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Please find below the July 2007 digital issue of MicroNanoSystems.
With the hype surrounding nanotechnology, MEMS and integration of emerging technologies it would be easy to assume that the industry has all the results and processes required to develop a constant supply of life changing devices for the business and consumer world. Of course, nothing could be further from the truth.
There are many scientists who believe that the term nanotechnology has been adopted to early but the marketers have already run with the ball. The reason for the reluctance is that there are almost no products that are of that size or being built from the bottom up rather than the traditional top down. Microelectronic manufactures have made parts of their devices at nano size for a number of years now and there is still a way to go to iron out the manufacturing issues.
Similarly MEMS has not reached its potential as there are a plethora of manufacturing needs based on the device rather than the generic size of a semiconductor. Economic realities require a similar manufacturing ease as with semiconductors. The key factor for all merging technologies is the ability to integrate into the existing electronics food chain.
Design and system wide accessibility will be the key driver for these exciting new developments.
MicroNanoSystems will explore the synergies between these new technologies taking a look at how any development is inherently tied to the legacy systems. I look forward to creating an interesting forum to explore this issue.
David Ridsdale
Editor in Chief
Features - July 2007
Editors Comment
By David Ridsdale Editor-In-Chief. |
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Cover story
Automated tool for double-sided overlay metrology
The effects of MEMS devices storming the market has resulted
in backside patterning experiencing strong growth. Keith A.
Cooper, Thomas Huelsmann, SUSS MicroTec discuss the
demand for more effective uses of wafer space. |
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MicroNanoSystems
Thin Wafer Processing in High Vol. Manufacturing
To meet the demand of device size reduction, manufacturers
continue to look for ways to reduce component space.
Stefan Pargfrieder, Paul Linder, EVG Group and Steven
Dwyer, Thorsten Matthias, EVG U.S. discuss two methods. |
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MicroNanoSystems
Introduction to Deep Silicon Etching
New technology developments require, advanced methods of
manufacturing. Dr Yiping Song and Dave Thomas,
Aviza Technology discuss the versatility of using Si etch and
polymer deposition to improve results using the Bosh Process. |
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MicroNanoSystems
Flat Out For The Future
New technologies and devices are are usually pioneered during
production Dr. Mike Cooke, Technology Journalist reports on a
the prospects of graphene, a new material in nano fabrication. |
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MicroNanoSystems
Processing Polymer Electronics
Revolutionary technology, Dr Alec Reader, Innos discusses
polymer electronics as a possible successor to silicon. |
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MicroNanoSystems
New-energy-efficient products
Micron Technology discuss their new power efficient range. |
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MicroNanoSystems
Advancing state-of-the-art in FinFET’s
IMEC presents some promising results. |
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