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| Agreement signed to commercialize image sensors for wafer-level CSP Oki Electric Industry Co., Ltd. and ZyCube Co., Ltd. have announced an agreement to cooperate in commercializing ZyCSP, an image sensor LSI with buried interconnects (also called TSV (Through Silicon Via)) that is equivalent in size to a wafer level chip size package(CSP).  | |
| Silicon Valley solar secures agreement with German photovoltaic manufacturer Silicon Valley Solar announced that they have finalized an agreement with GSS (Gebäude-Solarsysteme) to produce Sol-XTM Flat-Plate Concentrator Modules at their Fully Certified Facility in Eastern Germany. | |
| MEMS devices make major game players for consumer integration The MEMS Industry Group (MIG), a trade association representing the microelectromechanical systems (MEMS) and microstructures industries, has released an annual industry report. |  |
| TI reports profits increase but reduces workforce Texas Instruments (TI) has reported recorded record revenues and increased profits but express fears of weaker demand leading to a reduction of 500 staff by closing an older fab in their home Dallas base with a suggestion that development will move to Asia to be closer to foundry partners. | |
| Veeco AFM patent affirmed in European patent opposition Veeco Instruments Inc. has announced that the European Patent Office in Munich, Germany has ruled in its favour and has dismissed the opposition filed by Asylum Research Inc. against Veeco's European Patent No. 839,312 (the '312 patent). | |
| Blaze DFM qualified by STARC for 65nm leakage power optimization Blaze DFM has been chosen by the semiconductor Technology Academic Research Centre (STARC) to provide leakage power optimization software that will be integrated into the STARCAD-CEL (Certified Engineering Linkage, one step ahead of DFM) reference design methodology. | |
| Collaboration announced to promote real-time data systems for Chinese market Hertzler Systems Inc., and TechMax have announced an agreement to jointly deliver real-time data systems to the Chinese market. | |
| Renesas Technology and Key Stream to collaborate on wireless LAN solutions Renesas Technology Corp. has announced an agreement to invest in Key Stream Corporation, a provider of wireless LAN chipsets, and to collaborate in the field of wireless LAN solutions. | |
| Sun and Intel announce landmark agreement Sun Microsystems, Inc. and Intel Corporation have announced a broad strategic alliance centred on Intel's endorsement of the Solaris* Operating System (OS) and Sun's commitment to deliver a comprehensive family of enterprise and telecommunications servers and workstations based on Intel Xeon processors. | |
| ONFI accelerates time-to-market for NAND-based products The Open NAND Flash Interface (ONFI) Working Group, an organization dedicated to simplifying integration of NAND Flash memory into consumer electronics (CE) devices, computing platforms and industrial systems, has announced the availability of the ONFI 1.0 specification. The chip-level standard interface simplifies Flash controller design, which facilitates the integration of a wide range of NAND Flash components into diverse end-use applications. | |
| Hoku and SANYO enter major polysilicon supply contract Hoku Materials, a division of Hoku Scientific, Inc. has announced the signing of a definitive contract with Sanyo Electric Company, Ltd., for the sale and delivery of polysilicon to SANYO over a seven-year period beginning in January 2009. | |
| Blaze DFM opens San Diego development and support centre Blaze DFM, Inc has announced the opening of a development and support centre in San Diego, California. | |
| Berkeley Design Automation opens subsidiary in Japan Berkeley Design Automation Inc has announced it has established a wholly-owned subsidiary, Berkeley Design Automation KK (BDA KK), in Japan. BDA KK will provide direct sales and technical support to better serve the company's rapidly expanding Japanese customer base. | |
| Rudolph reaches milestone 50th Installation at Korean memory manufacturer Rudolph Technologies, Inc. has announced a milestone 50th installation at a large Korean memory manufacturer for its AXi 930 Advanced Macro Defect Inspection System. | |
| Praxair to supply New SMIC wafer plant in Shanghai Praxair China and semiconductor Manufacturing International Corp. (SMIC) have signed a contract for Praxair to supply industrial gases to SMIC's new FAB 8 facility in Shanghai, China. | |
| Cabot Microelectronics and DuPont Air Products in patent infringement dispute Cabot Microelectronics Corporation announced that it filed a legal action against DuPont Air Products NanoMaterials LLC (DA Nano) for DA Nano's manufacture and marketing of certain CMP slurries that infringe patents owned by Cabot Microelectronics. | |
| SoftJin establishes off-shore development centre in India SoftJin and Cswitch Corporation announced the companies are setting up of an Off-Shore Development Centre (ODC) in India to focus on developing customized EDA tools for customers and for in-house use of Cswitch. | |
| Fabless suppliers captured 20% of worldwide IC market in 2006 According to data in IC Insights¹ 2007 edition of The McClean Report, A Complete Analysis and Forecast of the Integrated Circuit Industry, fabless IC suppliers secured 20% of worldwide IC sales in 2006, an increase from just under 10% of the total IC market in 2000. | |
| Record figures for European company in 2006 may indicate a prosperous 2007 The SEZ Group has reported another record year of sales and order figures for the business year 2006. Order intake increased by 39.3 percent to 407.7 million Swiss Francs (CHF) and surpassed CHF 400 million for the first time. | |
| Rite Track announces Expansion plans with TEL Rite Track has announced the completion of an expansion of agreement with Tokyo Electron Limited (TEL). | |
| Ovonyx and Qimonda sign technology licensing agreement Ovonyx, Inc. and Qimonda have announced that they have entered into a long-term cross license agreement for discrete memory products using Ovonyx' and Qimonda's patents and intellectual property relating to Phase Change Random Access Memory (PCRAM) technology. | |
| HP claims nano improvement for gate arrays HP has unveiled research that could lead to the creation of field programmable gate arrays (FPGAs) up to eight times denser – while using less energy for a given computation – than those currently produced. | |
| Renesas Technology and Powerchip Semiconductor to launch joint venture Renesas Technology and Powerchip semiconductor have announced agreement to establish a joint venture that will specialize in the design of advanced memory devices. | |
| NXP Semiconductors will not renew Crolles2 Alliance contract NXP semiconductors has announced it shall not extend its current cooperation in the Crolles2 Alliance beyond the initial term expiring at the end of 2007. | |
| NXP and TSMC strengthen R&D and manufacturing partnership NXP semiconductor, founded by Philips, and Taiwan semiconductor Manufacturing Company Limited (TSMC) have announced they will strengthen their cooperation to include advanced R&D in CMOS process technologies as well as manufacturing partnership. | |
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