STS ASE® Process using high rate Pegasus Source
Surface Technology Systems plc

The Advanced Silicon Etch (ASE®) Process from STS has been the market-leading technology for deep reactive ion etch (DRIE) of silicon, ever since the original "Bosch Process" was patented and licensed to STS in 1994. It is a dry plasma etch process which offers anisotropic, high aspect ratio etching of silicon without the need for cryogenics.

This process works by the use of repeated cycles of passivation and etch. In each passivation step a precursor gas is utilised that when subjected to the plasma results in a polymer layer being deposited on the wafer. In the first part of the following etch step, ions accelerated towards the wafer preferentially remove the polymer from the base of features. In the remainder of the etch step neutral fluorine radicals react with the exposed silicon at the base of the features, isotropically etching the material.

The ASE® Process has been successfully adopted for silicon micromachining for Micro Electro-Mechanical Systems (MEMS), and has also been applied to other applications such as microfluidics, through-wafer via interconnects for wafer-stacking, and a range of nanotechnology areas.

Over the years, continuous research and development activities at STS have resulted in significant improvements in silicon etch rates and other important process characteristics, compared to the original "Bosch" technology. Most recently a new plasma source design, incorporated into STS\' Pegasus system has significantly increased the maximum etch rates (>50µm/min for 1% exposed area) while also improving uniformity and mask selectivity by over 30% compared to existing de-coupled DRIE plasma sources. The increased etch rate and improved uniformity lead to higher throughput and device yield, meaning increased productivity for device manufacturers.

The unique design of Pegasus leads to a more uniform plasma at the wafer surface resulting in improved across-wafer uniformity for both etch rate and critical dimension control. Pegasus also includes a range of software and hardware features that provide further advances in the ASE® process capability, such as reduced feature sidewall roughness and improved profile control while maintaining high etch rates. As standard, Pegasus incorporates STS' patented Parameter Ramping and Silicon on Insulator (SOI) technologies developed for their ASE® process, which allows high aspect ratio micromachining and etching to an insulating layer without notching at the interface.

The Pegasus system has been optimised for reliability and ease of maintenance by adopting a modular design concept that also results in a reduced footprint and improved accessibility. The combination of all of these features ensures a high performing, low cost of ownership solution to meet the highest industry expectation. The system is fully compatible with any of STS' modular platform configurations, from single wafer load-lock to full production cluster systems, enabling a smooth transition from research and development right through to volume production.

The new Pegasus system significantly enhances the process capabilities of the ASE® Process, compared to other DRIE systems currently on the market. This process is a truly enabling technology for device manufacturers, particularly within MEMS and Packaging applications.

STS is committed to continuing to work closely with their customers to further improve the DRIE capabilities of the ASE Process in line with their requirements, and facilitate the continued commercial success of MEMS manufacturing and other areas of the semiconductor industry who can benefit from this technology.

http://www.stsystems.com


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Pall Corporation Microelectronics Group has a PTFE-based filter for high-flow, high-purity, bulk gas delivery systems. The high-flow Emflon filters enable users to shrink the footprint of their filter systems, resulting in lower capital and operational costs.

Pall designed the high-flow Emflon filter for use in the newest generation of display and semiconductor manufacturing facilities, which have a need to filter bulk nitrogen and clean dry air (CDA) at flow rates in excess of 1,700 normal cubic meters per hour (Nm3/h) 1,000 standard cubic feet per minute (SCFM). These high flow rates are required in the manufacture of large-area displays, such as those produced by seventh- and eight-generation display production facilities. The high flow rates also are required in the latest generation of semiconductor production facilities, which use 300mm wafer substrates.

High-flow Emflon filter systems allow manufacturers to use smaller filter housings, saving fab space. A customer will realize an average savings of greater than 20% on system installation and greater than 50% on system maintenance.


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For engineers and scientists working on current and future semiconductor process technologies, the E5270B provides a solution that both meets their needs and lowers their cost of test. The wide variety of available modules and advanced measurement features provide a complete solution for parametric measurement and analysis. Both a VXIplug&play driver and TIS commands are provided as programming aids for customers who choose to use their own software instead of software provided by Agilent Unlike solutions that include both the system controller and measurement resources combined, the E5270B gives you the freedom to manage these resources separately, thereby avoiding the expensive problem of the system controller becoming obsolete years before other elements. The E5270B can be controlled from MS Windows-based, UNIX-based, or even LINUX-based operating system environments. Because you can upgrade your system controller hardware or software without losing the use of your instrument, your investment is protected against unforeseeable technology shifts.

- Ultra low current measurement without cumbersome external preamplifiers.
The E5270B HRSMU supplies 1-femtoamp measurement resolution without the need for cumbersome external preamplifiers, providing an extremely efficient solution for situations not requiring ultra low current measurement. This innate capability enables you to meet the measurement challenges posed by the vast majority of current and future devices. The HRSMU (and redesigned MPSMU) also provides voltage measurement resolution down to 0.5 microvolts. The HRSMU (as well as the redesigned MPSMU) also supports new 0.5 V and 5 V measurement ranges, which improve measurement accuracy for modern lower-voltage transistors. Advanced measurement features include multi-channel sweep mode with parallel test capability, linear/binary search, range management, and force value self-monitoring.

-Flexibility to provide stable 100 attoamp measurements.
The HRSMU accepts an optional atto sense and switch unit (ASU), which increases the low current measurement resolution to 100 attoamps. This is invaluable for certain extreme characterization needs such as memory cell leakage testing. In addition, the ASU allows you to make voltage measurements and force both voltage and current up to the limits of the HRSMU specification.

- Switch between CV and IV measurement without wasting time swapping cables.
The ASU enables switching between 100 attoamp measurement and precise capacitance measurement without changing any cabling. The ASU includes two BNC inputs that are compatible with the outputs of a capacitance meter. Simple software commands enable you to switch between SMU based measurement (IV) and capacitance meter based measurement (CV) without having to change any cabling. You can also use the BNC inputs with other instruments such as a digital voltmeter (DVM) or a pulse generator unit (PGU). No matter what your configuration, the ASU provides better switching measurement performance than an external switching matrix, and offers improved ease of use.

- Cost-effective alternative that takes advantage of your own testing software Agilent provides an industry-standard VXIplug&play driver, a high-level programming interface that saves time by allowing your programmers to avoid having to learn the detailed programming of the instrument. In addition, the TIS -- test instruction set -- interface enables code developed for the lab environment to be used in production. Specifically, TIS allows you to write algorithms for subsequent transfer to the Agilent 4070 production test environment.

No embedded controller in the instrument; Manage your instrument measurement resources separately from your controller and software resources, einsuring that your test investment does not become obsolete too quickly. HRSMU has 1 femtoamp current measurement resolution; Can meet the measurement challenges posed by the vast majority of current and future devices, without the need for external preamplifiers.

HRSMU combines with optional atto sense and switch unit (ASU) to achieve 100 attoamp current measurement resolution; Stable 100 attoamp current resolution via remote sensing meets the most demanding ultra low current measurement requirements.

Switch between CV and IV measurements on positioners via software commands; No need to physically change cabling or move to a different probe station when changing from CV to IV measurement.

MPSMU and HRSMU can measure voltage with 0.5 microvolt resolution. Both SMUs also support new 0.5 V and 5 V measurement ranges. Enables you to perform very demanding component matching and metal line resistance voltage measurements with ease.

Includes industry-standard VXIplug&play driver Ideal when you choose to use your own software, instead of Agilent-provided software. Improves programmer productivity by removing the need to learn detailed programming of the instrument. TIS (Test Instruction Set) commands supported for both BASIC and C Develop algorithms on an instrument that you can then easily transport into your 4070 Series-based production test environment.

http://www.agilent.com


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BedeMetrix™ are non-destructive X-ray metrology tools for high-throughput semiconductor manufacturing processes at 90nm and below.

The tools deliver dramatic yield enhancement through the absolute measurement of material parameters and properties, such as thickness, strain, relaxation, density, porosity, composition, texture, roughness, phase, crystallinity, tilt in SOI. BedeMetrix™ gives process transfer from BedeMetrix™-L to fully automated production line quality control on the BedeMetrix™-F.

Enables semiconductor manufacturers to optimise their processes through better control of their material measurements. BedeMetrix™ measures layer thickness AND other important material properties through multiple layers - essential for ensuring high yields at sub-90nm technology nodes.

BedeMetrix™ combines all X-ray techniques - X-ray reflectivity (XRR), X-ray diffraction (XRD), High Resolution X-ray Diffraction (HRXRD) and X-ray Flourescence (XRF), which are configurable on one tool. This enables fast measurement capability in sub-100 micron test pads and scribe lines on product wafers.

The BedeMetrix™ gives an enhanced small spot, high throughput, non-destructive process.

http://www.bede.com


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Aerotech's ABRS series rotary air-bearing stages provide superior angular positioning, velocity stability, and error motion performance in an exceptionally low-profile package. The ABRS is designed to meet the exacting requirements of wafer inspection, high precision metrology, x-ray diffraction systems, optical inspection and fabrication, and MEMS/nanotechnology device fabrication.

The design of the ABRS series direct-drive rotary stage has been optimized to minimize stage height. The low profile of the stage reduces the effective working height of the system, minimizing "stack-up" related errors. In addition to the low overall height, the ABRS series provides a clear aperture that can be used for product feed-through, laser beam delivery, cable clearance, or application-specific requirements.

