27th April 2007

News

Product News

News Stories

New 50 nanometre NAND flash milestones reached in joint development effort
Intel Corporation and Micron Technology have announced they are sampling industry-leading 50 nanometre (nm) multi-level cell (MLC) NAND flash memory manufactured by their NAND flash memory joint venture, IM Flash Technologies....26-04-2007 | Read More | back to top

Veeco selected by Sematech for $2.4 million EUV lithography tool development
Sematech and the College of Nanoscale Science and Engineering ("CNSE") of the University at Albany have announced that International Sematech North ("ISMTN") has selected Veeco Instruments for an additional $2.4 million project that will provide critical research and development necessary to enable extreme ultraviolet ("EUV") lithography for advanced manufacturing....24-04-2007 | Read More | back to top

US-Taiwan business council welcomes Taiwan approval of ProMOS 0.18-micron
The US-Taiwan Business Council has welcomed Taiwan's approval for ProMOS Technologies to build an advanced 0.18-micron chip manufacturing facility in China....24-04-2007 | Read More | back to top

Agreement signed on advanced high-voltage CMOS process
IBM and austriamicrosystems have announced the signing of a development agreement for an advanced high-voltage (HV) complementary metal oxide semiconductor (CMOS) process technology to be used in a range of consumer, automotive, industrial and medical applications....20-04-2007 | Read More | back to top

Ranking of top MEMS companies
WTC has updated its MEMS market data with a global bottom-up survey of the top 30 MEMS companies....18-04-2007 | Read More | back to top

Intel Multi-Core University program expands to 37 Chinese universities
Intel Corporation announced that the expansion of its Multi-core University program to 37 universities in China....18-04-2007 | Read More | back to top

Cavendish Kinetics and National Semiconductor join in nanomech technology
Cavendish Kinetics announced that National Semiconductor Corporation is working with the company to qualify its Nanomech embedded non-volatile memory technology for National's key analogue and mixed signal processes....17-04-2007 | Read More | back to top

Product News Stories

Solid State Laser

Newport Corporation

Newport Corporation's Spectra-Physics Lasers Division has announced the addition of CDRH-compliant models to their popular Cyan series of continuous wave (CW) 488 nm solid state lasers. Designed for table-top use in research laboratories the Cyan Scientific 488 nm serves a wide range of cell analysis applications including confocal microscopy, flow cytometry, and DNA sequencing. The Cyan Scientific laser operates single-frequency and delivers unprecedented beam quality, exceptionally low optical noise and industry leading reliability at power levels from 10-50 mW.

"We are excited to introduce the Cyan Scientific 488 laser to our scientific research customers," said Jürgen Niederhofer, product manager for Newport's Spectra-Physics Lasers Division. "This laser is an attractive alternative to Argon-ion lasers and other DPSS laser solutions, especially when size and low power consumption are important."

With a laser head that measures only 125 x 70 x 34 mm, the Cyan Scientific is designed to minimize space requirements. Probably the most compelling benefit of using these lasers, however, is their reliability. "We have the most extensive test data in the industry demonstrating that the expected lifetime of our Cyan lasers is beyond 20,000 operating hours," added Niederhofer.

For further information: Newport Spectra-Physics GmbH, Guerickeweg 7, D-64291 Darmstadt, T +49-6151-708-0, Fax +49-6151-708 217, Email: germany@newport.com

www.newport.com | back to top

Automated semiconductor characterisation suite

Keithley Instruments, Inc

Keithley Instruments, announces the availability of ACS (Automated Characterisation Suite) integrated test systems for semiconductor characterization at the device, wafer, and cassette level. With ACS integrated test systems, Keithley has created a variety of highly configurable and flexible test systems for semiconductor characterization that offer unique measurement capabilities with powerful automation-oriented software. ACS test systems provide faster measurements and greater system flexibility under one uniform software suite to fit unique test application needs.

