EuroAsia IC Industry Awards

GMT

Voting guidelines

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Only one vote per product category.
Votes can only be accepted from a current business email address.
Third party email providers (hotmail, yahoo, etc) will NOT be accepted.
A company cannot vote for themselves or they will be excluded.
Voting closes on 26th September 2008.

Voters will be expected to provide their name, job title, email address, company name and web address. The information is for vote validation purposes. It will be regarded as confidential and will not be disclosed to any third party organisation. Any obvious voting abuses may result in nominee withdrawal.

Please note - You do not have to vote in every category.

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Please Vote On The Following Categories:

Materials - Enabling Award

Advanced Diamond Technologies Ultrananocrystalline Diamond Wafers
Alchimer eG ViaCoat material for TSV metallisation
Honeywell Electronic Material Burn-in thermal interface material
SILECS, INC. New use of spin-on dielectric materials to enable new generation of CMOS sensors

Materials - Improvement

Dupont/EKC Technology CuSolve EKC520 copper/low-k post etch residue remover
Entegris Inc, Wafer Handling Unit Ultrapak Edge Guard wafer shipping box
Ferro Electronic Material Systems ILD Slurry
Honeywell Electronic Materials Honeywell burn-in materials
Okmetic Oyj G-SOI gettered SOI substrates for integrated MEMS and CMOS processes

Yield Management - Best Tool

Camtek Intelligent Imaging Ltd Falcon line of automated wafer inspection & metrology systems
Carl Zeiss SMT - SMS Division E-beam Mask Repair System MeRiT MG 45
Metryx Ltd The Metryx Mentor
Qcept Technologies ChemetriQ 3000
Sela MC600i

Yield Management - Best Process

FEI Company Helios NanoLab 400S
Mfg Vision Floorvision yield management software
Virage Logic Corporation Self-Test and Repair (STAR) Yield Accelerator
Vistec Semiconductor Systems GmbH LMS IPRO4
VLSI Standards, Inc. NanoCD Standard

Wafer Processing - Best Tool

ASM America, Inc. Pulsar 3000 ALD Module
Aviza Technology Versalis fXp
EV Group (EVG) EVG®150 NanoSpray Coating System
MATECH WaveEtch Advanced Wet Processing Tools
Microcontrol Electronic Italy Leonardo 300 Photopolymer Film Lamination
Rudolf Technology The NSX Series

Wafer Processing - Best Process

Alchimer Electrografting process for TSV metallisation
FSI International, Inc. ZETA Spray Cleaning System with ViPR Technology
Nova Measuring Instruments Ltd. NovaScan 3090Next
Replisaurus ElectroChemical Pattern Replication (ECPR)
Solvay Fluor F2 mixture for chamber cleaning
Surface Technology Systems plc Pegasus DRIE technology for 3D packaging applications

FMT- Best Tool

Agilent Technologies The 4080 series of Parametric Test Systems
F&K Delvotec Bondtechnik GmbH G5 Wirebonder
HÜTTINGER Elektronik GmbH + Co. KG HMP - DC Power Supplies
Kulicke & Soffa Industries The IConnPS High Performance Wire Bonder
Tokyo Electron Ltd Precio automated wafer prober

FMT- Best Process

Hesse-Knipps, Inc. Multi-dimensional Control System
Nanoplas HDRF - dry cleaning for advanced 3D silicon integration technologies
phoenix\|x-ray Systems + Services GmbH x\|act - µAXI with highest defect coverage
SET Kadett device bonder

Sub System/Component - New System Award

Hach Ultra ORBISPEHERE 510
HORIBA Jobin Yvon SAS Simple Thin Film Measurement with the Auto SE
Keithley Instruments, Inc. The Model 2636 Dual-Channel SourceMeter Instrument
Tres-Ark, Inc. AutoLytics, an automated CMP monitoring system

Sub System/Component - Improvement Award

Advanced Energy Industries Paramount RF-power delivery system
Carl Zeiss NTS GmbH LIBRA 200 MC
Inficon Sion plasma arc detector
Pfeiffer Vacuum CMR/CCR PicoCube multi-axis scanning stage
RASIRC Steamer UHP 125

Outsourcing

Digitron Engineering Services GmbH
Maser Engineering
T5 Process Solutions Limited

Start Up Company of the Year 2008

Advanced Micro-Fabrication Equipment Inc. (AMEC)
Nanoplas
RFIC Solutions
Ricmar Sales & Service GmbH
T5 Process Solutions Limited

MNS Innovation Award

Alcatel Micro Machining Systems AMS4200 DRIE/PECVD
Obducat Sindre manufacturing system for NIL
SiTime World's Thinnest Programmable Clock Oscillators

MEMS Foundry of the Year

Micralyne
Silex Microsystems
Tronics Microsystems S.A.

CleanTech Award 2008

Nanoplas
Replisaurus
SILECS, INC