The ABRS design features large air-bearing surfaces for high stiffness and load capacity, producing not only excellent axial and radial error motions, but outstanding tilt error motion, as well. The resultant face error motion is significantly better than other rotary air-bearing tables and spindles, greatly benefiting applications requiring exceptional planar performance.

To maximize positioning performance, the ABRS series utilizes Aerotech's S-series slotless, brushless motor. The motor uses an advanced magnetic circuit design to produce high torque output with minimal heat generation. The slotless design is inherently zero cogging and torque-ripple free. This makes the ABRS stages ideal for applications requiring smooth scan velocities at low or high speeds.

An optical encoder is standard with the ABRS. When coupled with Aerotech's feedback multipliers and controls, resolutions of <0.03 arc second are achievable.

Custom versions of the ABRS are available for rate table and inertial guidance test-stand applications.

http://www.aerotech.com


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The WaferMax Z represents a significant breakthrough in vertical alignment of high-precision components in one compact package. Its superior noncontact linear motor drive employs a high-accuracy encoder for direct position feedback. When combined with Aerotech’s MXH multiplier, it offers 0.83 nm resolution in addition to high speed and accuracy.

Bearing elements are cross-roller style for maximum smoothness and reliability. These are mounted on an optimized base and wedge assembly for stiffness and low mass/inertia, enhancing dynamic performance.

All the critical elements of the WaferMax Z were selected to operate in a 24/7 industrial environment and, unlike screw- or piezo-based vertical stages, the WaferMax Z requires no maintenance and will ensure years of trouble-free operation.

To maximize positioning performance, the WaferMax Z utilizes Aerotech’s BLMUC-series brushless, slotless linear motor. This motor has all the advantages of a brushless direct-drive motor — no brushes to wear, no gear trains to maintain, and high acceleration and high speeds. Since it is a slotless, ironless design, there is zero cogging, meaning that there is absolutely no torque ripple. This makes the WaferMax Z ideal for contoured motion, smooth scan velocity, or precise incremental steps.

Performance is assured with a precision linear encoder that results in 0.8 nm resolution. The motor and high-performance linear encoder are directly coupled to increase accuracy.

Aerotech manufactures a wide range of servo amplifiers and advanced controllers to provide a complete, integrated package.

http://www.aerotech.com


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The demand for single-wafer wet-processing technology has expanded beyond the fab floor to a variety of new applications for back-end semiconductor packaging and assembly, where the need for a more flexible, cost-effective and higher-performing wet solution is escalating rapidly.

Semiconductor product wafers are customarily thinned via a substrate-etch process prior to dicing in order to aid the sawing operation, minimize the thickness of the final assembled package, and improve devices’ ability to dissipate heat by lowering the thermal resistance of the die. This is particularly crucial when dealing with advanced packaging technologies—e.g., chip-scale, multi-chip and wafer-level packaging, flip-chip, die/package stacking, and systems-in-package—in which space is at a premium, with die in extremely close proximity.

The primary technologies currently employed for post-grind substrate etching—dry (plasma) and CMP solutions—still induce mechanical damage to the substrate surface, proving destructive to the wafer and the die. Wet processing, however, does not incur such damage, due to the nature of isotropic etching and the different mix of chemistries employed. This leads to less breakage during the sawing operation and increased final packaged device yield. Moreover, SEZ’s wet spin-processing approach delivers a unique advantage for handling thin wafers—its non-contact Bernoulli handling allows safe transfer of even extremely thin wafers, which have a tendency to warp.

There is also an increased need for optimized under-bump metallization (UBM) etch, which, together with wafer bumping, has grown critical to optimizing packaging and assembly techniques such as flip-chip. UBM is the foundation upon which solder bumps are built. Typically, multiple layers of various, compatible metals are deposited and a thick photoresist is applied, followed by electroplating and photoresist stripping. The excess metal is then etched away, before bump reflow and completion. This etching step has moved beyond the scope of batch spray tools' capabilities, especially for 300-mm wafer bumping, while SEZ's single-wafer wet process has proved well suited to meet its increasingly stringent performance requirements.

SEZ’s core Spin Processor technology is suited for other bumping applications as well, including photoresist strip, incoming wafer cleaning, post-plasma chemical vapor deposition (CVD) cleaning, defluxing and bump post-cleans.

Its yield-optimizing capabilities geared toward assembly/packaging include:

• Superior processing quality, throughput and reliability;
• Complete processing flexibility with respect to handling, integration, wafer size, and choice and supply of chemistries; and
• Improved cost of ownership (CoO) through reduced equipment cost and optimized consumption of resources, i.e., chemicals and deionized water.

http://www.sez.com


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EPV100-AW: Absolute Pressure Control — maintains exceptional stability under the toughest fab conditions. Its integrated vacuum generator enables absolute pressure control, eliminating the effects of fluctuating atmospheric pressure. The N2 pilot valve control and patented balancing spool technology deliver a level of response, accuracy, and stability that conventional technology can’t match. The EPV100-AW’s differential pressure monitoring function enables customers to equalize chamber pressure with atmospheric pressure for safe opening of the process chamber.

Specifically designed to control chamber exhaust, the EPV100-AW stabilizes the process environment to enable highly uniform oxide film layers. This elegant, single-package design installs easily, requiring no upstream modifications. Fast response, wide pressure control range, superior reliability, and decreased resource consumption all add up to improved yield and reduced cost of ownership.

Typical Applications
Aera’s EPV100-AW Exhaust Pressure Controller benefits any sensitive, atmospheric pressure manufacturing process, but is especially suited for use with vertical atmospheric thermal oxidization (diffusion) furnaces. This enables diffusion processes to produce the ultra-thin, yet highly uniform oxide film layers that multi-level flash memory products require.

Differentiating Pressure Control Technology
N2 valve control and patented balancing spool technology enable the EPV100-AW to quickly compensate for pressure changes in the chamber and the exhaust duct. An onboard pressure sensor and control circuit form a closed-loop feedback system to control the main valve with outstanding precision. This design enables a wider pressure control range and produces better pressure stability than the conventional motor-drive approach.

Highly Uniform Oxide Layers
As gate oxide thicknesses diminish, stable chamber pressure is increasingly critical. Unstable process exhaust can damage uniformity significantly. AE’s exclusive technology enables a higher level of stability for more precise oxide layer control than conventional approaches.

Better Process Repeatability
EPV100-AW creates a stable process condition that is highly repeatable, chamber-to-chamber and run-to-run. Further, its absolute pressure control approach enables customers to run identical processes at different altitudes and under varying weather conditions.

The EPV100-AW enables diffusion processes to produce the ultra-thin, yet highly uniform oxide film layers that multi-level flash memory products require. AE’s exclusive technology enables a higher level of stability for more precise oxide layer control than conventional approaches.

Aera’s EPV100-AW Exhaust Pressure Controller offers lower operation costs, easier installation, and more precise, rapid exhaust pressure control than any device of its kind on the market today.

http://www.advanced-energy.com


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Silicon Mechanical Resonator
SiTime Corporation

SiTime offers a technology that is more reliable, smaller, and cost effective compared to traditional quartz oscillators. The MEMS First™ process technology will inevitably transform the timing market and free engineers and procurement teams to design and bring both new innovation and current products to market faster because of quick product delivery and availability due to the established silicon processing methods SiTime supports. For over 30 years countless MEMS experts and engineers have tried to integrate resonators and oscillators on silicon, only to fail. The key advantage for impact in society is the advantages of size, price which is 20%-30% lower than existing quartz solutions, and multi functionality (or frequency). What was hindered in electronic advancement in the past due to size can now be enabled due to integration and micro fabrication in areas such as Medicine, Aerospace, Automotive, and Consumer Electronics.

The MEMSFirst™ unique architecture overcomes the contamination issues that usually plague micro-mechanical resonators by fabricating them below the surface of the silicon wafer. This is made possible by its Epi Seal™ process that allows the MEMS structures to be placed in an evacuated, hermetic cavity that’s shielded from the outside environment. The high process temperatures regularly used in standard wafer processes in acts like a self cleaning oven that removes any and all contaminants that have plagued the silicon resonator solution for years past.

The resonator’s hermetic seal also provides enough mechanical protection to let the device be handled just like any other silicon component using conventional high volume packaging technologies. After standard dicing, the IC chips, with oscillators below the surface of the chip, can be packaged in standard plastic injected-molded IC packages. Today, one can locate quartz crystals on a circuit board by their visual appearance. SiTime resonators and oscillators look (and cost) just like any other silicon component.

In April of 2006, SiTime delivered the first samples of its SiRes ™ oscillator products which includes the SiT8002 and SiT1xxx oscillator families, to a handful of carefully-selected alpha customers for evaluation. SiTime is entering the market at an exciting time and is at the forefront in providing cost effective, reliable, and dependable Silicon MEMS First™ solutions to key players in the quartz and timing industry, which is continually expanding due to innovation, minituration, and integration. SiTime technology complements these driving factors by and as a result become the first MEMS fabless IC Company to give the age old quartz industry a run for their money.

