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Please find below the February/March 2007 digital issue of MicroNanoSystems.
With the hype surrounding nanotechnology, MEMS and integration of emerging technologies it would be easy to assume that the industry has all the results and processes required to develop a constant supply of life changing devices for the business and consumer world. Of course, nothing could be further from the truth.
There are many scientists who believe that the term nanotechnology has been adopted to early but the marketers have already run with the ball. The reason for the reluctance is that there are almost no products that are of that size or being built from the bottom up rather than the traditional top down. Microelectronic manufactures have made parts of their devices at nano size for a number of years now and there is still a way to go to iron out the manufacturing issues.
Similarly MEMS has not reached its potential as there are a plethora of manufacturing needs based on the device rather than the generic size of a semiconductor. Economic realities require a similar manufacturing ease as with semiconductors. The key factor for all merging technologies is the ability to integrate into the existing electronics food chain.
Design and system wide accessibility will be the key driver for these exciting new developments.
MicroNanoSystems will explore the synergies between these new technologies taking a look at how any development is inherently tied to the legacy systems. I look forward to creating an interesting forum to explore this issue.
David Ridsdale
Editor in Chief
Features - February/March 2007
Editors Comment
By David Ridsdale |
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The future of parametric
testing
Integrated circuit devices continue to shrink in size, increase in
density, and improve in performance every year. Manufacturing and
testing these devices while simultaneously maintaining and
improving yield has become increasingly difficult. David Ridsdale spoke to Dr. Stewart Wilson, European System Sales Manager for
Parametric Test Systems at Agilent about the growing need for
parametric testing in the industry. |
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Static & Dynamic MEMS Device
characterisation
MEMS are quickly pervading every aspect of the technical world but only a handful are
making the grade as commercially viable products. The very diversity creates manufacturing
differences that makes it difficult to create a wide variety of devices. In this article,
Eleonora Ferraris and Irene Fassi from Institute of Industrial Technology and
Automation, Biagio De Masi from MEMS Business Unit, STMicroelectronics, Richard
Rosing and Andrew Richardson from Centre for Microsystems Engineering, Lancaster
University discuss two empirical methods suitable for the static and the dynamic
characterisation of micrometersized structures. |
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Advancing E Beam Lithography
E Beam Lithography has always been a precise method of
patterning in microelectronics manufacturing but has suffered
from slow throughput, reducing its take up in the industry. David
Ridsdale spoke to Nezih Unal, VP of Sales and Marketing at
GenISys to discover how the process is being developed to meet
emerging needs. |
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Customising Photolithography
Mask Aligners
With the expansion of photolithography machines into new fields, manufacturers of biomedical, solar cell, MEMS and LED products now have a new way to develop next generation devices. Here Neutronix discusses its technology field innovation with its new photolithography mask aligner productuction tool remanufactured from the old industry Canon series. |
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