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Founded in 1980, EV Group (EVG) is a global supplier of wafer bonders, aligners, thin-wafer-, temporary bonding and debonding-equipment, photoresist coaters, cleaners and inspection systems for semiconductor, MEMS and emerging nanotechnology markets. EV Group holds the dominant share of the market for wafer bonding and debonding equipment and is a leader in lithography for advanced packaging, MEMS and Nanoimprint Lithography (NIL). Our standard equipment and technological expertise enable our customers to develop and successfully commercialize their innovations by providing advanced and proven process solutions from R&D to high volume production. In 2006 EVG celebrated its 25 company anniversary and 15 years of MEMS equipment leadership in high volume production applications.
The company's unique Triple I approach (Invent - Innovate - Implement) is supported by a vertical infrastructure, allowing EV Group to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. Headquartered in St. Florian, Austria, EVG operates via a global customer support network, with subsidiaries in Tempe, Arizona; Albany, New York; Yokohama and Fukuoka, Japan; and Chung-Li, Taiwan. For more information, visit www.EVGroup.com and our EVG-TShop “Click, Stop – the new way to shop” www.EVGTShop.com cleaners and etchers.
Please direct all enquiries regarding sponsorship of the EuroAsia IC Global Awards to jc@angelbcl.co.uk
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The SEZ Group is the pioneer and leading provider of single-wafer wet-clean processing solutions for the semiconductor industry, with an installed base of over 1,200 tools. The company maintains operations in Asia-Pacific, Europe, Japan and North America. Since 1996, registered shares of SEZ Holding Ltd. have been traded on the SWX Swiss Exchange under the symbol SEZN.
The company’s product portfolio includes flexible, best-of-breed, low cost-of-ownership (CoO), single-wafer platforms for back-end-of-line (BEOL)—and now front-end-of-line (FEOL)—cleaning, etching and stripping utilizing a variety of chemistries that allows customers to operate in zero-particle environments at 45 nm and below.
Developed through close collaboration with customers and chemistry suppliers, SEZ’s technology portfolio provides fully synergistic solutions ready to meet the challenges associated with smaller device nodes. The company’s two-pronged corporate strategy: 1) remain focused on the roadmap to offer complete, fab-wide, single-wafer solutions; and 2) drive the need for better factory designs in the equipment sector. Coupled with this strategy is SEZ’s “Right Time, Right Technology” philosophy, which formed the development foundation for its highly successful Da VinciTM Series for BEOL polymer removal.
The Da Vinci’s introduction revolutionized the cleaning industry by providing a single-wafer wet technology platform precisely when the industry hit critical limits with batch cleaning solutions, and SEZ aims to do the same with the newly introduced EsantiTM platform developed to address critical FEOL cleans.
Additional information about the company is available on the Internet at www.sez.com.
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EuroAsia Semiconductor has established itself over its 25 year history as the only monthly magazine focusing exclusively on equipment and materials for the microelectronics production industry in Europe and Asia. Core editorial coverage includes equipment and materials technology for the manufacturing and processing of semiconductor wafers into integrated circuits (including IC design).
http://www.euroasiasemiconductor.com |
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MicroNanoSystems is a global bi-monthly magazine for the micro and nano
marketplace. It has a circulation of over 45,000 and is a sister publication
to market leading EuroAsia Semiconductor.
MicroNanoSystemshas evolved from MEMS Manufacturing Magazine.
An extensive comprehensive 18 month study gave clear direction on audience
information needs.
The role of MicroNanoSystems is to deliver information on the implications
of world-wide developments in micro and nano technologies. In addition special
attention will be given to the integration of these technologies in complex, legacy
systems.
Engineered to educate along the food chain
Bridging the gap between R&D and Industry
Defining the Products, Process, Integration, Recruitment & Training issues
Worldwide reach - the only title with a truly global circulation
From the publishers of the globally recognised EuroAsia Semiconductor brand
http://www.micronanosystems.info |
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