While the company is only 18 months old, it is already being courted by multi-billion companies with large interests in quartz. SiTime is confident that it can have a major impact on, and significantly disrupt, the electronic timing industry, which consists of $3.1B+ in quartz crystals and $2B+ in IC timing chips associated with the quartz elements. In addition, the extreme miniaturization and cost improvements made possible by MEMS First™ will hugely impact industries such as wireless and microcontrollers.

The first quartz crystals were used in the 20’s and by the mid 40’s hundreds of quartz companies were formed to meet the rising demand for quartz based oscillator products. The Silicon MEMS oscillator solution has been in development for over 30 years. These industry changing technologies simmer for a long time in development, then when ready they rip through markets are tremendous speeds. SiTime will impact and reorganize the corporate landscape of a multi-billion dollar industry. SiTime has accomplished what researchers, like Kurt Petersen have devoted their lives to; the commercialization of MEMS oscillators. And, as they say -- It’s About Time.

http://www.sitime.com


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The SpectraFx 200 is designed to achieve cost-effective production control over advanced film processes at the 65nm node and below. Based on its spectroscopic ellipsometry (SE) technology, SpectraFx 200 leverages a new 150 SE option to enable qualification and monitoring of such advanced films as ultra-thin ONO layers, nitrided films, high-k and low-k dielectronics, amongst others.

At the 65-nm node, process tolerances are so small that within-die variation and airborne molecular contamination (AMC) can have a major impact on device performance. New types of materials are also being added that require new measurements parameters, such as composition and film stress. Traditional proxy measurements, which utilize blank pad structures, cannot detect these process variations at the die level, and are thus no longer enough to meet the requirements for production films control. SpectraFx 200 provides robust, non-destructive measurements that more accurately reflect process conditions at the die level, enabling chipmakers to achieve cost effective production films control for the 65nm node and beyond.

With KLA-Tenor’s DPM capability, SpectrFx 200 measures test structures composed of alternating metal dielectric arrays, which significantly improve correlation to within-die variations. These patterned structures generate complex diffraction spectra, which are then turned into accurate measurements using powerful onboard algrorithms. With its new 150 SE option, SpectaFx 200 enables measurement in the “vacuum UV” (150-nm wavelength) accurately monitor film thickness and composition variations on new materials such as high-k films. On nitrided films and hafnium silicate gates a two-fold improvement in repeatability and matching compared to 190-nm wavelength scatterometry-based systems is being claimed. The systems AccuFilm capability eliminates the effects of AMC. SpectraFx 200 also provides enhanced 2-D and 3-D product wafer stress metrology-allowing users to obtain wafer stress measurements that correlate to die-level stress more accurately than traditional 1-D monitor wafer measurements, thereby improving root cause analysis.

Advanced films such as ultra-thin ONO layers, nitrided films, high-k and low-k dielectrics, 193-nm anti-reflective coating (ARC) layers, and engineered substrates, including silicon-on-insulator (SOI), strained silicon, and silicon geranium (SiGe)

All major optical components on the SpectraFx 200 have been redesigned to lower spectral distortion. A faster computer and a cleaner, faster front-end wafer-handler, combined with remote diagnostics and iSupport for 300-mm automated fabs.


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The proprietary technology of the Aerial Image Measurement System (AIMS™) emulates the imaging of a photomask in a wafer scanner. The AIMS™ serves to analyse possible failures of a photomask under the same conditions than a wafer scanner. This technology allows for fast and reliable prediction of wafer printability of defects, critical features (like dense patterns or contacts), and repairs on the masks without the need for time-consuming and costly wafer prints followed by wafer CD-SEM analysis.

Based on the performance optimised 2nd generation AIMS™ fab platform, AIMS™ fab 193i enables emulation of both dry and immersion 193nm lithography stepper/scanners with numerical apertures up to 0.93. By adjustment of numerical aperture, illumination type, and partial illumination coherence (Sigma), the system emulates steppers or scanners using any type of Binary, EAPSM, AAPSM, and CPL reticles. This means a high level of flexibility and application space of the system in mask shops and wafer fabs to analyse mask defects and to verify repair quality. Furthermore OPC strategies can be investigated under the same optical conditions as the 193 nm steppers/scanners in the wafer fab.

To address the latest developments in optical lithography, the AIMS™ fab 193i provides a linear polarisation capability in the illumination as will be implemented in upcoming generations of optical wafer scanners. Oriented horizontally or vertically to the mask edges polarisation effects of the mask itself can be investigated which is crucial to optimise designs and lithographic settings for upcoming mask designs. The AIMS™ fab 193i can be equipped optionally with a robotic reticle handling, allowing for fully automated reticle loading from SMIF pods or reticle box libraries. With its high level of automation and increased throughput, the system is also ready for a new class of fully automated measurement applications such as Global CDU Map for investigating CD uniformity across the photomask. Global CDU Map optimises efficiently the mask manufacturing and design process with respect to process tolerances and optical proximity effects. Furthermore it is a valuable tool in wafer fabs for CDU qualification of incoming photomasks without the need for pellicle removal (through-the-pellicle CDU qualification).

Based upon the detailed information about the printability of mask defects AIMS™ enables photomask manufacturers and wafer fabs to decide whether a photomask needs to be repaired and to ultimately decide whether a repair was successful and the mask can be used for chip production.

Using AIMS™ is a clear prerequisite to achieve high yield levels of photomask and chip production. Based upon the major improvements with respect to automation and throughput the AIMS™ fab 193i clearly enables mask shops to produce photomasks at higher yields and lower costs.

Reason 3: New applications like Global CDU Mapping broaden the spectrum of analysis instruments for our customers. These new applications provide necessary information that become essential with shortening of wavelengths and increasing NA.

http://www.smt.zeiss.com/sms


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Micronox MX2188 Low COD Aqueous Precision Cleaner is an innovative, powerful aqueous cleaning solution, designed to meet the latest challenges of lead-free, water-soluble fluxes while meeting RoHS and environmental constraints. The cleaner is intended for use at very low concentrations while cleaning tight pitch and low standoff devices. Whether batch, in-line or immersion, MX 2188 is perfect to meet the industry challenge of meeting cleaning needs with minimal environmental impact and low cost of ownership.

Besides being low COD, the cleaner is low VOC, non-flammable, non-corrosive, recyclable, multi-metal safe, and features no HAPs, CFCs and SARA 313s, providing users with consistent, high-quality performance every time. Additionally, MX2188 features low-use cost and has a long bath life ¾ this material truly gives users the most for their money.

Easy to use/implement and effective at all temperatures, MX2188's performance is optimum at 120° to 160°F. As previously mentioned, the material is extremely environmentally friendly: it is a non-corrosive biodegradable aqueous solution with 102 g/L VOC at 100 percent dilution, and contains absolutely no CFCs or HAPs.

MX2188 is multi-solder safe for use on all lead-free and eutectic solders in addition to most precious metals. It is part marking safe and compatible on all tested electronics industry labels (polyimide). It is safe to use with PVDF, Kalrez, Teflon, and ceramic elastomers and filters, while it is best used in polypropylene or stainless equipment. The cleaner is available commercially in one, five and 55 gallon containers.

MX2188 is an innovative cleaner and should win an award because of the following reasons: It is a powerful aqueous cleaning solution It meets the most recent challenges of lead-free, water-soluble fluxes It is extremely environmentally conscious. It meets or exceeds both RoHS and environmental constraints.

http://www.kyzen.com


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Soldering of complex packages and new housing technologies require an exact controlled reflow process. The RO300FC is a full convection oven that allows fast and homogenous heating. The integrated convection technology offers a unique and innovative way of heating -- with a vertical hot air stream that evenly heats the complete substrate. Both standard and lead-free pastes can be used.

As an innovative new feature, RO300FC now features RO-CONTROL software for increased process simulation and control. RO-CONTROL combines all the important functions for the process evaluation and process control for reflow ovens. This technologically advanced software offers many of the same features as thermal profilers, but for less than half the price. Also, because the software is within the RO300FC, ESSEMTEC is able to offer users an industry first.

The high air volume of the RO300FC guarantees equal heating rates in all the components and the substrate, which leads to a minimum Delta-T and guarantees a perfect soldering process at every location on the substrate. This 80" long oven offers many of the same options -- including chain conveyor, computer control and an N2 option -- as those available on ovens that are three to four times more expensive.

The temperature of the pre-heat and the peak zones along with the conveyor speed are programmable to obtain the required soldering profile. Measuring the zone temperatures directly in the convection airflow guarantees reproducible results with lowest Delta-T values (±2°C). Different profiles for solder and glue are already integrated in the microprocessor control.

Please give three reasons why this nomination should win an award:
1. Quite simply, ESSEMTEC's RO300FC should win because it provides a significant amount of capability at a small footprint and price. The oven can be used for prototypes, small batches and production runs up to 700 substrates in an eight-hour shift. The oven can produce prototypes or production with lead-free products with minimum space and low power requirements, providing major cost benefits to users.

Also, it is the only oven in the industry that offers built-in thermal profiling software -- making it both innovative and extremely cost effective.

http://www.essemtec.com


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VERSALINE™ SOI Etching from Unaxis Wafer Processing
Unaxis Wafer Processing

Unaxis has emerged as a leading provider of deep silicon etching technology with an entire suite of processes for the diverse MEMS market. Among its capabilities, the popular VERSALINE™ enables high performance MEMS devices with SOI structures. Fast, smooth etching of the silicon layer without notching at the buried oxide interface is achieved using new charge relaxation technology developed for Unaxis deep silicon etch (DSE™) processes. Coupled with Unaxis’ patented advanced optical emission endpoint system (OES) that can detect <2% open oxide, a wide range of aspect ratios can be fabricated. By eliminating unnecessary over-etching, throughput is enhanced.

