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| Discera selects Japanese distributor M-RF Discera, Inc and M-RF Co., Ltd., Japan, announced a partnership to distribute Discera’s CMOS MEMS Resonator-based timing products.  |  |
| Silicon Valley solar to supply Pacific Power Management with 10MW contract for solar modules Silicon Valley Solar announced that they have secured a 10MW purchase order for the company’s Sol-X2, internal concentrator solar modules. | |
| Promising new memory chip technology demonstrated by joint research team Scientists from IBM, Macronix and Qimonda announced joint research results that give a major boost to a new type of computer memory with the potential to be the successor to flash memory chips, which are widely used in computers and consumer electronics like digital cameras and portable music players. | |
| e2v is awarded UK Government funding to develop eco friendly power supply UK based e2v, has been awarded support funding to develop power converter technology that will be used to drive major efficiency improvements in electrical energy usage. | |
| UMC and Integrand Advance to enhance 90nm and 0.13 micron RFCMOS design Integrand Software, Inc., an EDA software company and UMC announced that their ongoing collaboration has resulted in new advances and enhanced capabilities for RF/mixed mode IC designers designing into 90nm and 0.13 micron nodes. | |
| Varun Kapur joins TPG Ventures to focus on Investments in India TPG Ventures (TPGV) announced that Varun Kapur, a prominent Asian private equity professionals and a former top executive at Intel Corporation's strategic investment unit, Intel Capital, will join the firm as a Partner effective February 2007. | |
| Co-sponsored report cites benefits of automation and ‘compliance architecture’ Despite stepped-up efforts, many manufacturers are throwing good money after bad in their attempts to comply with government product content regulations, according to a new study co-sponsored by Dassault Systčmes (DS) and its ENOVIA MatrixOne product brand. | |
| Nanometrics reports favourable Markman ruling in patent dispute Nanometrics Incorporated announced a favourable "Markman" decision by Judge Maxine Chesney of the United States Federal District Court for the Northern District of California in the patent infringement case initiated by Nova Measuring Instruments | |
| Littelfuse to move Teccor wafer fabrication to China Littelfuse, Inc. announced plans to transfer its semiconductor wafer manufacturing from Irving, Texas to Wuxi, China in a phased transition over the next three to four years. | |
| Entegris reaches milestone by surpassing 300th Aeronex System installation Entegris Inc. has reached an important industry milestone. The company recently surpassed its 300th Aeronex Gas Purification System installation.;; | |
| Elpida and PSC sign agreement to establish DRAM joint venture in Taiwan Elpida Memory, Inc. and Powerchip semiconductor Corp.(PSC) jointly announced that both parties will establish a new joint venture company to operate DRAM fabrication facilities in Central Taiwan Science Park with a total planned capacity of 240,000 12" wafers per month. | |
| UMC and integrand advance collaboration to enhance 90nm and 0.13µm RFCMOS Integrand Software, Inc., an EDA software company and UMC global foundry announced their ongoing collaboration has resulted in new advances and enhanced capabilities for RF/mixed mode IC designers designing into 90nm and 0.13µm nodes. | |
| Rohm and Haas Electronics plans $30 million R&D expansion at Chonan, Korea Rohm and Haas Electronic Materials, Microelectronic Technologies announced the completion of a $30 million expansion in their Chonan, Korea facility. | |
| M+W Zander return to failed site for Solar overhaul M+W Zander FE has been commissioned by the Conergy Group to plan and construct a fully integrated production facility for photovoltaic cells and modules in Frankfurt (Oder), Germany. | |
| UK engineering report reflects European trend New research of UK engineering academics and students reflects the growing European concern of a skills crisis growing for locally trained engineers across Europe. | |
| New state-of-the-art wafer bumping and backend processing facility in Malaysia Pac Tech has begun working on its new 53,512 square foot wafer bumping facility in Penang, Malaysia. | |
| Ultra Thin Mikrochips The Institute for Microelectronics Stuttgart (IMS CHIPS) has developed what they claim to be as, the worlds thinnest silicon chips in cooperation with the University of Stuttgart | |
| TranSwitch announces plans to acquire the ASIC design centre of data JCE, Ltd. TranSwitch Corporation, announced that it has entered into a definitive agreement to acquire substantially all of the assets of the ASIC Design Centre division of Data JCE, Ltd., Israeli electronic components distribution company. | |
| $1M gift establishes endowment for case materials characterization laboratory A $1 million grant from the Fred A. Lennon Charitable Trust means a new name and a lot more resources for a nationally renowned materials characterization facility at the Case School of Engineering. | |
| Crown teams up with QinetiQ to resolve RFID challenge QinetiQ and Crown Holdings, Inc. have launched a joint development programme to adapt QinetiQ's Omni-ID Pak integrated Radio Frequency Identification (RFID) technology for use on metal packaging. | |
| India’s chip design industry set to nearly quadruple by 2010 India’s Integrated Circuit (IC) design industry is booming, with market revenue expected to reach $2.1 billion by 2010, rising at a Compound Annual Growth Rate (CAGR) of 29 percent, up from $596 million in 2005, iSuppli Corp. predicts. | |
| ST Microelectronics unveils mass storage solution STMicroelectronics announced full availability of its entire NAND Flash memory family in 70nm process technology. | |
| TEL and ASML agree on long-term joint development Tokyo Electron Limited (TEL)and ASML Holding NV announced plans to jointly evaluate their most advanced tools and engage in long-term joint development programs. | |
| AMD delivers energy-efficient computing with 65nm technology transition Launching its next generation of energy-efficient computing, AMD announced transition to 65nm process technology with its Athlon 64 X2 dual-core desktop processors. | |
| Integration of multimedia and portable audio/media processors predicted to consolidate IC industry Functional integration in the portable media player and multimedia processor system-on-chip (SoC) markets will fundamentally change the value proposition for today’s integrated circuit (IC) vendors, according to Gartner, Inc. Research of System-on-Chip (SoC) Market | |
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