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It only takes two minutes and you can keep up with the latest news and events in the semiconductor industry.
| Boeing prepares European-built fuel cell demonstrator airplane In an effort to develop environmentally progressive technologies for aerospace applications, Boeing researchers and industry partners throughout Europe plan to conduct experimental flight tests this year of a manned airplane powered only by a fuel cell and lightweight batteries.  |  |
| Plans for new GaAs wafer fabrication facility in China announced Anadigics Inc. has announced that it has entered into an Investment Contract with the Kunshan New and Hi-Tech Industrial Development Zone (KSND), to jointly construct a new state-of-the art 6" gallium arsenide (GaAs) integrated circuit (IC) wafer fabrication facility. | |
| Integration success for Vistec and TOOL Vistec semiconductor Systems and TOOL Corporation have announced the integration of Vistec's SEM-based CD measurement system LWM9000 SEM and TOOL's layout visualization platform LAVIS. | |
| TSMC schedules 45nm production for September Taiwan semiconductor Manufacturing Company has announced that it would complete 45nm technology qualification and enter production as early as September 2007. | |
| Name change reflects new focus on nanometrology systems PSIA, Inc has announced its name change to Park Systems Corporation. | |
| European agreement will accelerate system-level MEMS development A deal with SoftMEMS has been agreed which will enable EDA Solutions to offer a system-level MEMS environment that will accelerate development. | |
| First MEMS based CO2 gas sensor module AMS Technologies has announced the availability of a groundbreaking new technology for CO2 detection, the SensorChip-CO2-4P from ICx Photonics, formerly ICx Ion Optics. | |
| New record in trench depths achieved with Applied’s latest etch system Applied Materials, has announced a significant leap forward in deep trench etch nanomanufacturing technology with its new Applied Centura Mariana Trench Etch system. | |
| Silicon and MEMS solution vendors face challenges in timing device industry Vendors of solutions based on silicon and micro electro-mechanical systems (MEMS) face an uphill battle to make a dent in the huge market for timing devices, according to a recent study from ABI Research. | |
| IC Interconnect and JCAP China form intercontinental alliance IC Interconnect (ICI has announced an agreement with Jiangyin Changdian Advanced Packaging (JCAP) | |
| ARC signs $15M multiyear license with major consumer electronics company ARC International has announced that one of the largest consumer electronics companies has taken a multiyear license valued at $15 million (USD) for ARC's patented configurable processors. | |
| Funding available for SMART ideas NAMTEC (the National Metals Technology Centre) is looking to help manufacturers access awards of up to £5,000 for the development of ‘Smart' materials. ‘Smart' materials are those that sense and adapt to stimulus in the environment and NAMTEC is part of a consortium that is promoting the investment into research & development for these types of materials, surfaces and structures. | |
| ASML announces the Henk Bodt ASML-TU/e scholarship fund ASML Holding (ASML) has announced a scholarship fund set up as a tribute to Henk Bodt, who retires after 12 years as Chairman of the ASML Supervisory Board. | |
| Sales of semiconductors dip in February In the context of worldwide semiconductor sales declining in February, the European market looks relatively less impacted than the market in the other Regions, although decreasing 4.4% over January. | |
| February chip sales decline by 6.5 percent from January Worldwide sales of semiconductors of $20.09 billion in February were 6.5 percent lower than January when sales were $21.48 billion, the semiconductor Industry Association (SIA) reported. | |
| Renesas Technology and ZMD to collaborate on 900 MHz band ZigBee chipset Renesas Technology Corp. and ZMD have announced a joint development agreement enabling Renesas to incorporate ZMD's RF technology into Renesas microcontrollers (MCU) to develop a 900-MHz band ZigBee chipset. | |
| Vishay completes acquisition of power control business from International Rectifier Vishay Intertechnology has announced that it completed the acquisition of the Power Control Systems business (selected discrete semiconductor and module product lines) from International Rectifier. | |
| Avago Technologies acquires fiber business from Infineon Infineon Technologies and Avago Technologies have entered into a definitive agreement, under which Avago will acquire Infineon's Polymer Optical Fiber (POF) business, based in Regensburg, Germany. | |
| Laser processing tool integration to bolsters photovoltaic manufacturing Manz Automation and Synova have announced an exclusive technology licensing agreement. | |
| Applied Materials completes acquisition of Brooks Software Applied Materials, Inc. has announced that it has completed its acquisition of the assets and business of Brooks Software, a division of Brooks Automation, Inc. | |
| Software platforms and development environments planned with acquisition ARC International has announced that it has acquired the key assets of Teja Technologies, Inc. | |
| ZMD goes fabless as X-FAB acquires ZFOUNDRY X-FAB semiconductor Foundries and ZMD have agreed that X-FAB will take over ZFOUNDRY (ZMD Analogue Mixed Signal Services & Co.), the wafer production facilities of ZMD, located in Dresden, effective immediately. | |
| Ramp in thin film solar cell is benefiting equipment suppliers As the solar cell industry moves toward thin film technology because of a severe shortage of polysilicon, there will be a ramp in commercial production equipment, according to a report Opportunities in The Solar Cell Market For Thin Film Technology, recently published by The Information Network. | |
| RVSI announces new site relocation in Singapore RVSI Inspection LLC has announced that it is expanding its Singapore office by relocating to a new location closer to its customers. | |
| Nanometrics’ photoluminescence system installed in Euopean R&D facilities Nanometrics Incorporated has announced the successful installation of its recently introduced VerteX photoluminescence mapping system at the Philips Electronics Microsystems Plaza (MiPlaza) R&D Facilities located on the High Tech Campus in Eindhoven, Netherlands. | |
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As mentioned in previous blogs, design enablement is a key enabler to fabless semiconductor design and manufacture, without question. The purpose of this blog (in 500 words) is to compare and contrast two very different design enablement strategies and engage the semiconductor community in a meaningful discussion.
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