The SOI technology is just one aspect of deep silicon etching with the Unaxis VERSALINE™. In addition to avoiding notching at the oxide/silicon interface, Unaxis DSE™ processes provide smooth sidewalls at high etch rates by integrating several process technologies that enable sub-second etch and deposition steps. Sub-second switching between process steps produces smooth sidewall profiles, as scalloping is reduced to a minimum. A patented, fast gas switching technique using solenoids coupled with mass flow controllers, is only one of several components for high performance, fast response processing. Pressure control technology commensurate with the changes in gas flow is accomplished using a combination of high speed throttle valves and patented control algorithms. The challenge of maintaining inductively coupled plasma performance in a fast changing environment is met by utilizing a solid state matching network. This solid state matching technology not only ensures efficient impedance matching and power transfer to the plasma on a sub-second timescale, but also eliminates the mechanical wear encountered with traditional motorized matching networks. Another important technology enabling sub-second deep silicon etch processes is endpoint control. An optical emission spectroscopy system (OES) developed by Unaxis is used with patented endpoint algorithms to compliment notchless SOI etch capability. These technologies result in overall process speeds approaching the system’s limit of gas residence time.

With Unaxis SOI technology the system leverages fast gas switching, rapid response pressure control, immediate plasma power matching, and sensitive endpoint detection to produce a complete, state-of-the-art advance in deep silicon etching. This advance promotes both innovation and commercialization in the emerging markets of MEMS, nanotechnology, and packaging.

Unaxis has assembled technologies ranging from fast gas switching technology to new algorithms for optical emission endpoint detection in a constantly changing plasma environment to pressure control technology that avoids pressure bursts and maintains stable and reproducible pressures over long process periods. This technology solution has been implemented on the VERSALINE system and is part of the Unaxis DSE™ product offering.

The VERSALINE™ platform - the first designed from it’s inception to be flexible and modular - encourages an economical approach when moving from research and development to production. Thus, a single wafer loader easily transitions to a multi-chamber cassette-to-cassette system adapting our customers’ growth.

Unaxis has an extensive history of working in emerging markets and partnering with our customers. These partnerships promote application specific processes and hardware - whether it be for micro-fluidics, micro-optics, three-dimensional packaging, accelerometers, or any of the many other exciting devices being developed. Together, we advance the state-of-the-art for deep silicon etching.

http://www.waferprocessing.unaxis.com


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This new rework tool for 01005 components (size 0.25 x 0.125 mm) is unique in the market and provides reliable and reproducible results.

The thermodic-style soldering head is powered by hot gas, with heat transferred via a conductive heat method. Very rapid heating and cooling allows the shortest process times. Simultaneous to the heating process, nitrogen can be directed to the component to build up an inert gas shield around the working area, eliminating solder oxidation. The tool is capable of safely handling the component from pick out of tape through placement and reflow on the board. Additionally, it uses a vacuum to hold the component during alignment and placement. The tool carefully controls the force in z direction used during pickup and placement.

Working in conjunction with the Small Passive Application package for the FINEPLACER® Pico System, the rework process also includes an integrated dispenser for solder paste with small and stable volumes, as well as a fine resolution video system (offering 5 micron placement accuracy).

The barely visible size and often limited accessibility make safe reworking of 01005 components extremely difficult. FINETECH is the only supplier with a tool solution for this challenge.

FINETECH's 01005 soldering head allows reproducible rework results for sophisticated circuits considered to be "irrepairable" in the past.

Due to the tool's precise thermal management, neighboring components remain in place and undisturbed, a critical concern in reworking the next generation of passive components.

http://www.finetech.de


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This work deals with the fabrication of high resistivity (HR) SOI wafers. HR SOI wafers are known to suffer from parasitic surface conduction (PSC) below the buried oxide (BOX) due to fixed charges in the oxide that attract free carriers at the substrate surface. The resulting effective resistivity of the wafers is then degraded by typically more than 1 order of magnitude and is correlated with oxide charge distribution across the wafer (i.e., it varies from one die to another). A fabrication method has been developed to suppress PSC in HR SOI wafers, which consists in inserting a passivation layer of trap-rich polysilicon between the HR substrate and the BOX. The deposited polysilicon layer was optimized to increase at the same time the passivation efficiency and its mechanical properties. This fabrication method is entirely compatible with UNIBOND SOI wafer fabrication and was demonstrated to be fully efficient.

The proposed method to get rid of parasitic surface conduction in HR SOI wafers is cheap, CMOS-compatible and interests an increasing number of actors in the IC industry which faces growing market shares for SOI and HR SOI applications.

dimitrilederer@gmail.com

http://www.emic.ucl.ac.be


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The Bulk Specialty Gas System (BSGS) provides a step change in the supply of high-volume specialty gases for semiconductor manufacturers by improving product consistency & reliability (saving money), manufacturing productivity (more uptime), and employee and facility safety (fewer cylinder changes).

For device manufacturers who are using high volumes of specialty gases the BSGS and the benefits it offers, helps manufacturers save money and makes their job easier. Air Products is the leader in providing BSGS technology to customers around the world with more systems installed than all competitors combined.

http://www.airproducts.com/electronics


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SOPRA’s EP5 and EP12 tools are based on Ellipsometric porosimetry (EP). This is a unique technology to characterize CVD and spin coated porous ultra low-k materials. EP measures the change of the optical properties and thickness of the materials during absorption and desorbtion of an organic solvent.

EP allows the measurement of PSD at room temperature in thin films directly deposited on Si or any smooth solid substrate. A small surface area (<1mm 2) is sufficient. It is also suited to characterize other materials like: membranes, fuel cells, Sensors, Catalysis surfaces, nano-structure and nano-composite materials, hybrid organic & inorganic interfaces.

http://www.sopra-sa.com


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Innos Develops Silicon MEMS Microgenerators for Perpetuum Ltd
Innos Limited

The biggest roadblock to wireless comms is power - either a battery or a connection is required. Batteries, whilst efficient need to be recharged or replaced. Smaller than a matchbox, the device developed by Perpetuum Ltd is a small electro mechanical system consisting of an arrangement of magnets on a vibrating beam. These magnets move past a coil, generating power up to four milliwatts, enough to power a sensor, microprocessor and radio link.

Innos was chosen by Perpetuum Ltd to research and develop a silicon-embedded self-powered wireless device. The concept is to harvest kinetic energy from vibrations in the environment, which is then converted by microgenerators into usable electrical energy to power sensors, microprocessors and transmitters.

Working together, Perpetuum Ltd and Innos have pioneered a Silicon MEMS Microgenerator that is 5mm X 5mm X 1.5mm and capable of producing a few hundred microwatts under suitable conditions.

Imagine a heart pace maker that uses the patients own body energy to power it, eliminating the need for a battery and the associated operations to replace them. This breakthrough has truly revolutionary possibilities for industry.

Further applications for the device includes:
* Condition monitoring of machinery: motors, turbines, pumps and gearboxes
* Powering and delivering signals from sensor systems for testing rotating parts, wheels, rotors, shafts, and propellers
* Permanent embedding in inaccessible structures: bridges, roads,
* Vehicle, container or asset tracking

The core strategy is the integration of emerging technologies such as MEMS, bioelectronics and nanotechnologies with conventional silicon technology. The facilities and expertise at Innos mean that we are ideally placed to undertake experimental and pioneering R&D and initial production projects, such as the Perpetuum Silicon MEMS Microgenerators.

http://www.innos.co.uk


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The Mentor from Metryx which is able to carry out Mass Metrology for SPC applications at 60 wafers per hour, >95% uptimes and measure mass differential in the atomic layer regime.

Metryx is a provider of nanotechnology metrology equipment; their Mass Metrology is being utilised for many applications in advanced devices where standard metrology techniques cannot be used. Due to it's capability of delineating mass errors to the equivalent Ångström range, Mass Metrology is being used in volume production on 200mm and 300mm wafers for leading edge & deposition applications.

All microelectronic devices are manufactured by adding or removing materials. Unique technology from Metryx enables weight measurement with atomic layer accuracy for characterization of individual materials and processes, or process control of the complete manufacturing sequence.

http://www.metryx.net


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Low labour costs and unsaturated markets, combined with a steady economic recovery, have made the Asia-Pacific region attractive for semiconductor vendors and electronic equipment manufacturers. Even so, a region that remains untapped for its similarities to Asia Pacific is Eastern Europe. Although the market here is not developing as quickly as it in Asia, Eastern Europe houses well-experienced electronics manufacturers, and holds added benefits compared to its Asian counterpart.

For Austria-based SEZ, its decision to outsource its production facilities to countries like Slovakia has proven beneficial in many ways. Here, intellectual property is not a significant issue as it is in China. Moreover, as a German-speaking company, SEZ eliminates language barriers it would face in Asia Pacific, finding it easier to heighten production and planning flexibility.

