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Avanex divests optoelectronic fabs in France Avanex Corporation has announced that it entered into a definitive agreement to sell a 90 percent interest in its French subsidiary, Avanex France S.A, including its Indium Phosphide (InP) and Gallium Arsenide (GaAs) semiconductor fabs to Global Research Company, a société à responsibilité limitée.
Isonics Corporation regains compliance with Nasdaq for continued listing Isonics Corporation announced that it has received notification from the Nasdaq Hearings department that it has regained compliance with the market price requirements for continued listing on the Nasdaq Capital Market. The hearing originally scheduled for March 1, 2007, with the Nasdaq Hearings department has been cancelled.
Solar for silicon in the valley Applied Materials, Inc announced its expanded agreement to purchase 8,220,000 kilowatt-hours (kWh) of clean renewable energy annually from wind and solar generation sources in California in lieu of energy from nonrenewable sources.
Intel announces investment in Rio Rancho, New Mexico site Intel Corporation has announced that it will invest $1 billion to $1.5 billion in its Rio Rancho site to retool Fab 11X for production on Intel's next generation 45 nanometre (nm) manufacturing process.
TAZMO and Silecs expand collaboration on wafer processing tools TAZMO Co., Ltd. and Silecs, Inc. announced that the companies have completed the installation of TAZMO's Spin Coating System at Silecs' new electronic materials production and demonstration facilities in Espoo, Finland.
Groundbreaking development project for biotechnologies Together with researchers from the Max Planck Institute for Biophysics in Frankfurt, the Nano Technology Systems Division of Carl Zeiss SMT has developed a transmission electron microscope for the high-resolution phase contrast imaging of biologic materials.
TSMC versus GlobalFoundries: Semiconductor Design Enablement!
As mentioned in previous blogs, design enablement is a key enabler to fabless semiconductor design and manufacture, without question. The purpose of this blog (in 500 words) is to compare and contrast two very different design enablement strategies and engage the semiconductor community in a meaningful discussion.