about the printability of mask defects AIMS™ enables photomask manufacturers and wafer fabs to decide whether a photomask needs to be repaired and to ultimately decide whether a repair was successful and the mask can be used for chip production.
Using AIMS™ is a clear prerequisite to achieve high yield levels of photomask and chip production. Based upon the major improvements with respect to automation and throughput the AIMS™ fab 193i clearly enables mask shops to produce photomasks at higher yields and lower costs.
Reason 3: New applications like Global CDU Mapping broaden the spectrum of analysis instruments for our customers. These new applications provide necessary information that become essential with shortening of wavelengths and increasing NA.
http://www.smt.zeiss.com/sms
Best Process Award
KLA Tencor Corporation – SpectraFx 200
The SpectraFx 200 is designed to achieve cost-effective production control over advanced film processes at the 65nm node and below. Based on its spectroscopic ellipsometry (SE) technology, SpectraFx 200 leverages a new 150 SE option to enable qualification and monitoring of such advanced films as ultra-thin ONO layers, nitrided films, high-k and low-k dielectronics, amongst others.
At the 65-nm node, process tolerances are so small that within-die variation and airborne molecular contamination (AMC) can have a major impact on device performance. New types of materials are also being added that require new measurements parameters, such as composition and film stress. Traditional proxy measurements, which utilize blank pad structures, cannot detect these process variations at the die level, and are thus no longer enough to meet the requirements for production films control. SpectraFx 200 provides robust, non-destructive measurements that more accurately reflect process conditions at the die level, enabling chipmakers to achieve cost effective production films control for the 65nm node and beyond.
With KLA-Tenor’s DPM capability, SpectrFx 200 measures test structures composed of alternating metal dielectric arrays, which significantly improve correlation to within-die variations. These patterned structures generate complex diffraction spectra, which are then turned into accurate measurements using powerful onboard algrorithms. With its new 150 SE option, SpectaFx 200 enables measurement in the “vacuum UV” (150-nm wavelength) accurately monitor film thickness and composition variations on new materials such as high-k films. On nitrided films and hafnium silicate gates a two-fold improvement in repeatability and matching compared to 190-nm wavelength scatterometry-based systems is being claimed. The systems AccuFilm capability eliminates the effects of AMC. SpectraFx 200 also provides enhanced 2-D and 3-D product wafer stress metrology-allowing users to obtain wafer stress measurements that correlate to die-level stress more accurately than traditional 1-D monitor wafer measurements, thereby improving root cause analysis.
Advanced films such as ultra-thin ONO layers, nitrided films, high-k and low-k dielectrics, 193-nm anti-reflective coating (ARC) layers, and engineered substrates, including silicon-on-insulator (SOI), strained silicon, and silicon geranium (SiGe) All major optical components on the SpectraFx 200 have been redesigned to lower spectral distortion. A faster computer and a cleaner, faster front-end wafer-handler, combined with remote diagnostics and iSupport for 300-mm automated fabs.
Wafer Processing
The processing of a wafer to create microelectronic devices involves a number of highly complex and technical steps to achieve the devices that drive the electronics industry. As important as each step is, it is the integration of all these processes that determines the outcome of the manufacturing process. The processing requires diffusion, bake, lithography, etch, implant, clean, as well as all the ancillary processes and support to create the desired outcome. Once the tool sets are in, it is the creative approaches of the engineers that ensure constant creative leaps.
Best tool award
Aviza Technology Inc, – Sigma fx PVD System
The Sigma fxP is a single-wafer cluster tool designed for high-volume physical vapor deposition (PVD) processing. The architecture of the Sigma fxP sputter deposition system offers excellent process control with high throughput. Various process chamber configurations and combinations are available to address a large variety of specific applications. Deposition process modules are based on a standard design that enables simple technology upgrades and wafer size conversions. Key applications for the Sigma fxP include Ti/TiN liners and Aluminum interconnect for sub-0.35 µm node IC devices including ionized PVD, very thick and flowed Aluminum for power semiconductor manufacture, highly uniform Aluminum Nitride layers for Bulk Acoustic Wave devices and Thin Film Heads.
Mainstream semiconductor device manufacture is becoming increasingly cost driven. This is an inevitable response to the general decrease in the average selling prices for ICs. In addition, the rise of foundry activities in low-cost regions of the world places additional pressure on cost of capital investment. Finally, established fabs need to find new ways to differentiate themselves, including reducing running costs, reducing WIP cycle times and reducing transition time from one product type to another. The majority of today's fabs are no longer dedicated to single-type or same-type product manufacture, they are far more likely to have 100's of device types streaming through the manufacturing line at the same time. Being able to quickly change tool configurations, and process capability on the installed manufacturing equipment in response to new capacity plans is a critical factor in maximizing profitability.