Since 2004, Slovakia has been the production home of SEZ’s chemical modules. As a result of outsourcing to countries like Slovakia, the company has realized a significant cost savings. This coupled with the quality of work and experience the region holds has led SEZ to make Slovakia the production centre for the Da Vinci series as of March 2006.

http://www.sez.com


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The Laser MicroJet is the perfect technology for singulation of semiconductors, especially when delicate materials are involved such as gallium arsenide (GaAs), indium phosphide (InP) and low-k materials or with hard materials such as silicon carbide (SiC).

Synova’s Laser Microjet is a revolutionary hybrid cutting process combining a laser beam and a water jet, where a hair-thin water jet guides the laser beam on to the wafer. Contrary to standard cutting methods, the Laser MicroJet uses the water jet to cool the material surface for optimal protection against thermal damage. At the same time, water is used as a natural layer of protection to prevent deposition or contamination. Both of these surface protection features offer significant improvements to standard cutting processes that boost device yields. In addition to consistently demonstrating superior quality results, the Laser MicroJet is a highly reliable, maintenance-free cutting technology, which does not wear or need replacement like traditional blade methods. This has proven to have significant cost-of-ownership advantages for chipmakers compared to older cutting processes. This water jet-guided process not only reaches unprecedented speeds of up to 200 mm/s for thin silicon wafers (50 microns), but also provides parallel and narrow cuts from 75 microns to 25 microns, and has no wafer thickness limitations.

Apart from standard operations such as cutting, scribing and drilling, the Laser MicroJet provides a unique solution for performing edge grinding, which considerably reduces wafer breakage for thin semiconductors (< 150 microns thick).

While semiconductor applications represent the lion’s share of Synova’s business, the Laser MicroJet is a versatile technology that can be used in a number of other industries and its applications.

Key Benefits:

• No thermal stress, thanks to water-jet cooling
• No particle contamination or need of a surface protection layer
• Outstanding cutting results with no burrs or slag
• Chipping and cracking of materials on the wafer edge, which can result from traditional cutting methods, are avoided
• No mechanical stress thereby enabling high die fracture strength
• Flexible process - in addition to high-quality cutting, allows drilling, scribing, grooving, edge grinding, or marking processes on wafers
• Scalable process with a wide variety of applications in the semiconductor sector including the dicing of low-k wafers, gallium GaAs wafers, solar cells, power semiconductors, multi-project wafers or thin wafers, etc
• Through-cutting of any thickness

http://www.synova.ch


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ALOHA Precursor Screening Programs
Air Liquide

The semiconductor industry is currently faced with numerous challenges related to new materials and integration, both for FEOL and BEOL processing (high k's, metal gates and electrodes, low T SiN/SiO2 spacers... for FEOL, and 2nd generation low-k and pore sealing chemistries, new etch stops and hard masks, for example.). Some of these materials have been introduced into the 90 and 65 nm devices, and more materials are currently being investigated for the 45 and 32 nm node.

This has lead OEMs and end users to start numerous programs to define the most suitable chip materials, and chemistry that is well best suited for CVD or ALD processes. However, considering the number of possible options, it is virtually impossible for most end user or OEMs to evaluate all the potentially sound chemistries for a given application. In addition, they often lack the chemical capabilities and background to anticipate manufacturability and scale-up issues which eventually can have a substantial impact on the overall process CoO.

In order to alleviate this problem and support pour OEM partners and key customers, the Air Liquide ALOHA™ business line has assembled a highly efficient and fast precursor screening infrastructure and protocol. This program is vertically integrated to provide our partners with all the information and material required before testing new chemistries on production-worthy equipment, ranging from new molecule proposals, precursor synthesis and characterization, film deposition and characterization in a variety of equipments, basic process window determination, and eventually supply of sample quantities for first full scale implementations along with mid and long-term pricing indications.

With the current deposition and characterization tool set, virtually all processes types (LP-CVD, SA-CVD, PE-CVD, ALD, PE-ALD) are covered for a variety of applications, whether low-k, SiN/SiO2, high-k's or metals. With in-house FTIR, ellipsometry, Auger, EDX, XRD, mercury probe and other basic electrical characterization capabilities, and a network of academic labs and R&D institutes for more thorough film evaluation. ALOHA™ apps labs are able to identify the process window to match precise film requirements given by our partners. To improve our responsiveness and better understand each request, application labs have been created in each major semiconductor zone (Asia, US and EU), and staffed with a pool of experienced researchers and engineers, whose job is to bridge the gap between chemistry and the semiconductor world, and support our partners into their process developments all the way to volume production.

This unique integrated approach to Joint R&D and customer support brings an obvious timing benefit to our partners by considerably downsizing the number of solutions they must evaluate by themselves, and gives them access to innovative tailored chemistries for future technology nodes. Such screening programs are currently active with 5 of the top 10 semiconductor makers, and numerous OEMs and R&D consortia worldwide. Regarding our program, a leading DRAM maker declared : "Fast and reliable precursor and process screening is most valuable for unit process development for key innovations such as high-k capacitor dielectrics that supports the technological roadmap, which is driven by introduction of new materials to boost product/device performance".

Such a program considerably helps reducing screening time for new materials and contributes to reducing associated costs, both being the biggest challenges of the "materials era". What is also truly unique is the scale at which we are doing this for our customers and the number of application we cover.

http://www.airliquide.com


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WaferScan from Tamar Technology is a big step forward in wafer thickness metrology. WaferScan utilizes Tamar's proprietary Optical Stylus (patent pending) technology to measure the thickness, warp, bow and other shape features of wafers, with high data density and high throughput, without contacting the substrate surface. WaferScan allows the user to acquire thousands of data points on the surface and can measure thickness of conventional wafers as well as thin wafers, and of any material. No optical constants are required and patterned or bumped wafers are easily addressed. Thickness of sensor membranes and other etched features that are local placed on the substrate can also be measured.

This tool solves unique problems in wafer processing, such as thin membrane thickness measurement and other etched feature depths/thicknesses on the wafer. Allows for wafer thickness, bow and warp metrology on bumped or patterned wafers - capacitance sensors fail here. Can measure ultra-thin wafers, 10 microns up to 100mm nominal thicknesses. Non-contact optics with long working distance eliminates the chance for wafer damage - or sensor damage.

http://www.tamartechnology.com


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LDS3300 C series
Vistec Semiconductor Systems GmbH

The LDS3300 C series from Vistec Semiconductor Systems enables unlimited all surface macro defect inspection on 300mm wafers. A new generation of macro defect detection tools allows the first real 100% automated process control within litho, CMP, etch and other applications - thanks to an innovative wafer edge and backside detection solution.

The LDS3300 system's modular concept enables adaptation to current and emerging process requirements. The "parallel processing" capability allows simultaneous wafer inspection at the frontside, the backside and the edge/bevel - without affecting system throughput of up to 130 wafers per hour.

The backside inspection function allows early identification of potential wafer and process killer defects such as particles, scratches and residues - all within a very short inspection time of only one scan cycle. A full wafer color image and single defect images are provided. The graphical user interface allows direct and easy correlation of frontside and backside inspection results , which prevents for root cause analysis of from focus/exposure problems caused by backside defects.

The edge/bevel function inspects the wafer edge during only one rotation. The scan includes the detection of typical edge defects such as particles, cracks, chips, scratches and residues, and records the defect images. Because a second rotation for images is unnecessary, the new inspection solution saves a huge amount of time and costs compared to competitive solutions.

The resulting inspection time per wafer at highest sensitivity leads to a significant cost of ownership improvement when compared to manual inspection and stand-alone solutions. In combination with its unique inline high-resolution intelligent review capability, the LDS3300 offers automated defect recognition of process excursions that cause yield loss. The outstanding detection methods and algorithms used for detection allow easy differentiation between the range of process variations allowed and real defects.

Summary
The LDS3300 C provides a unique combination of automated macro inspection, including backside and edge, and high resolution optical review with world class performance. Thus allowing the user to have complete control over an entire process step through reliable, fast and repeatable results. The system can be used for a variety of applications in lithography, CMP, etch, yield control and others. With it's superior performance the LDS3300 C has proven to be a key contributor for yield enhancement and increased productivity in leading edge fabs around the world.

http://www.vistec-semi.com


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Aviza Technology - Sigma® fxP™ PVD System
Aviza Technology

The Sigma fxP is a single-wafer cluster tool designed for high-volume physical vapor deposition (PVD) processing. The architecture of the Sigma fxP sputter deposition system offers excellent process control with high throughput. Various process chamber configurations and combinations are available to address a large variety of specific applications. Deposition process modules are based on a standard design that enables simple technology upgrades and wafer size conversions. Key applications for the Sigma fxP include Ti/TiN liners and Aluminum interconnect for sub-0.35 µm node IC devices including ionized PVD, very thick and flowed Aluminum for power semiconductor manufacture, highly uniform Aluminum Nitride layers for Bulk Acoustic Wave devices and Thin Film Heads.

Mainstream semiconductor device manufacture is becoming increasingly cost driven. This is an inevitable response to the general decrease in the average selling prices for ICs. In addition, the rise of foundry activities in low-cost regions of the world places additional pressure on cost of capital investment. Finally, established fabs need to find new ways to differentiate themselves, including reducing running costs, reducing WIP cycle times and reducing transition time from one product type to another. The majority of today's fabs are no longer dedicated to single-type or same-type product manufacture, they are far more likely to have 100's of device types streaming through the manufacturing line at the same time. Being able to quickly change tool configurations, and process capability on the installed manufacturing equipment in response to new capacity plans is a critical factor in maximizing profitability.

