A new suit of aligners and measurement systems for 3D IC and other advanced semiconductor, MEMS and nanotechnology devices manufacturing has been introduced by EVG which is expected to increase performance significantly.

The industry giant drives the acceleration of TSV adoption in 3DICs and delivers a high performance etch system.

Both companies announce breakthrough results and collaboration on copper process technology for 2Xnm and beyond.

Infineon Technologies announced that Robert Bosch will be employing a chip from Infineon in its next generation of automotive radar systems.

Dubai Circuit Design Centre receives award from Global Design Forum in Germany. Synopsys Users Group (SNUG) in Munich recognises DCD’s technical excellence.

Hitachi Data Systems to locate MENA headquarters at Dubai Silicon Oasis.

The company announces progress on partnership discussions and delays release of results.

MAPPER Lithography has received a $5 million innovation loan from SenterNovem, the innovation agency of the Dutch Ministry of Economic Affairs, to further develop its highly innovative lithography machine for the manufacturing of chips.

The company also received the second tranche of US$ 200 in cash.

A big step towards energy saving OLED lighting with efficiency of more than 60 lm/W. International standard for white colour requirements met.

The company completes relocation from United Kingdom to become first international high tech equipment supplier to move entire operation to New York’s Capital Region.

The new system will help to reduce PFC pollution from dielectric film etching processes used in semiconductor manufacturing.

SRAM with HK/MG process has yielded and complements foundry's 32/28nm technology.

OLOVO announces agreement for supplying advanced packaging wafer bumping plating anodes.

The company draws US$ 400 million under its revolving credit facility.

The companies move into mass production of 34nm NAND Flash.

Linde wins three new long term thin film contracts to capture over 50% of the market in China.

The licensing of this Beyond Semiconductor technology will enable e3C to expand its consumer electronics product lines and deliver more cost competitively products to the market.

The company will develop RF WiMAX production test solution for Fujitsu Microelectronics’ new WiMAX PCMCIA card and WiMAX USB dongle devices.

The company sets new world record in microscopy resolution using scanning helium ions.

The companies collaborate at MIT on ultra low power microcontroller devices.

Silicon Foundry Holding can immediately start production without modifications to the facility, rapidly addressing an existing market demand.

The Semiconductor Equipment Association of Japan (SEAJ) posts its book to bill ratio based on three months average for October 2008.

Polysilicon facilities start up at Wacker’s Burghausen site and creates new jobs.

Credit turmoil cuts 2009 PC outlook by nearly two thirds says iSuppli.