The Sigma fxP has multiple benefits for this type of customer.
- Standard deposition modules used for Ti/TiN or Aluminum are interchangeable. The user can switch applications in response to a loading change very simply; all that is required is a target and shield change. Competitive systems usually require more significant hardware modifications, reducing their overall flexibility.
- Target and shield life in the Sigma is longer than in competitive tooling, meaning significant savings on running costs. For a high volume fab running ~10,000 wspm, a Sigma fxP user can save >$1,000,000 per year on running costs alone compared to the main competitor system.
- In addition to long shield life, lasting up to 100% of the target in most Aluminum applications, Sigma fxP users benefit from fast target & shield change times. By leveraging fully automated service routines, the user can do a full target/shield change PM in ~6 hours, one-half to one-third the time taken by the main competitor. The result is less downtime, allowing our customers to increase their line yield on a per week basis. This, of course, could contribute to an increased product flow through the fab.
- Generally, more advanced PVD modules cover a narrow range of device nodes, requiring the user to obsolete older modules after 2 or 3 years, or invest in multiple modules to cover last- and next-generation product types. On the Sigma fxP, the Advanced Hi-Fill (AHF) ionized PVD module offers the unique ability to switch the ionization source on and off. Users of the AHF module can cover a very wide range of device nodes and so need to carry less capital equipment to meet capacity.
- Also, it is important to note that given that the growth of the China market, we see that Sigma has great potential in this region for 200-mm aluminum interconnect applications. Currently, Aviza has a Sigma evaluation system installed at one of China's leading foundries.
Best process award
IMEC – epitaxial GaN layers on 150mm silicon wafers
IMEC claims that it has been able to achieve excellent uniformity results with a sheet resistively as low as 272+5 O/square and a standard deviation as small as 1.9% (edge excluded) employing the HEMT structures.The process overcomes issues associated with the growth of high-quality epitaxial GaN layers of Silicon such as the high lattice mismatch and the large difference in thermal expansion coefficient between Silicon GaN. This was accomplished by using a AIGaN buffer layer to provide compressive stress in the top GaN layer. A proprietary IMEC in-situ SI3N4 passivation layer is then used to achieve the results.
According to IMEC the process could lead to low-cost GaN power devices, replacing expensive sapphire SIC based wafers that are only available on smaller wafer sizes.
FMT Final Manufacturing
Final manufacturing technology, including test, assembly and packaging, has come a long way from being the back end of the microelectronics industry. With smaller devices and a blurring of the line between device and packaging, this area has become as complex and important as every aspect of manufacturing.
Best tool award
Agilent Technologies – B1500A
The Agilent B1500A Semiconductor Device Analyzer is a modular instrument with a ten-slot configuration that supports both IV and CV measurements. Its familiar, MS Windows user interface supports Agilent's new EasyEXPERT software, which provides a new, more intuitive task-oriented approach to device characterization. Because of its extremely low-current, low-voltage, and integrated capacitance measurement capabilities, the Agilent B1500A can be used for a wide range of semiconductor device characterization needs. The Agilent B1500A makes every user into a parametric test expert. The MS Windows PC-based interface is familiar, even to new engineers who are inexperienced with parametric measurement instruments. Its unique task-oriented approach enables users to focus on their real task-at-hand (device characterization), without having to become a specialist in the instrument hardware. This new approach is made simple to use via a touch screen interface, which makes the instrument as easy to use from a rack as from a benchtop.The modular 10-slot configuration helps reduce cost of test by ensuring that you buy only what you need up front, leaving room to grow as your needs grow or change. This flexibility is a particular advantage for those needing a capacitance measurement unit, which easily can be added to a slot. A unique SMU CMU Unify Unit (SCUU) eliminates cabling confusion when connecting the SMUs and the CMU to your wafer-probing environment. This greatly improves characterization efficiency and accuracy by eliminating the time needed and measurement compensation required when switching between cables. The flexibility of the Agilent B1500A extends to measurement range as well, by providing extremely high