The Sigma fxP has multiple benefits for this type of customer.

• Standard deposition modules used for Ti/TiN or Aluminum are interchangeable. The user can switch applications in response to a loading change very simply; all that is required is a target and shield change. Competitive systems usually require more significant hardware modifications, reducing their overall flexibility.
• Target and shield life in the Sigma is longer than in competitive tooling, meaning significant savings on running costs. For a high volume fab running ~10,000 wspm, a Sigma fxP user can save >$1,000,000 per year on running costs alone compared to the main competitor system.
• In addition to long shield life, lasting up to 100% of the target in most Aluminum applications, Sigma fxP users benefit from fast target & shield change times. By leveraging fully automated service routines, the user can do a full target/shield change PM in ~6 hours, one-half to one-third the time taken by the main competitor. The result is less downtime, allowing our customers to increase their line yield on a per week basis. This, of course, could contribute to an increased product flow through the fab.
• Generally, more advanced PVD modules cover a narrow range of device nodes, requiring the user to obsolete older modules after 2 or 3 years, or invest in multiple modules to cover last- and next-generation product types. On the Sigma fxP, the Advanced Hi-Fill (AHF) ionized PVD module offers the unique ability to switch the ionization source on and off. Users of the AHF module can cover a very wide range of device nodes and so need to carry less capital equipment to meet capacity.
• Also, it is important to note that given that the growth of the China market, we see that Sigma has great potential in this region for 200-mm aluminum interconnect applications. Currently, Aviza has a Sigma evaluation system installed at one of China's leading foundries.

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The Da Vinci™ Series is a revolutionary single-wafer wet processing technology platform designed for high-volume manufacturing applications. Developed to address new cleaning requirements for back-end-of-line (BEOL) polymer cleaning and backside etch and clean, as well as for processing emerging applications such as high-k dielectric and metal gate etch on 200- and 300-mm wafers at the 45-nm and smaller technology nodes, Da Vinci tools provide a combination of workable design, high throughput and accurate wafer cleaning needed to maximize device yields.

The Da Vinci family high-volume production at the 65-nm, where wet bench tools are no longer viable due to their inability to clean delicate submicron devices without causing damage. The Da Vinci tools address emerging cleaning challenges posed by both shrinking geometries and new materials, leveraging SEZ’s proven spin processor technology in multiple chambers to deliver improvements in flexibility, productivity and cost of ownership (CoO) compared to prior-generation single-wafer tools. By combining high throughput and smaller system footprint to reduce tool CoO, the Da Vinci family offers a cost-effective alternative to wet-bench tools.

Additional benefits include:

• Helps manufacturers cope with the requirements of high-volume manufacturing, especially addressing new cleaning requirements for back-end-of-line (BEOL) polymer cleaning
• Gives manufacturers better control of the wafer surface, while minimizing media consumption and defect density
• Supports the efficiency of different cleans, enabling effective cleaning for tiny geometries—critical for processing high-aspect-ratio wafers at the sub-90-nm technology node
• Speeds wafer handling and transport to cut wafer-processing cycle time and boost throughput
• Compared to former SEZ systems, Da Vinci increases throughput by 100-120%

SEZ’s Da Vinci system has also helped its users to provide a safer workplace and to become more environmentally responsible. It allows chemicals to be recycled—significantly reducing media consumption and overall waste due to the patented wafer chuck and improved chamber design (based on a chemical flow analysis). It also saves valuable fab floor space, while still maintaining the level of access needed without jeopardizing serviceability further contributing to the tool’s low CoO.

Historically, SEZ helped pioneer the single-wafer wet clean market, introducing its first single-wafer tool in 1990 and its first 300-mm single-wafer wet clean system in 1997. The company has over 1,000 systems installed worldwide, resulting in a >60% market share in single-wafer wet processing.

The Da Vinci family was developed from the ground up, using the company’s proven spin-processing technology, as a series of tools based on a flexible, extendible platform. Rather than continuing to develop standalone tools that were less easy for customers to upgrade, the company targeted creation of a high-volume, high-CoO platform that addressed as many customer wish-list capabilities as possible, while providing headroom for future expansion and customization.

Propelled by the current industry trends toward increased cost reduction, better yields and higher productivity, market adoption of the Da Vinci platform has grown sharply since its launch in June 2003. SEZ already has multiple Da Vinci tools installed worldwide.

http://www.sez.com


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COMET Integrated Drive Dramatically Enhances RF Sub-System Design and Manufacturing. The versatile Integrated Drive from COMET enables precise alignment of capacitors, motors, and cou-plers for high-precision RF "match-box" network design. Steadily reducing feature sizes on larger semiconductor wafers is placing new demands on sub-systems. The Integrated Drive meets these demands and improves yields by providing a reliable and accurate solution for critical RF matching of multiple vacuum capacitors in matching networks.

Shorter, multi-step processes, multiple frequency operation, and changes in resist thickness and chemistries are increasing demands on the RF sub-system. The COMET sub-system provides a single multi-functional solution, thereby eliminating the need to source and integrate components from multiple suppliers.

The core component of the Integrated Drive is the industry-proven COMET variable vacuum capacitor. The Unicon family of vacuum capacitors are capable of operation at higher frequencies required in semiconductor fabs (up to 15kV peak voltage). The sub-system also includes a motor, coupler, and coupling tube to drive the capacitor. The proprietary COMET coupler design enables the system to deliver capacitor actuations in excess of 3 million cycles. A durable, backlash-free coupling connects the capacitor to the drive system. A bulkhead flange and adjustable end flange ensure easy mounting in the RF systems.

COMET has been manufacturing fixed and variable vacuum capacitors since 1965. The Integrated Drive was the result of close cooperation with leading international companies in the RF industry. Ensuring 100% accuracy in matching network design, the Integrated Drive dramatically reduces procurement and assembly lead-times, and replaces tedious and error-prone manual assembly with a standardized, easy-to-install subsystem. Optional features on the sub-system that directly benefit the customer include an advanced motor control that enables accurate, high-speed operation, and a memory chip that stores specific module information, such as Capacitor type, serial number, measurement of capacitance curves. Customers can also request an integrated stepping motor and micro controller that allows for high level commands.


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STS Pegasus DRIE technology for MEMS fabrication
Surface Technology Systems plc

Pegasus is the continuation of STS' Advanced Silicon Etch (ASE®) technology which enables MEMS device manufacturers to improve throughput and yield, thus reducing costs of production. The new technology has realised silicon etch rates higher than any other Deep Reactive Ion Etch (DRIE) system currently on the market (>50µm/min for 1% exposed area).

The Pegasus process module incorporates a range of developments and enhancements in a unique, high uniformity plasma source design. This high-density decoupled source has been shown to increase etch rates by 30% over competing systems and mask selectivity by 35% or more.

The unique design of Pegasus leads to a more uniform plasma at the wafer surface resulting in improved across-wafer uniformity for both etch rate and critical dimension control. Pegasus also includes a range of software and hardware features that provide further advances in reduced feature roughness and improved profile control while maintaining high etch rates. As standard, Pegasus incorporates STS' patented Parameter Ramping and Silicon on Insulator (SOI) technologies which are key in the optimisation of high aspect ratio features often found in MEMS devices, and etching to hidden sacrificial oxide layers.

Pegasus has been optimised for reliability and ease of maintenance by adopting a modular design concept that also results in a reduced footprint and improved accessibility. The combination of all of these features ensures a high performing, low cost of ownership solution to meet the highest industry expectation. The system is fully compatible with any of STS' modular platform configurations, from single wafer load-lock to full production cluster systems, enabling a smooth transition from research and development right through to volume production.

The Pegasus DRIE system offers MEMS manufacturers and researchers a truly enabling wafer processing tool, with market-leading process performance available on a complete range of wafer-handling platforms ranging from manually loaded, single-wafer loadlocks to fully production-proven multi-chamber cluster tools, which allows easy transition from R&D to full scale production.

Key features of the new system include the improved etch rates, improved selectivity, smooth sidewall capability, high plasma uniformity, along with the patented "Parameter Ramping" and "SOI" capability of STS original ASE® Process.

Since the introduction of the 'Bosch Process' or DRIE for deep anisotropic silicon etching, in 1994, STS has worked continuously with MEMS customers to improve the technology and process capabilities, and facilitate the commercialisation of an ever-growing range of MEMS devices, including ink jet heads, sensors, gyroscopes, microfluidics, BioMEMS and optical MEMS devices. The Pegasus system is the result of over a decade's experience in this field, and STS is committed to continuing to push the limits of this technology and satisfy the requirements of the MEMS industry.

http://www.stsystems.com


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Falcon - Finished Wafer Inspection System
Camtek Ltd

Automated optical inspection (AOI)is quickly replacing manual inspection all across the IC industry. It delivers the productivity to inspect 100% of the products at production rates, doing away with the guess work of sampling.

The Falcon family models address finished wafer-level optical inspection needs at the FAB end-of line, test houses, bumping services, MEMS and packaging facilities. Built from the ground up as a modular platform, the Falcon dedicated models offer a broad range of tightly-integrated capabilities. For example, the Falcon 800 line provides both 3D and 2D inspection and metrology in a single system, delivering true three-dimensional analysis of flip-chip bumps diameter, shape, location, height and co planarity. Another model handles framed diced wafers and bare wafers. This integration greatly increases overall throughput, reduces handling and improves cost of ownership.

