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Avanex divests optoelectronic fabs in France
Avanex Corporation has announced that it entered into a definitive agreement to sell a 90 percent interest in its French subsidiary, Avanex France S.A, including its Indium Phosphide (InP) and Gallium Arsenide (GaAs) semiconductor fabs to Global Research Company, a société à responsibilité limitée.
Isonics Corporation regains compliance with Nasdaq for continued listing
Isonics Corporation announced that it has received notification from the Nasdaq Hearings department that it has regained compliance with the market price requirements for continued listing on the Nasdaq Capital Market. The hearing originally scheduled for March 1, 2007, with the Nasdaq Hearings department has been cancelled.

Agilent Technologies expands investment in device modelling with new China R&D centre
Agilent Technologies Inc. has announced plans to expand the company's investment in its Integrated Circuit Characterization and Analysis Program (IC-CAP) device modelling software.
Scientists discover nanostructures on butterfly wings exhibit chemical sensing capabilities
GE Global Research has announced scientists have discovered that the nanostructures on the wing scales of butterflies exhibit high-performance optical properties that facilitate a selective detection of vapours.
Cypress announces sale of automotive image sensor business to Sensata Technologies
Cypress semiconductor Corp. has announced that it has entered into a definitive agreement to sell its SMaL Camera Technologies, Inc. subsidiary to Sensata Technologies, Inc. The transaction is expected to close later this quarter.
300mm semiconductor processing tools reached 82% of front-end equipment in 2006
Competitive spending by semiconductor manufacturers on copper and 300mm programs resulted in growth of 300mm front-end equipment reaching 82% of all front-end equipment in 2006, according to the recently published 300mm/Copper/Low-K Convergence report by The Information Network.

Carl Zeiss SMT announces request for large mask repair system order
Carl Zeiss SMT has announced the receipt of further orders for its MeRiT mask repair systems from global leaders in the field of chip and photomask fabrication in the first quarter of 2007.
Nikon ships first 45 nm production immersion scanner
Nikon Corporation has shipped its first immersion lithography system capable of 45 nm production.
German company orders AIXTRON Tricent ALD and AVD modules
AIXTRON AG has announce the receipt of an order for two Tricent deposition modules by the Forschungszentrum Juelich in Germany in the fourth quarter of 2006.
Nikon, CEA-Leti announce partnership for double patterning and exposure technology
Nikon Corporation announced a Joint Development Program with CEA-Leti.

Cypress Semiconductor selects Camstar's InSite for ‘factory of the future’
Camstar Systems, Inc. announced that Cypress semiconductor Corporation has selected Camstar's InSite for its conventional and autoline facilities in Cavite, Philippines.
Dialog Semiconductor strengthens R&D with new design centre in Edinburgh
Dialog semiconductor Plc has announced it has started recruiting for a major new research and design (R&D) centre in Edinburgh, Scotland.
Solar for silicon in the valley
Applied Materials, Inc announced its expanded agreement to purchase 8,220,000 kilowatt-hours (kWh) of clean renewable energy annually from wind and solar generation sources in California in lieu of energy from nonrenewable sources.
Synova to license Laser MicroJet Technology to end users and equipment manufacturers
Synova has unfolded a strategic business model allowing select partners to license its proprietary Laser MicroJet technology.

First results of ALEGRA NanoFutur project unveil AMO Graphene Transistors
In the scope of project-ALEGRA" the AMO nanoelectronics group of Dr. Max Lemme was able to manufacture top-gated transistor-like field-effect devices from monolayer graphene.
Pixer Technology receives order from major DRAM flash manufacturer
Pixer Technology Ltd. (Pixer) announced the sale of a CDC101 system to a major DRAM Flash Manufacturer in Asia-Pacific.
Cymer to ship First XLR 500i laser light source to Nikon
Cymer, Inc. has announced it has reached an agreement to ship its first revolutionary XLR 500i light source, to lithography system provider--Nikon Corporation.
Intel announces investment in Rio Rancho, New Mexico site
Intel Corporation has announced that it will invest $1 billion to $1.5 billion in its Rio Rancho site to retool Fab 11X for production on Intel's next generation 45 nanometre (nm) manufacturing process.

TAZMO and Silecs expand collaboration on wafer processing tools
TAZMO Co., Ltd. and Silecs, Inc. announced that the companies have completed the installation of TAZMO's Spin Coating System at Silecs' new electronic materials production and demonstration facilities in Espoo, Finland.
Sumitomo Electric reaches milestone of 10 million laser diodes shipped
Sumitomo Electric Industries, Ltd. (SEI) has announced it has now shipped more than 10 million semiconductor laser diodes (LD) for the optical fiber communication applications since its first shipment in 1991.
Aquest raises $20 million in second venture round
Aquest Systems has announced it has raised $20 million in its second round of venture financing.
Freescale selects Cabot Microelectronics’ CMP polishing pad
Cabot Microelectronics Corporation has announced that Freescale semiconductor has selected the Epic D100 CMP polishing pad for use in its manufacturing process
Chartered extends technology development agreement with IBM to 32nm
Chartered semiconductor Manufacturing has announced the extension of its joint development efforts with IBM to include 32-nanometer (nm) bulk complementary metal oxide semiconductor (CMOS) technology. Financial terms were not disclosed.
Groundbreaking development project for biotechnologies
Together with researchers from the Max Planck Institute for Biophysics in Frankfurt, the Nano Technology Systems Division of Carl Zeiss SMT has developed a transmission electron microscope for the high-resolution phase contrast imaging of biologic materials.
Cypress announces UMC as one of its primary foundry partners
Cypress semiconductor Corp. has announced the addition of UMC as one of its primary foundry partners.



TSMC versus GlobalFoundries: Semiconductor Design Enablement!

As mentioned in previous blogs, design enablement is a key enabler to fabless semiconductor design and manufacture, without question. The purpose of this blog (in 500 words) is to compare and contrast two very different design enablement strategies and engage the semiconductor community in a meaningful discussion.
*****Diamond slims down*****Advanced Diamond
Technologies discuss the advances*****
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