resolution measurements: sub-1 femtoamp and sub 1-microvolt. Agilent EasyEXPERT software task-oriented approach: Enables users to be immediately productive and focus on the real task-at-hand (device characterization), without having to become a specialist at using the instrument hardware. Modular 10-slot hardware configuration, with support for the following module types: HPSMU, MPSMU, HRSMU, MFCMU; Allows you to tailor your measurement solution to meet your precise measurement needs, thereby optimizing cost versus performance. Support for both IV (SMU-based) and CV (MFCMU-based) measurements; Provides seamless measurements and eliminates the need to purchase a separate capacitance meter to perform medium frequency (1 KHz to 5 MHz) CV measurement. SMU CMU Unify Unit (SCUU); Takes care of connecting and multiplexing between the MPSMUs/HRSMUs and the MFCMU. Effortless CV and IV measurement, with no need to worry about issues such as cable length, capacitance compensation and capacitance measurement current return path. ASU: 100 attoamps current measurement resolution and multiplexing with the MFCMU Stable 100 attoamps current resolution via remote sensing meets the most demanding ultra low current measurement requirements, and also allows CV measurements without having to change any cables. MS Windows PC-based instrument Integrates easily into existing PC-based work environments, allowing easy networking, file sharing and printing. Touch screen instrument interface, with optional USB keyboard and mouse It is equally easy to use the instrument when it is mounted in an instrument rack or when it is sitting on the benchtop in your lab. http://www.agilent.com
Best process award
SEZ – Uniformity Control in Advanced Packaging Applications
The demand for single-wafer wet-processing technology has expanded beyond the fab floor to a variety of new applications for back-end semiconductor packaging and assembly, where the need for a more flexible, cost-effective and higher-performing wet solution is escalating rapidly.Semiconductor product wafers are customarily thinned via a substrate-etch process prior to dicing in order to aid the sawing operation, minimize the thickness of the final assembled package, and improve devices’ ability to dissipate heat by lowering the thermal resistance of the die. This is particularly crucial when dealing with advanced packaging technologies—e.g., chip-scale, multi-chip and wafer-level packaging, flip-chip, die/package stacking, and systems-in-package—in which space is at a premium, with die in extremely close proximity. The primary technologies currently employed for post-grind substrate etching—dry (plasma) and CMP solutions—still induce mechanical damage to the substrate surface, proving destructive to the wafer and the die. Wet processing, however, does not incur such damage, due to the nature of isotropic etching and the different mix of chemistries employed. This leads to less breakage during the sawing operation and increased final packaged device yield. Moreover, SEZ’s wet spin-processing approach delivers a unique advantage for handling thin wafers—its non-contact Bernoulli handling allows safe transfer of even extremely thin wafers, which have a tendency to warp. There is also an increased need for optimized under-bump metallization (UBM) etch, which, together with wafer bumping, has grown critical to optimizing packaging and assembly techniques such as flip-chip. UBM is the foundation upon which solder bumps are built. Typically, multiple layers of various, compatible metals are deposited and a thick photoresist is applied, followed by electroplating and photoresist stripping. The excess metal is then etched away, before bump reflow and completion. This etching step has moved beyond the scope of batch spray tools' capabilities, especially for 300-mm wafer bumping, while SEZ's single-wafer wet process has proved well suited to meet its increasingly stringent performance requirements. SEZ’s core Spin Processor technology is suited for other bumping applications as well, including photoresist strip, incoming wafer cleaning, post-plasma chemical vapor deposition (CVD) cleaning, defluxing and bump post-cleans. Its yield-optimizing capabilities geared toward assembly/packaging include:
- Superior processing quality, throughput and reliability;
- Complete processing flexibility with respect to handling, integration, wafer size, and choice and supply of chemistries; and
- Improved cost of ownership (CoO) through reduced equipment cost and optimized consumption of resources, i.e., chemicals and deionized water.
Sub System/Component Provider
The tools required for semiconductor manufacturing are actualised as a result of many companies providing innovative sub systems and components to the tool manufacturers. These sub systems and components can be a critical enabler for the success of a given tool.