Merging into the plant process data management systems, AOI takes inspection way beyond merely defect detection. It generates and edits wafer maps and provides detailed statistical reports of defect types and locations, as well as critical dimensions at the die, wafer or lot level.

The Falcon's software-intensive flexible architecture enables Camtek to quickly customize detection algorithms to specific customer needs - from inspecting MEMS sensors multiple levels in a single cycle, to accommodating wide process various in the appearance of redistribution layers.

The Falcon is designed to handle bare and framed wafers up to 300mm diameter. But when a MEMS pressure sensors manufacturer required inspection of bonded and diced wafers on expansion rings (hoops), the Falcon was customized to deliver that too.

1. Superb inspection and metrology capabilities
2. Very easy to setup and operate, especially considering its versatility.
3. Very capable \'out of the box\', but easy to customize when needed
4. Chosen and qualified by most of the top worldwide IC suppliers, including the major European corporations.

http://www.camtek.be


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Jumbo Bulk Specialty Gas Offering
Air Liquide

Jumbo is Air Liquide's offer for bulk Electronics Specialty Gases (ESG). Jumbo targets highest-volume, highest-flow ESG customers such as liquid crystal display (TFT LCD) fabs and 300 mm semiconductor fabs. With key features such as multi-sourcing for supply contingency, local analysis with an Air Liquide certificate-of-analysis, redesigned bulk containers ensuring highest standards if safety and reliability, new high-capacity on-site dispense systems, and on-site services, Jumbo brings a real value to ESG .

Through a Jumbo contract, mutual commitment between Air Liquide and the customer is strengthened: Air Liquide gets a majority account share for a minimum duration and the customer benefits from peace-of-mind.

Technically, some key Jumbo-specific items are
* pneumatic primary isolation valve on each tube (remotely operated)
* sliding chassis and anti-removal device
* manual secondary isolation valve on each tube
* UHIS connection for SiH4 and NF3
* Safe and reliable heaters to overcome Joule-Thompson cooling
* Safe operations ensured by remote PLC controller
* Higher reliability with dual pressure monitoring at panel and main line levels
* High stability of distribution pressure insured by dual pressure regulation
* High purge efficiency with short connection between ISO and Pigtail box From a customer standpoint, all the Jumbo features translate into:
* improved safety and reliability
* better product quality
* lower cost of ownership

Jumbo first targeted high-volume users of SiH4 and NF3, and is being enlarged to include other ESG such as NH3, N2O. More than 10 customers in the past 6 months have chosen Jumbo™ for the innovations it brings in dealing with high volume ESG, and references include customers in TFT-LCD, Semiconductor, as well as Solar Cell. Customer localization include US, Europe, Asia and Air Liquide latest investment in analysis and warehouse capabilities in Taiwan and China will further strengthen our customer portfolio.

http://www.airliquide.com


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WS-2800 Wafer Inspection System from RVSI Inspection LLC
RVSI Inspection LLC

WS-2800 is the only wafer inspection system to provide proven defect detection along with the flexibility to include 3-D metrology as required. This innovative, modular approach to design means that the system can be specifically tailored to the dynamic requirements of any wafer production setting, thereby meeting the significant industry challenge of constantly changing wafer settings. Whether the application is identifying micro defects only or requires the inclusion of accurate 3-D metrology for flip chip bumps, the system is ready.

The WS-2800 Wafer Inspection System provides superior yield management for defect inspection throughout post-fab processes for both standard and flip chip wafers up to 200 mm in diameter. Additionally, the system is aware of environmental concerns and makes lead-free inspection as simple as possible for operators.

Defects created in the post-fab area between wafer processing and final manufacturing can negatively impact production yields and time-to-market. The WS-2800 quickly and reliably locates wafer defects and classifies them to reduce process costs and improve yield. The speed with which the system detects defects is unmatched and results in improved throughput rates.

It is the ONLY wafer inspection system to provide proven defect detection along with the flexibility to include 3-D metrology AS REQUIRED, allowing it to be tailored to meet the requirements of ANY wafer production setting. The system features significant benefits: superior, high-speed surface defect inspection, 100 percent inspection that ensures no escapes and an integrated inspection tool for fast response to process variations, comprehensive probe mark inspection, complete bump defect detection for flip chip applications, unparalleled 3-D bump metrology at product speeds, adaptable to all wafer sizes and handling media, and best overall cost-of-ownership.

http://www.rvsi.com


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Lowest footprint for multitank wet bench
This innovative automated wet bench MultiStep offers a huge variation of combined and isolated wet processes within one wet bench. The necessary footprint is reduced to a minimum while keeping all benefits of today's wet bench standards. Due to its high grade of standardization, an outstanding reliability is given in all relevant topics. Within a maximum of standardization, the flexibility to realize all main process applications is still given. The shortest installation and start-up time known is reached and approved with this tool concept.

AP&S GmbH is a specialist for development and production of wet process equipment and tools for substrate treatment in cleanrooms.

MultiStep, the newest product development, is a platform, that covers all must applications for wet etching, layer thinning, surface cleaning and layer stripping of various materials. It features outstanding small footprint, user-friendliness and reliability. Due to the flexible design and the innovative robot handling the MultiStep is suitable for common wafer or substrate sizes from 50 to 300 mm.

This tool features all wet processes on smallest footprint
The MultiStep guarantees a standardized and user-friendly set-up for fast implementation and
Easy maintenance

http://www.ap-s.de


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Optimized precursor for Low T SiO2 ALD : SAM.24™
Air Liquide

Several applications requiring very low T (< 300°C) and conformal ALD deposition of high quality SiO2 films have recently appeared. Among the numerous examples are liners for STI, SiN/SiO2 dual spacers, metal gate capping, M1 capping, porous low-k pore sealing, etc... Another new application for silicon ALD precursors is the deposition of mixed oxides such as HfxSiyOz4 in DRAM capacitors, with extremely stringent conformality requirements when used in deep trench structures.

Usual silicon sources used in the semiconductor industry such as monosilane, TEOS, chlorosilanes (di, tri and tetra chlorosilane) or disilanes (disilane and hexachlorodisilane), either exhibit insufficient reactivity on the surface (no growth by ALD), or self decomposition (parasitic CVD), or tend to leave detrimental impurities (such as chlorides). Among newer and reactive silicon compounds are silanols such as TBOS (tris-tertiarybutoxysilanol HOSi(OtBu)3), and TICS (tetrakis-isocyanatosilane Si(NCO)4), but both suffer from being solids at room temperature.

The family that have so far attracted the most attention are aminosilanes as 3DMAS (SiH(NMe2)3) and 4DMAS ((Si(NMe2)4), that are supported by ALOHA(tm). However, it appears that better ligand selection can both improve the process performance and contribute to lower CoO. ALOHA(tm) has recently designed and selected through our Precursor Screening Program a new aminosilane, marketed under the name "SAM.24", which best fulfills all the requirements of the ideal SiO2 ALD precursor, namely:
* Self limited growth characteristics under a wide temperature range
* High growth per cycle by optimization of ligand steric hindrance
* Low film contamination, even at low T ([C] < 0,3 atomic% @ 250°C)
* High volatility
* Constant film properties and composition over a wide temperature range (WER change < 10% for films deposited between 200 and 300°C)
* Lower cost (materials) of ownership from a simpler synthesis process than usual aminosilanes

SAM.24 is currently supplied to several leading OEMs and IDM worldwide.

Xlow T SiO2 and SiN ALD is one of the hottest topic in new materials (although the materials is not really new), and this molecule brings a clear process benefit vs. the usually proposed one, especially regarding the film purity and range of the process window. In addition, it is cheaper!

http://www.airliquide.com


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MegPie Single Substrate Megasonic System
ProSys, Inc

The MegPie® Single Substrate Megasonic system incorporates unique, patented features that enable major improvements in uniformity and control of single substrate Megasonic enhanced processes.

A key design feature of the MegPie® is Radial Uniformity (Patented). This assures that the complete substrate receives a uniform cavitation field from the Megasonic dosage, without scanning or sweeping of the transducer . This makes the MegPie® very easy to integrate into almost any single substrate platform and, after initial set-up, there are no adjustments required.

A critical element in Megasonic Enhanced Processing is control. The MegPie® Electronic RF and control system allows "On the Fly" real time monitoring of actual process parameters including forward and Reflected power. The system can be programmed to alarm if a user set parameter limit has been exceeded. In addition the system will store the actual run data for each substrate, allowing comparative analysis off-line.

Proven applications for the MegPie® include traditional Megasonic Enhanced cleaning for Post CMP, Mask and Final Clean, where Radial Uniformity provides a broad process window for PRE and through-put. The MegPie® is now available in Stainless Steel for difficult Solvent develop and strip applications. Megasonic enhanced develop of films such as SU8 using the MegPie® has shown increases in cross wafer uniformity as well as improved profiles in High Aspect Ratio features. Megasonic enhancement also helps reduce chemistry and process time.

