10th May 2007

News

Product News

News Stories

First lab-on-a-chip system based on printed semiconductor technology unveiled
BIOIDENT Technologies Inc has announced its first complete, functional lab-on-a-chip system—the PhotonicFlow System....09-05-2007 | Read More | back to top

Efficient mixing in milliseconds with lab-on-a-Chip
Micronit Microfluidics has introduced four glass microfluidic mixers enabling high-quality mixing of micro or nanoliters of fluids, in fractions of seconds....09-05-2007 | Read More | back to top

Nature is nurtured in nano technology computer chip manufacturing
IBM has announced, what they claim to be as the first-ever application of a breakthrough self-assembling nanotechnology to conventional chip manufacturing, borrowing a process from nature to build the next generation computer chips....03-05-2007 | Read More | back to top

Mass production of 16Gb NAND flash memory will accelerate data speeds
Samsung Electronics has announced plans to begin mass producing 16 gigabit (Gb) NAND flash, the highest capacity memory chip now available. The company said it will fabricate the devices in 51 nanometres (nm), one of the finest process technology to be used in memory mass production to date....30-04-2007 | Read More | back to top

Optoelectronic tweezers push nanowires around
In efforts that can improve studies of biological objects and the construction of nanotech materials, researchers at the University of California-Berkeley have invented "optoelectronic tweezers," a new way of controlling nanometre-scale objects....30-04-2007 | Read More | back to top

Opening of new nanotechnology demonstration centre in Japan announced
Carl Zeiss SMT and SII NanoTechnology (SIINT), a subsidiary of Seiko Instruments jointly celebrated the opening of the new Yokohama Nanotechnology Demonstration Centre....27-04-2007 | Read More | back to top

Product News Stories

New dry vacuum pump valves

BOC Edwards

BOC Edwards have announced a new Basement Gate Valve (BGV) designed to enable BOC Edwards dry vacuum pumps operating in harsh processes to be kept running during foreline maintenance, maximizing reliability and up-time. The valves were developed as part of a joint collaboration with VAT, a worldwide leader in vacuum valves.

The valves have been specially designed with a unique wedge sealing system that eliminates the complex mechanism of traditional gate valves. The benefit is that no oil, grease, or moving parts are within the vacuum, thereby reducing the risk of the mechanism being damaged by contamination of the lubrication in dusty processes. In addition, the simplified gate sealing design makes for quick and easy maintenance.

Both manual and pneumatic BGV valves are available. The pneumatic valves can be supplied with the solenoid pre-fitted and wired for easy ordering and installation.

www.bocedwards.com | back to top

Overclocking Memory Modules

Aeneon, a Qimonda AG brand

Aeneon, a Qimonda AG brand announced the availability of a new series of overclocking memory modules designed on the needs of demanding users looking for highest speed and reduced latency. The new XTUNE overclocking series consists of DDR2 1066MHz overclocking memory modules offering exceptional system performance without any compromise on fast, stable and reliable system operation.

www.qimonda.com | back to top

Contacting Sockets for Small Devices

Multitest Elektronische Systeme GmbH

The Multitest nanoKelvin Socket is tailored for the challenging requirements of small pad QFN devices. It integrates the features of cost favourable Kelvin solutions with plunge-to-board capabilities. In general the socket is applicable for packages such as QFNs, QFPs and SOs with a lead pitch down to 0.4 mm. It is designed for today’s and future small size, fine pitch packages with small pad or lead sizes.

The Multitest Dura /Tecta coating, the high contact force of 0.5 Newton at 0.4 mm lead pitch and the minimum, scrub ensure best electrical repeatability. The Multitest coating, guarantees a proven lifespan of more than 1 mio. insertions. The socket uses contact spring blocks, which allow the exchange of the contact springs without any special tool and without additional alignment.

The Multitest nanoKelvin socket is a solution for the high volume production of any Kelvin application, such as mixed signal or analog devices.

www.multitest.com | back to top

High Accuracy Placement and Bonding System for R&D (New)

SUSS MicroTec

SUSS MicroTec, a supplier of precision manufacturing and test equipment for the semiconductor and emerging markets unveiled the KADETT, a new High Accuracy Placement and Bonding System especially configured for R&D laboratories, universities and pre-production environments.

The new SUSS KADETT Semi-Automatic Device Bonder is a flexible and open platform for accurate assembly and bonding of devices on a large variety of substrates. The machine performs accurate Pick and Place functions. A wide range of bonding processes including In-Situ Reflow, Thermo-Compression, Thermo-Sonic and Adhesive Bonding are available for forces up to 75N. The KADETT, originally developed by the Paul Scherrer Institute*, has been proven in the field for bonding Ionizing Radiation Detectors and it is also well suited for Advanced Packaging, micro-optics or MEMS assembly.

Accurate alignment is automatically achieved by a vision system which uses two independent high resolution video microscopes (chip and substrate) with a high resolution (0.1µm) XY alignment stage. The robust and simple concept of the system meets the current requirements for high accuracy placement and bonding various components and its open design makes it the ideal platform for future evolution of the advanced packaging applications.

The flexible architecture of the SUSS KADETT enables the integration of many processing modules such as a UV glue curing system, Ultrasonic bonding head and many others. “Its easy and quick changeover between the various process configurations is of primary interest for research environments where adaptability and multi-user compatibility is essential“, said Gilbert Lecarpentier, International Product Manager at SUSS MicroTec Device Bonder Division.

www.suss.com | back to top

CONTACT INFORMATION
To submit editorial that demonstrates your expertise contact:
David Ridsdale at dr@angelbcl.co.uk
T: +44 (0)1923 690200

For Commercial/Advertising and all other enquiries contact:
Jackie Cannon at jc@angelbcl.co.uk
T: +44 (0)1923 690200

http://www.micronanosystems.info

PRIVACY NOTICE
EuroAsia, the list owner, is pleased to provide you with information on products and services that might be of interest to you. Opt in - if you wish to retain this status no action is required. You may opt out of receiving promotional news by clicking the button below in order to suppress all further emails from EuroAsia.

Please remove my email address from the MicroNanoSystems database - click here

If you have any trouble unsubscribing using the link above please do not 'reply' to this email but instead email info@angelbc.co.uk

© 2007 MicroNanoSystems

If you are having difficulties viewing this email please use the link below.
http://www.euroasiasemiconductor.com/mns-newsletter/issue13.html