New system award
Advanced Energy Industries, Inc – AE EPV
EPV100-AW: Absolute Pressure Control — maintains exceptional stability under the toughest fab conditions. Its integrated vacuum generator enables absolute pressure control, eliminating the effects of fluctuating atmospheric pressure. The N2 pilot valve control and patented balancing spool technology deliver a level of response, accuracy, and stability that conventional technology can’t match. The EPV100-AW’s differential pressure monitoring function enables customers to equalize chamber pressure with atmospheric pressure for safe opening of the process chamber.Specifically designed to control chamber exhaust, the EPV100-AW stabilizes the process environment to enable highly uniform oxide film layers. This elegant, single-package design installs easily, requiring no upstream modifications. Fast response, wide pressure control range, superior reliability, and decreased resource consumption all add up to improved yield and reduced cost of ownership. Typical Applications
Aera’s EPV100-AW Exhaust Pressure Controller benefits any sensitive, atmospheric pressure manufacturing process, but is especially suited for use with vertical atmospheric thermal oxidization (diffusion) furnaces. This enables diffusion processes to produce the ultra-thin, yet highly uniform oxide film layers that multi-level flash memory products require. Differentiating Pressure Control Technology
N2 valve control and patented balancing spool technology enable the EPV100-AW to quickly compensate for pressure changes in the chamber and the exhaust duct. An onboard pressure sensor and control circuit form a closed-loop feedback system to control the main valve with outstanding precision. This design enables a wider pressure control range and produces better pressure stability than the conventional motor-drive approach. Highly Uniform Oxide Layers
As gate oxide thicknesses diminish, stable chamber pressure is increasingly critical. Unstable process exhaust can damage uniformity significantly. AE’s exclusive technology enables a higher level of stability for more precise oxide layer control than conventional approaches. Better Process Repeatability
EPV100-AW creates a stable process condition that is highly repeatable, chamber-to-chamber and run-to-run. Further, its absolute pressure control approach enables customers to run identical processes at different altitudes and under varying weather conditions. The EPV100-AW enables diffusion processes to produce the ultra-thin, yet highly uniform oxide film layers that multi-level flash memory products require. AE’s exclusive technology enables a higher level of stability for more precise oxide layer control than conventional approaches. Aera’s EPV100-AW Exhaust Pressure Controller offers lower operation costs, easier installation, and more precise, rapid exhaust pressure control than any device of its kind on the market today. http://www.advanced-energy.com
Improvement award
Aerotech, Inc – WaferMax ZThe WaferMax Z represents a significant breakthrough in vertical alignment of high-precision components in one compact package. Its superior noncontact linear motor drive employs a high-accuracy encoder for direct position feedback. When combined with Aerotech’s MXH multiplier, it offers 0.83 nm resolution in addition to high speed and accuracy. Bearing elements are cross-roller style for maximum smoothness and reliability. These are mounted on an optimized base and wedge assembly for stiffness and low mass/inertia, enhancing dynamic performance. All the critical elements of the WaferMax Z were selected to operate in a 24/7 industrial environment and, unlike screw- or piezo-based vertical stages, the WaferMax Z requires no maintenance and will ensure years of trouble-free operation. To maximize positioning performance, the WaferMax Z utilizes Aerotech’s BLMUC-series brushless, slotless linear motor. This motor has all the advantages of a brushless direct-drive motor — no brushes to wear, no gear trains to maintain, and high acceleration and high speeds. Since it is a slotless, ironless design, there is zero cogging, meaning that there is absolutely no torque ripple. This makes the WaferMax Z ideal for contoured motion, smooth scan velocity, or precise incremental steps. Performance is assured with a precision linear encoder that results in 0.8 nm resolution. The motor and high-performance linear encoder are directly coupled to increase accuracy. Aerotech manufactures a wide range of servo amplifiers and advanced controllers to provide a complete, integrated package.
http://www.aerotech.com
R & D Initiative of the Year 2006 sponsored by
The cost of research and development for new innovations in microelectronics manufacturing have increased to the point that most companies are no longer able to afford to develop new ideas on their own. This award recognises the recent trend of R&D initiatives that ensure the industry maintains the impressive rate of technological advancement.
Innos Ltd - Silicon Microgenerators
The biggest roadblock to wireless comms is power - either a battery or a connection is required. Batteries, whilst efficient need to be recharged or replaced. Smaller than a matchbox, the device developed by Perpetuum Ltd is a small electro mechanical system consisting of an arrangement of magnets on a vibrating beam. These magnets move past a coil, generating power up to four milliwatts, enough to power a sensor, microprocessor and radio link.Innos was chosen by Perpetuum Ltd to research and develop a silicon-embedded self-powered wireless device. The concept is to harvest kinetic energy from vibrations in the environment, which is then converted by microgenerators into usable electrical energy to power sensors, microprocessors and transmitters.Working together, Perpetuum Ltd and Innos have pioneered a Silicon MEMS Microgenerator that is 5mm X 5mm X 1.5mm and capable of producing a few hundred microwatts under suitable conditions. Imagine a heart pace maker that uses the patients own body energy to power it, eliminating the need for a battery and the associated operations to replace them. This breakthrough has truly revolutionary possibilities for industry. Further applications for the device includes:
* Condition monitoring of machinery: motors, turbines, pumps and gearboxes
* Powering and delivering signals from sensor systems for testing rotating parts, wheels, rotors, shafts, and propellers
* Permanent embedding in inaccessible structures: bridges, roads,
* Vehicle, container or asset tracking The core strategy is the integration of emerging technologies such as MEMS, bioelectronics and nanotechnologies with conventional silicon technology. The facilities and expertise at Innos mean that we are ideally placed to undertake experimental and pioneering R&D and initial production projects, such as the Perpetuum Silicon MEMS Microgenerators. 
http://www.innos.co.uk
Outsourcing Company Of the Year
Maintaining and managing any company these days is no easy task. Many companies now outsource aspects of their daily requirements to a specialist in a given area. This award is for those companies providing outsourcing services that help improve a company’s productivity.
