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13th April 2007
News

Product News


For three days in April, you have a unique opportunity to learn from leading experts on Nanotechnology in academia and industry.
Keithley Nano Days is a live, online conference on Nanotechnology that features a series of six web-based seminars presented by industry leaders – all at no charge. Using the Internet, you can view each of the seminars and participate in live Q&A with the presenters from the comfort of your office.
Register to attend any of the seminars of your choice during Nano Days - each day’s registration includes two seminars covering the latest nanotechnology industry trends such as new measurement instrumentation and techniques.
Don’t miss this great opportunity to learn industry-leading technology without ever leaving your office!
Presenting companies include FEI Company, Hysitron, Inc., Keithley Instruments, Inc., Kleindiek Nanotechnik, Michigan State University, FCRP Center on Functional Nano Architectonics (FENA) & NRI Western Institute of Nanoelectronics (WIN).
FREE: Download Keithley's Nanotech RSS Reader Widget from our event page that automatically keeps you updated about news in the Nanotechnology world.
Click here for program details and to register. |

News Stories
European company reaches milestone in defect cleaning for EUV mask blanks
Technologists at Sematech have successfully detected and cleaned 10 nm particles from mask blanks for use in extreme ultraviolet (EUV) lithography - pushing the technology another significant step toward readiness for advanced manufacturing....12-04-2007 | Read More | back to top

Joint effort for design-aware mask inspection aims for higher 45nm device yield
KLA-Tencor and Clear Shape Technologies have announced that they are collaborating on DFM (design for manufacturability) solutions enabling "design-aware" photomask inspection at 45nm and below....12-04-2007 | Read More | back to top

Collaboration will improve manufacturability of mask reconfigurable IP
Clear Shape Technologies and Lightspeed Logic have announced a partnership to combine their design, manufacturing, and EDA methodologies to reduce litho-related variability and stress-related variability in mask reconfigurable IP at the 65nm and 45nm process nodes....11-04-2007 | Read More | back to top

New TEM enables view of sub-atomic details
A new transmission electron microscope (TEM) for the imaging and analysis of materials with atomic resolution has now been successfully installed at the caesar Institute in Bonn....11-04-2007 | Read More | back to top

TSMC schedules 45nm production for September
Taiwan Semiconductor Manufacturing Company has announced that it would complete 45nm technology qualification and enter production as early as September 2007....10-04-2007 | Read More | back to top

First MEMS based CO2 gas sensor module
AMS Technologies has announced the availability of a groundbreaking new technology for CO2 detection, the SensorChip-CO2-4P from ICx Photonics, formerly ICx Ion Optics....04-04-2007 | Read More | back to top

European agreement will accelerate system-level MEMS development
A deal with SoftMEMS has been agreed which will enable EDA Solutions to offer a system-level MEMS environment that will accelerate development....04-04-2007 | Read More | back to top

Product News Stories
Innovative Micro Technology (IMT)
Getter Deposition Services
Innovative Micro Technology today announced it has begun offering getter deposition services for wafer-level packaging of MEMS and other devices that require hard vacuum for device performance. In exhaustive testing, IMT has demonstrated vacuum levels equal to or surpassing other established getter deposition services (see figure). Using IMT’s proprietary getter (patent pending), IMT has routinely achieved vacuum levels below 10 mTorr in production of inorganic devices for such applications as IR emission and sensing and for resonant oscillators in biological and chemical hazard detection applications.
IMT’s getter deposition services are performed on 150mm or smaller wafers in IMT’s Class 100 cleanroom in Santa Barbara, California with fast turnaround of 3-4 weeks for patterned wafers. Faster turnaround is available on request. Shadow masking services are also available. Customers are encouraged to call for price quotations and delivery.
| IMT CEO, John Foster commented, “We see this addition to our MEMS manufacturing services as fulfilling an industry-wide need for fast-turnaround, cost-effective deposition of high-quality getters to enable wafer-level packaging of a wide range of devices that require a vacuum environment. Our getter has been proven to be equal to or better than the industry standard materials available today.” |
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IMT also offers a full suite of MEMS design, prototyping, and production manufacturing services to fabless and fab-light companies in our 30,000 square foot Class 100 fab, the largest and best-equipped independent MEMS fab in the world. Services include:
- Basic device design and design for manufacturability
- Extensive high-volume manufacturing experience, including SQC/SPC
- 6" wafer efficiency
- 30,000 sq. ft. Class 100, fully automated clean room/fab with superior tool set for all aspects of wafer processing
- Sub-micron photolithography to 0.35um
- Wafer-level bonding (glass frit, eutectics, anodic, fusion, polymer) for device encapsulation (vacuum, atmospheric and partial pressures) and microfluidic construction
- Getter deposition for vacuum wafer-level packaging (firing temperature 400C)
- Deep reactive ion etching (DRIE)
- Electroplating of Au, Cu, Ni, In, NiFe, and other alloys
- Chemical-mechanical polishing (CMP)
- Extensive non-CMOS materials flexibility in deposition, etch, magnetics, polymers, etc.
- Unmatched metrology tools and experience

