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It only takes two minutes and you can keep up with the latest news and events in the semiconductor industry.
| Cadence announces restructuring programme At least 625 full time positions are expected to be eliminated while the company hopes to achieve annual operating expense savings of at least $150 million.  | |
| University orders shower head Ohio State University orders AIXTRON system for solar cell development. | |
| FOA opens group purchasing contracts The association opens group purchasing organisation to all members. | |
| Honeywell files lawsuit against Datalogic The complaint has been filed to protect intellectual property. | |
| ANADIGICS announces cost reduction The cost reduction includes the loss of about 100 jobs worldwide. | |
| Freescale and Samsung Electronics collaborate Both companies announce collaboration on LED display technology. Freescale LED driver ICs complement Samsung’s advanced LED backlighting technology. | |
| Future Horizons sets up start up assistance Starting a new business in the electronics industry is tough enough in itself, with professional research reports and industry experts' advice tipping even the wealthiest start up’s budget; add to this the recent global economic downturn, and a near-term outlook is starting to look bleak. | |
| Gartner predicts at least $25 Billion overall loss for industry The economic crisis is having a significant impact on the semiconductor industry, as worldwide semiconductor revenue growth in 2009 is expected to be 1 percent, down by approximately 7 percentage points from previous estimates, according to preliminary estimates from Gartner, Inc. | |
| TSMC adds high voltage features to 0.13 processes TSMC has enhanced its 0.13um process technology with immediate availability of a 1.5/6/32V technology, targeted at high resolution mobile handset display drivers. | |
| Renesas and NXP announce contactless licensing agreement NXP and Renesas Technology have announced that they have expanded the licensing agreement on NXP’s MIFARE technology. This agreement is aiming to build momentum for the availability of advanced payment and Near Field Communication (NFC) offerings in contactless infrastructures. | |
| Fujitsu to Acquire Siemens's Stake in Fujitsu Siemens Fujitsu Limited and Siemens AG announced that Fujitsu will acquire Siemens's 50% share in their joint venture Fujitsu Siemens Computers (Holding) B.V., effective April 1, 2009 subject to the approval of relevant government agencies. | |
| Entegris sheds USA jobs in light of results semiconductor equipment maker Entegris announced that it will close down one of its USA manufacturing sites and warehouses. Although the company had always planned to reduce USA manufacturing, with 75% of their business outside the USA, the timing of the announcement is more to do with losses announced a $411.4 million loss for the third quarter. | |
| FSI enter the single wafer cleaning market FSI International has finally entered the single wafer cleaning market with an innovative closed-chamber design that is targeted firmly at the FEOL below 32nm node of manufacturing enabling critical path cleaning capabilities for ultra shallow junctions, high-k/metal gates and metal capping layers at 32nm and below. The new tool has the added bonus of BEOL capability with the obvious goal to take market share in this growing arena. | |
| New sputtering order extends research efforts Surrey NanoSystems will be extending the possibilities of research into thin film deposition following a sputtering tool order from the Low Dimensional Systems Laboratory of Romania's National Institute of Materials Physics (NIMP) in Magurele. | |
| Presto and SEMICAPS announce OEM Relationship Presto Engineering., a provider of engineering services to the semiconductor industry, has announced the establishment of an OEM relationship with SEMICAPS, a supplier of semiconductor failure analysis systems. | |
| IMEC and Semilab collaborate on metrology IMEC to collaborate with Semilab on metrology for nano-electronic and photovoltaic process control BUDAPEST, Hungary. - October 30, 2008 | |
| Replisaurus secures funding for clean tech Replisaurus has secured significant financing that puts the company in a strong position at this time of financial confusion as it begins to commercialize its new, clean metallization technology for the chip packaging market. | |
| Microchip and ON disappointed with Atmel ON semiconductor and Microchip respond to Atmel board rejection. | |
| Concept Engineering and EVE sign partnership agreement EVE customers offered free use of Concept Engineering’s graphical engine; integration between tools planned. | |
| Will there be blood on the chip market road ahead? “The chip industry marches on, but not for much longer,” comments Future Horizons’ Malcolm Penn. | |
| AMD appoints former HP exec Alberto Bozzo to head EMEA region The industry veteran brings more than 20 years of commercial and consumer PC experience. | |
| AIXTRON on track for 2008 targets Full Year guidance confirmed, compound common platform systems dominate demand, continued silicon weakness in line with market conditions. | |
| September semiconductor sales up 1.6% Y-o-Y Sales up 4% in first nine months of 2008, says SIA. | |
| Fraunhofer opens centre for organic materials and electronic devices Federal Minister Annette Schavan and Premier Stanislaw Tillich honour the significance of organic light emitting diodes as the illumination technology of the future. | |
| IMEC calls for true European collaborations True join collaboration across European borders is becoming increasingly important to remain competitive and able to face global challenges. | |
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As mentioned in previous blogs, design enablement is a key enabler to fabless semiconductor design and manufacture, without question. The purpose of this blog (in 500 words) is to compare and contrast two very different design enablement strategies and engage the semiconductor community in a meaningful discussion.
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