Maser Engineering - Test & Diagnostics of Micro-electronics
MASER Engineering is an independent Dutch company, located in Enschede, The Netherlands, offering high-tech support to micro-electronic engineering groups. We operate a wide range of advanced equipment for various engineering applications. MASER Engineering is certified according ISO-9001 and has accreditations for environmental tests according ISO-17025. The Reliability test group supports customers with the qualification and test of electronic components and systems, ESD and Latch-Up testing and a wide range of electrical, environmental and mechanical tests. MASER Engineering also offers for system design validation HALT and HASS services. The Physical Analysis group supports customers with device failure and construction analysis, micro- and surface analysis of electronic materials and FIB based IC modification services. Our customers benefit from our continuous efforts to have up to date test and analysis equipment and know-how available that meets their technology requirements.Fast growing independent test and analysis services for cutting-edge technology requirements.
http://www.maser.nl
MEMS Innovation of the Year 2006
Surface Technology Systems plc – Pegasus DRIE technology for MEMS fabrication
Pegasus is the continuation of STS' Advanced Silicon Etch (ASE®) technology which enables MEMS device manufacturers to improve throughput and yield, thus reducing costs of production. The new technology has realised silicon etch rates higher than any other Deep Reactive Ion Etch (DRIE) system currently on the market (>50µm/min for 1% exposed area).The Pegasus process module incorporates a range of developments and enhancements in a unique, high uniformity plasma source design. This high-density decoupled source has been shown to increase etch rates by 30% over competing systems and mask selectivity by 35% or more. The unique design of Pegasus leads to a more uniform plasma at the wafer surface resulting in improved across-wafer uniformity for both etch rate and critical dimension control. Pegasus also includes a range of software and hardware features that provide further advances in reduced feature roughness and improved profile control while maintaining high etch rates. As standard, Pegasus incorporates STS' patented Parameter Ramping and Silicon on Insulator (SOI) technologies which are key in the optimisation of high aspect ratio features often found in MEMS devices, and etching to hidden sacrificial oxide layers. Pegasus has been optimised for reliability and ease of maintenance by adopting a modular design concept that also results in a reduced footprint and improved accessibility. The combination of all of these features ensures a high performing, low cost of ownership solution to meet the highest industry expectation. The system is fully compatible with any of STS' modular platform configurations, from single wafer load-lock to full production cluster systems, enabling a smooth transition from research and development right through to volume production. The Pegasus DRIE system offers MEMS manufacturers and researchers a truly enabling wafer processing tool, with market-leading process performance available on a complete range of wafer-handling platforms ranging from manually loaded, single-wafer loadlocks to fully production-proven multi-chamber cluster tools, which allows easy transition from R&D to full scale production. Key features of the new system include the improved etch rates, improved selectivity, smooth sidewall capability, high plasma uniformity, along with the patented "Parameter Ramping" and "SOI" capability of STS original ASE® Process. Since the introduction of the 'Bosch Process' or DRIE for deep anisotropic silicon etching, in 1994, STS has worked continuously with MEMS customers to improve the technology and process capabilities, and facilitate the commercialisation of an ever-growing range of MEMS devices, including ink jet heads, sensors, gyroscopes, microfluidics, BioMEMS and optical MEMS devices. The Pegasus system is the result of over a decade's experience in this field, and STS is committed to continuing to push the limits of this technology and satisfy the requirements of the MEMS industry.
Contact Information:
Jackie Cannon - Sales & Marketing Manager
EuroAsia Semiconductor & IC Industry Awards
Angel Business Communications Limited
Hannay House
39 Clarendon Road
Watford
Herts
WD17 1JA
T: +44 (0)1923 690200
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jc@angelbcl.co.uk
David Ridsdale – Editor in Chief
EuroAsia & IC Industry Awards
Angel Business Communications Limited
Hannay House
39 Clarendon Road
Watford
Herts
WD17 1JA
T: +44 (0)1923 690200
F: +44 (0)1923 690201
dr@angelbcl.co.uk
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