www.imtmems.com | back to top

Armstrong Optical Ltd
Vibration analysis
With the capability to assess mechanical vibrations in the range 0 - 450kHz the SP-S series interferometric vibrometer from Armstrong Optical Ltd opens whole new vistas of measurement capabilities.
The modular system, manufactured by SIOS Messtechnik GmbH of Ilmenau in Germany, has been designed to allow non-contact vibration measurements to be made on surfaces of arbitrary roughness and can also be easily adapted to perform extreme precision length measurements.
Coupled with the ability to have the small, electrically passive, measurement head (8x8x4cm) physically removed from the control electronics and PC (<10m) measurements in constrained and harsh environments can be undertaken with confidence. |
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SP-S systems have been successfully used in applications such as the calibration of piezo-ceramic stacks, vibration analysis of micro switches, fans, industrial drives, CNC machines, replacement of capacitive/inductive sensors on dilatometers, damping/stress-strain research on materials such as polymer fibres, carbon composites, metals, glass, cardboard etc.

www.armstrongoptical.co.uk | back to top

PI (Physik Instrumente)
XYZ-Piezo-Scanner for AFM Provides 25 Picometers Resolution
PI (Physik Instrumente) offers a new ultra-high-resolution positioning & scanning system. The minute P-363 PicoCube, together with its ultra-low noise E-536 driver / controller, provide significantly higher resolution and positional stability than previous multi-axis scanning stages.
Features & Advantages:
- High-Speed XYZ Scanner for AFM / SPM & Manipulation Tool for Nanotechnology
- Custom, High-Stiffness Shear Piezo Drives Provide up to 10 kHz Resonant Frequency for Faster Response and Higher Scanning Performance
- Ultra-Low-Noise Controller Enables 25 Picometers (0.025 nm) Resolution
- Capacitive Feedback for Exceptional Precision and Linearity
- Parallel Metrology for Better Multi-Axis Accuracy
- Small & Rugged Design with Titanium Case
- Vacuum Compatible
| Typical Applications: AFM (Atomic Force Microscopy), SPM (Scanning Probe Microscopy) and Nanomanipulation, Bio-Technology, Nanotechnology, Nano-Imprint, Semiconductor & Data-Storage Test Equipment.
PicoCube systems were designed to overcome the limitations of open-loop piezo-tube based scanners which provide high resolution motion but poor linearity and trajectory guidance.
The compact PicoCube is based on exceptionally robust, high-stiffness piezo drives rather than tubes and employs non-contact, direct-measuring, parallel-metrology capacitive sensors for position feedback. |
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The low-inertia drives allow for a resonant frequency of 10 kHz, important for high speed scanning applications.
Why Parallel Metrology?
Parallel metrology can “see” all controlled degrees of freedom simultaneously and compensate for off-axis motion in real time. The benefits are a reduction of runout and off-axis errors, straighter multi-axis motion and improved repeatability.
Controller
The new ultra-low-noise E-536 closed-loop controller provides unprecedented positional stability and can be controlled with analog or digital signals. Extensive software support including LabView drivers is provided.
 
www.pi.ws | back to top

Vistec Semiconductor Systems
Vistec launches new photomask CD measurement system
for the 45nm technology node
Vistec’s LWM9045 is a SEM-based Critical Dimension (CD) measurement system for photomasks. The tool was designed specifically to address the needs for 45 nm technology node photomask production and 32 nm process development. The LWM9045 provides excellent long-term stability providing “state-of-the-art” dynamic precision performance.
| The LWM9045 utilizes an ozoniser unit that reduces organic contamination in the measurement chamber. The use of a highly accurate laser stage combined with software positioning corrections results in stage accuracy uncertainty of less than +/- 75 nm. In most cases the stage accuracy negates the need for local pattern recognition which leads to greater throughput and system productivity. |
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Key Features
- CD measurement system for the 45 nm technology node production and 32 nm process development
- Dynamic CD measurement repeatability of <0.6 nm (mean 3s)
- Improved substrate charging and contamination control
- Improved stage position accuracy of < 75 nm (range)
- Reduction of measurement times through incorporation of new Image Processing algorithms, reduced pump down times, and reduced reliance on local pattern matching
- Semi-automatic job setup by ASCII input of data files generated by CATS, Hotscope, or Lavis Software
- SMIF handling
- Batch processing of multiple substrates and multiple jobs per substrate
www.vistec-semi.com | back to top



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