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  • Voting is strictly monitored.
  • Only one vote per product category.
  • Votes can only be accepted from a current business email address.
  • Third party email providers (hotmail, yahoo, etc) will NOT be accepted.
  • A company cannot vote for themselves or they will be excluded.
  • Voting closes on 26th September 2008.

Voters will be expected to provide their name, job title, email address, company name and web address. The information is for vote validation purposes. It will be regarded as confidential and will not be disclosed to any third party organisation. Any obvious voting abuses may result in nominee withdrawal.


Please note - You do not have to vote in every category.

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Please Vote On The Following Categories:

Materials - Enabling Award
Advanced Diamond Technologies
Ultrananocrystalline Diamond Wafers
Alchimer
eG ViaCoat material for TSV metallisation
Honeywell Electronic Material
Burn-in thermal interface material
SILECS, INC.
New use of spin-on dielectric materials to enable new generation of CMOS sensors
 
Materials - Improvement
Dupont/EKC Technology
CuSolve EKC520 copper/low-k post etch residue remover
Entegris Inc, Wafer Handling Unit
Ultrapak Edge Guard wafer shipping box
Ferro Electronic Material Systems
ILD Slurry
Honeywell Electronic Materials
Honeywell burn-in materials
Okmetic Oyj
G-SOI gettered SOI substrates for integrated MEMS and CMOS processes
 
Yield Management - Best Tool
Camtek Intelligent Imaging Ltd
Falcon line of automated wafer inspection & metrology systems
Carl Zeiss SMT - SMS Division
E-beam Mask Repair System MeRiT MG 45
Metryx Ltd
The Metryx Mentor
Qcept Technologies
ChemetriQ 3000
Sela
MC600i
 
Yield Management - Best Process
FEI Company
Helios NanoLab 400S
Mfg Vision
Floorvision yield management software
Virage Logic Corporation
Self-Test and Repair (STAR) Yield Accelerator
Vistec Semiconductor Systems GmbH
LMS IPRO4
VLSI Standards, Inc.
NanoCD Standard
 
Wafer Processing - Best Tool
ASM America, Inc.
Pulsar 3000 ALD Module
Aviza Technology
Versalis fXp
EV Group (EVG)
EVG®150 NanoSpray Coating System
MATECH
WaveEtch Advanced Wet Processing Tools
Microcontrol Electronic Italy
Leonardo 300 Photopolymer Film Lamination
Rudolf Technology
The NSX Series
 
Wafer Processing - Best Process
Alchimer
Electrografting process for TSV metallisation
FSI International, Inc.
ZETA Spray Cleaning System with ViPR Technology
Nova Measuring Instruments Ltd.
NovaScan 3090Next
Replisaurus
ElectroChemical Pattern Replication (ECPR)
Solvay Fluor
F2 mixture for chamber cleaning
Surface Technology Systems plc
Pegasus DRIE technology for 3D packaging applications
 
FMT- Best Tool
Agilent Technologies
The 4080 series of Parametric Test Systems
F&K Delvotec Bondtechnik GmbH
G5 Wirebonder
HÜTTINGER Elektronik GmbH + Co. KG
HMP - DC Power Supplies
Kulicke & Soffa Industries
The IConnPS High Performance Wire Bonder
Tokyo Electron Ltd
Precio automated wafer prober
 
FMT- Best Process
Hesse-Knipps, Inc.
Multi-dimensional Control System
Nanoplas
HDRF - dry cleaning for advanced 3D silicon integration technologies
phoenix|x-ray Systems + Services GmbH
x|act - µAXI with highest defect coverage
SET
Kadett device bonder
 
Sub System/Component - New System Award
Hach Ultra
ORBISPEHERE 510
HORIBA Jobin Yvon SAS
Simple Thin Film Measurement with the Auto SE
Keithley Instruments, Inc.
The Model 2636 Dual-Channel SourceMeter Instrument
Tres-Ark, Inc.
AutoLytics, an automated CMP monitoring system
 
Sub System/Component - Improvement Award
Advanced Energy Industries
Paramount RF-power delivery system
Carl Zeiss NTS GmbH
LIBRA 200 MC
Inficon
Sion plasma arc detector
Pfeiffer Vacuum
CMR/CCR PicoCube multi-axis scanning stage
RASIRC
Steamer UHP 125
 
Outsourcing
Digitron Engineering Services GmbH
Maser Engineering
T5 Process Solutions Limited
 
Start Up Company of the Year 2008
 
Advanced Micro-Fabrication Equipment Inc. (AMEC)
Nanoplas
RFIC Solutions
Ricmar Sales & Service GmbH
T5 Process Solutions Limited
 
MNS Innovation Award
Alcatel Micro Machining Systems
AMS4200 DRIE/PECVD
Obducat
Sindre manufacturing system for NIL
SiTime
World's Thinnest Programmable Clock Oscillators
 
MEMS Foundry of the Year
Micralyne
Silex Microsystems
Tronics Microsystems S.A.
 
CleanTech Award 2008
Nanoplas
Replisaurus
SILECS, INC
 
 

 

 

 
 
 
 
 
 
 
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