News
SEMATECH Celebrates Twenty-Five Years »Friday 3rd February 2012 | SSEC Welcomes Industry Veteran to Board »Wednesday 1st February 2012 |
WACKER: Weak Semiconductor and Solar Demand Slowed Business »Friday 27th January 2012 | 11 New Machines for Aixtron R&D Centres »Thursday 26th January 2012 |
MTPV Completes $10M Series B Financing »Thursday 26th January 2012 | Coherent Reports First Fiscal Quarter Results »Thursday 26th January 2012 |
ISSI Announces First Quarter Results »Thursday 26th January 2012 | AMETEK Acquires O'Brien Corporation »Thursday 26th January 2012 |
Axcelis Announces Strategic Service Partnership with ULVAC TECHNO »Thursday 26th January 2012 | Synopsys Acquires ExpertIO »Wednesday 25th January 2012 |
3D Packaging Or General Chip Shot »Thursday 19th January 2012 | Hitachi Chemical File Patent Infringement Lawsuit against Korean Company »Wednesday 18th January 2012 |
ASML Achieves Record 2011 Sales and Enters 2012 On A High »Wednesday 18th January 2012 | Solvay and Air Liquide Collaborate to Form Flourine Gas JV »Monday 16th January 2012 |
SSEC bolsters sales force in critical regions »Friday 13th January 2012 | Air Liquide Electronics Completes Expansion Programme »Thursday 12th January 2012 |
FEI Buys ASPEX Corporation »Wednesday 11th January 2012 | EV Group Collaborates for Nanopatterning Solution For HB-LED Manufacturing »Tuesday 10th January 2012 |
IBM and GLOBALFOUNDRIES Begin Production at New York's 'Tech Valley' »Tuesday 10th January 2012 | Multiple Orders for FSI »Tuesday 10th January 2012 |
Tegal sells over 30 patents from Nanolayer Deposition Portfolio »Friday 6th January 2012 | Hanwha Solar chooses Oxford Instruments for R&D centre »Wednesday 4th January 2012 |
Soitec to acquire Altatech for € 15 million »Thursday 29th December 2011 | Unison to advance steep ultra-shallow junction technology »Thursday 22nd December 2011 |
SEMATECH’s 3D Enablement Centre Focuses on Future High-Volume 3D Applications »Thursday 22nd December 2011 | Worldwide Semiconductor Revenue Grew 1 Percent to Reach $302 Billion in 2011 »Wednesday 21st December 2011 |
Plessey release latest sensor specifically tailored to detect movement »Tuesday 20th December 2011 | Global Power Semiconductor Market Growth Cut to 5.0% in 2012 »Friday 16th December 2011 |
Dow develops tin CVD precursor for new electronic devices »Thursday 15th December 2011 | Lam Research to acquire Novellus Systems in $3.3 Billion Merger »Thursday 15th December 2011 |
Axcelis Wins Follow-on Order From Major Chipmaker »Wednesday 14th December 2011 | New executive VP for Samsung Electronics »Wednesday 14th December 2011 |
Decline in Silver Pastes Market Expected »Monday 12th December 2011 | SPTS and Sumitomo joint venture to be big in Japan »Sunday 11th December 2011 |
MEMC announces job cuts »Thursday 8th December 2011 | Global chip sales stable in October »Wednesday 7th December 2011 |
Electronics giant needs your help »Wednesday 7th December 2011 | STATS ChipPAC provides update on Thailand plant »Tuesday 6th December 2011 |
Asahi Kasei Orders IQ Aligner UV-NIL System From EV Group »Tuesday 6th December 2011 | ASM qualifies higher-k gate process for 14nm »Monday 5th December 2011 |
Micron and Intel claim NAND leadership »Monday 5th December 2011 | SUSS MicroTec Launches Temporary Bonder for High-Volume Production »Monday 5th December 2011 |
IBM to Produce Micron's Hybrid Memory Cube »Monday 5th December 2011 | EV Group Boosts High-Volume Manufacturing Performance »Monday 5th December 2011 |
SPTS Wins Technology Prize »Saturday 3rd December 2011 | MonolithIC 3D Issued 5th Patent on 3D IC Technology »Saturday 3rd December 2011 |
New Technology for Thin Wafer Handling »Saturday 3rd December 2011 | EUV lithography ties affirmed »Thursday 1st December 2011 |
International ties strengthened »Thursday 1st December 2011 | Intel remains on top »Thursday 1st December 2011 |
Applied Materials Announces Atomic-Level Film Treatment to Reduce Chip Power Consumption »Tuesday 29th November 2011 | Oerlikon Leybold Vacuum starts extended production facility in China »Wednesday 23rd November 2011 |
New technology for electron microanalysis »Tuesday 22nd November 2011 | Air Products Settles Spanish Tax Audit »Tuesday 22nd November 2011 |
ChipMOS subsidiary ThaiLin enters a new testing service agreement »Tuesday 22nd November 2011 | FSI Receives Follow-On Order for ORION »Sunday 20th November 2011 |
Hynix Renews Tessera License »Sunday 20th November 2011 | Precision Mechatronics acquires Surfx Technologies »Sunday 20th November 2011 |
Analog Devices End of Year 2011 Show Revenue Up 8% »Sunday 20th November 2011 | TowerJazz Targets India’s Emerging Semiconductor Market »Friday 18th November 2011 |
Intel enters Teraflop era »Wednesday 16th November 2011 | Novellus introduces sub-22nm ceramic hard mask materials »Friday 11th November 2011 |
SSE reaches the Summit with equity investment »Friday 11th November 2011 | InnoLas and Advanced Optical collaborate on laser product line »Thursday 10th November 2011 |
Plasma-Therm welcomes order for VERSALINE system »Thursday 10th November 2011 | Meyer Burger halts Roth and Rau takeover »Wednesday 9th November 2011 |
Intel Senior Fellow to be Keynote Speaker at CS Europe Conference »Monday 7th November 2011 | EUV symposium update »Tuesday 1st November 2011 |
SPTS Appoints Henry R. Nothhaft to the Board »Tuesday 1st November 2011 | X-FAB Extends 0.18 Micrometer Technology Platform »Monday 31st October 2011 |
Micron ranks first in patent industry scorecard »Sunday 30th October 2011 | Pressure sensors to become top MEMS device by 2014 »Sunday 30th October 2011 |