Under the unified Automated Characterisation Suite, Keithley's ACS integrated test systems incorporate a variety of test hardware and overall unique measurement capability:

• Keithley's Model 4200-SCS Semiconductor Characterisation System features I-V source-measure and specialized pulse testing packages, such as the Model 4200-PIV package for testing of advanced semiconductor materials.
• Series 2600 SourceMeterR Instruments feature TSP-LinkT and Test Script Processor (TSP)T for scalable I-V channel count systems, fast parallel measurements, and complex test sequences for applications such as on-the-fly NBTI or on-wafer component characterization.
• Series 2400 SourceMeterR Instruments feature high voltage and high current sourcing, which are unique in applications such as high power MOSFETs and display drivers.
• Optional switching, C-meters, and pulse generators round out the instrument capabilities of ACS integrated test systems.

ACS integrated test systems are available in basic bench-top configurations or in factory-integrated full-height rack configurations.

Pricing for Keithley's ACS integrated test systems is based on the particular configuration and customization options. Availability is immediate.

To learn more about Keithley's ACS integrated test systems, visit http://www.keithley.com/pr/070.

www.keithley.com | back to top

Ultrasonic Coating Technology

Ultrasonic Systems, Inc.

Ultrasonic Coating Technology for Electronics Assembly

USI's patented ultrasonic coating technology is revolutionizing the electronics assembly market by providing a superior alternative to conventional air-atomizing spray nozzles, film coating and dispensing technology for coating applications. The patented Ultra-Spray head uses ultrasonic energy to produce a fine spray and directed air streams to precisely shape the coating pattern. All parameters are electronically controlled through the software, including liquid flow rate, air flow and spray mode. Click here to learn more about Ultra-Spray technology.

Prism Conformal Coating System

The Prism System is a high performance line of programmable selective coating systems. The Prism employs the unique combination of ultrasonic spray and digital micro streaming technology to apply coatings to selective areas of a substrate. The ultrasonic spray head produces coating patterns from 5 to 25 mm wide and the Micro-Line Digital Dispensing Valve produces patterns from 1 to 3 mm wide, thus virtually eliminating the requirement for masking. The Prism employs a precision X-Y-Z-θ motion control system. The motion and positioning system consists of precision ball screw linear actuators with digital AC closed loop servo drive motors.

Coating recipes are created using a user-friendly Windows XP based user interface.

Click here to learn more about the Prism Conformal Coating System.

Performa Fluxing System

The Performa Fluxing System provides excellent fluxing performance and process control for high-volume production at a budget conscious price. The Performa applies flux into 100% of plated through-holes of the circuit board and achieves better than +/- 3% flux deposition control.

Click here to learn more about the Performa Fluxing System.

www.ultraspray.com | back to top

High Accuracy Placement and Bonding System for R&D (New)

SUSS MicroTec

SUSS MicroTec, a supplier of precision manufacturing and test equipment for the semiconductor and emerging markets unveiled the KADETT, a new High Accuracy Placement and Bonding System especially configured for R&D laboratories, universities and pre-production environments.

The new SUSS KADETT Semi-Automatic Device Bonder is a flexible and open platform for accurate assembly and bonding of devices on a large variety of substrates. The machine performs accurate Pick and Place functions. A wide range of bonding processes including In-Situ Reflow, Thermo-Compression, Thermo-Sonic and Adhesive Bonding are available for forces up to 75N. The KADETT, originally developed by the Paul Scherrer Institute*, has been proven in the field for bonding Ionizing Radiation Detectors and it is also well suited for Advanced Packaging, micro-optics or MEMS assembly.

Accurate alignment is automatically achieved by a vision system which uses two independent high resolution video microscopes (chip and substrate) with a high resolution (0.1µm) XY alignment stage. The robust and simple concept of the system meets the current requirements for high accuracy placement and bonding various components and its open design makes it the ideal platform for future evolution of the advanced packaging applications.

The flexible architecture of the SUSS KADETT enables the integration of many processing modules such as a UV glue curing system, Ultrasonic bonding head and many others. “Its easy and quick changeover between the various process configurations is of primary interest for research environments where adaptability and multi-user compatibility is essential“, said Gilbert Lecarpentier, International Product Manager at SUSS MicroTec Device Bonder Division.

www.suss.com | back to top

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