The MegPie® is a truly NEW device that addresses many of the shortcomings in traditional single wafer processing. (brushes, nozzles, etc) The MegPie® provides a controlled, radialy uniform cavitation field over the whole substrate surface. The ease of integration and lack of complexity make it a very stable, reliable platform for Meg Enhanced Processes.

http://www.prosysmeg.com


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The INFICON TripleGauge Bayard-Alpert Pirani Capacitance Diaphragm Gauge is designed to take the place of three stand-alone gauges (hot ion, convection-enhanced Pirani, and vacuum switch. The unique TripleGauge reduces the complexity of installation, set-up, and vacuum measurement on the semiconductor tool for processing and transfer chambers.

The TripleGauge BCG450 combines the advantages of three sensor technologies in a single, economical package to measure process and base pressures from 3.75 x 10-10 to 1125 Torr. Above 10 Torr, the TripleGauge BCG450 measures gas-type-independent and solves venting problems with different gas types such as argon or helium. The integrated Pirani sensor protects the hot ion filament from burn-out by automatically switching emission off at high pressures.

The INFICON TripleGauge represents the first true innovation in vacuum measurement since the first combination pressure gauges were described in a patent by Schafer in 1962. TripleGauge is the first high vacuum gauge to fulfill longstanding customer's desires. As long as there were high vacuum applications, end users always wanted a pressure gauge that could measure from extreme ultra-high vacuum to accurate venting to atmosphere with one device on one flange.

One longstanding problem in the vacuum industry is that measuring pressure over 13 decades requires several different measurement principles. Traditionally this requires one connection flange, one dedicated stand-alone controller, and the necessary signal and power connection for each measuring unit. Individual gauges on different flanges on the vacuum system do not measure exactly the same pressure due to conductance differences in the chamber or tubing. There are also offset problems between different gauges due to calibration differences.

Having several gauges on a system also needs additional resources to leak test the individual flanges, and validate the additional computer interface connections. All these problems have disappeared with the TripleGauge. Thermal conductivity gauges usually are calibrated with nitrogen. However, if a light gas such as helium is used, the gauge would indicate atmospheric pressure already at a true pressure of approximately 10 Torr. conversely, with a heavy gas such as argon, the gauge will not indicate a pressure above a few Torr even when vented to atmosphere or overpressure is applied. The introduction of a gas-type-independent pressure sensor solves these problems and contributes to increased safety.

Combination Pirani-capacitance diaphragm gauges have been commercially available since the last decade. However, standard combination Pirani-CDGs are still having a problem in venting applications. The atmospheric air pressure changes with the weather. A sensor hermetically sealed inside the vacuum chamber has no communication with the outside air and does not know about the actual atmospheric pressure that can change between approximately 700 to 825 Torr. A significant advantage of the TripleGauge is the addition of an atmospheric barometer, which allows the precise determination of the difference between pressure inside the vacuum chamber and the outside atmospheric pressure when venting the chamber. Unnecessary purge gas wasting and possible safety hazards, for personnel and equipment, due to overpressure conditions, are eliminated.

the customer's demand for highly accurate and gas-type-independent vacuum measurement gauges is increasing dramatically and the TripleGauge meets those requirements.

Benefits of the INFICON TripleGauge are:
Cost Reduction
Performance benefits
Increased safety
Easier handling
Reproducible process
Increasing quality on final products

All these benefits make it possible for researchers and factory workers to be more productive and safer, and it contributes to better and cheaper products for the consumer. The TripleGauge answers a decade's old manufacturing and consumer wish.

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MAXIM probe from Hiden Analytical
Hiden Analytical

The Hiden Analytical UHV surface analysis system range is further extended by the addition of 'MAXIM', a high-performance quadrupole secondary ion monitor specifically designed for optimum sensitivity for surface analysis and depth profiling applications for a wide range of materials including polymers, superconductors, semiconductors, alloys and dielectric, with measurement of trace components to sub-ppm levels.

'MAXIM' features a ten-fold increase in detection capability to 10^6 counts per second per nanoamp for argon-aluminium, mass range options from 300amu to 1000amu and detection of both positive and negative ions through a dynamic range of 7 decades. An internally generated raster scan is used for primary beam deflection which, together with the synchronous data acquisition facility, enables precise surface mapping. The acquisition region is additionally user-definable and software-selectable within the total raster area for depth profile studies.

The increase is sensitivity is a great benefit for the next generation of materials using ever smaller levels of dopants and thinner layers of materials

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In IMEC's centralized research platform on sub-45nm CMOS process technologies, companies can jointly investigate the major roadblocks of future chip production processes.In a state-of-the-art 300mm clean room, research on a.o. advanced lithography, gate stacks with metal gates and high-k materials, interconnect architectures using low-k material and copper, alternative transistor architectures such as multigate FETs, and ultra-clean processing solutions is performed.

This centralized research platform is the best solution to get fast results in a time where research has become extremely complex (e.g. many possible new materials have to be explored), and very expensive (more complex tools and transition to 300mm-compatible tools).

Collaboration between IC manufacturers, material suppliers and equipment suppliers on pre-competitive technologies is the right answer to this problem. A living proof of this is the success of the research platform: eight of the leading IC manufacturers and/or foundries participate in all research programs of the platform.

http://www.imec.be


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USED4semicon was established in 2000 to address this market need bringing decades of experience in both equipment, process, and commercial aspects of the semiconductor manufacturing business.

USED4semicon supply new, used & refurbished equipment and services globally to the Semiconductor & other high technology businesses. Also, 'The Global Stockroom' was developed as a solution for global sourcing of parts within manufacturing. The system can be applied to almost any industry or application either local, national or global. The system can be used as a spare parts locator within a multi-site organization for instant internal checking or providing other information such as responsible engineer etc as well as letting customers have limited access to improve your customer support efficiency. The Global Stockroom allows your staff (and/or customers) to locate parts distributed within your organization through out the world - FAST!

In addition to these core services other services have been added to compliment the product portfolio, some of which are very applicable outside the traditional industry sector, such as e-commerce, remote data storage, and escrow service.

http://www.used4semicon.com


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Test and Diagnostics of Micro-electronics
MASER Engineering

MASER Engineering is an independent Dutch company, located in Enschede, The Netherlands, offering high-tech support to micro-electronic engineering groups. We operate a wide range of advanced equipment for various engineering applications. MASER Engineering is certified according ISO-9001 and has accreditations for environmental tests according ISO-17025. The Reliability test group supports customers with the qualification and test of electronic components and systems, ESD and Latch-Up testing and a wide range of electrical, environmental and mechanical tests. MASER Engineering also offers for system design validation HALT and HASS services. The Physical Analysis group supports customers with device failure and construction analysis, micro- and surface analysis of electronic materials and FIB based IC modification services. Our customers benefit from our continuous efforts to have up to date test and analysis equipment and know-how available that meets their technology requirements.

Fast growing independent test and analysis services for cutting-edge technology requirements.

http://www.maser.nl


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GEMINI with UV Bond Module
EV Group

GEMINI is the first fully-automated production wafer bonding system designed for processing wafer and substrate sizes up to 300 mm and with field-proven technology from the world leader in wafer bonding. This production proven system integrates fully-automated alignment and bonding stations and is computer controlled for maximum usability and process control.

Its capability to perform all wafer bonding processes fulfils the production requirements for Advanced MEMS, Bio MEMS, Optical MEMS, 3D Interconnects and for tomorrow's applications. The GEMINI is the innovative solution for integrated alignment and bonding utilizing EVG's unique process separation principle.

http://www.EVGroup.com


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Loctite™ 3549 is a high flow underfill formulated specifically for use with today's advanced CSP and BGA packages. The innovative material is designed to quickly fill the space beneath the CSP and BGA packages and cures rapidly at low temperature, which minimizes thermal stress to other components on the printed circuit board (PCB) and allows for in-line curing to increase device throughput.

When fully cured, Loctite™ 3549 delivers excellent protection for solder joints against mechanical stress such as shock, drop and vibration in hand-held devices and testing confirms its superiority over competitive materials when subjected to these stresses. In addition, testing of the material to JEDEC drop test standards on 0.4mm and 0.5mm Pb-free devices has shown that Loctite 3549 offers five times the reliability over non-underfilled Pb-free devices.

Loctite™ 3549 also delivers great levels of flexibility, as the product is compatible with modern lead-free solder materials and is completely reworkable, allowing for an increased process window and the recovery of high-cost substrates and PCB's. Additional benefits of the material include its long pot life and simple, standard refrigeration temperature storage.

Cost-savings and production efficiencies are necessities for today's electronics firms and, like all Henkel materials, Loctite™ 3549 was formulated with these goals in mind. Due to the product's long pot life, which is 14 days at room temperature and up to 7 days at processing temperature (40oC), its simplified storage, low temperature cure and reworkability, manufacturers incorporating Loctite 3549 will realize significant energy and process cost savings.

http://www.electronics.henkel.com


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The Agilent B1500A Semiconductor Device Analyzer is a modular instrument with a ten-slot configuration that supports both IV and CV measurements. Its familiar, MS Windows user interface supports Agilent's new EasyEXPERT software, which provides a new, more intuitive task-oriented approach to device characterization. Because of its extremely low-current, low-voltage, and integrated capacitance measurement capabilities, the Agilent B1500A can be used for a wide range of semiconductor device characterization needs. The Agilent B1500A makes every user into a parametric test expert. The MS Windows PC-based interface is familiar, even to new engineers who are inexperienced with parametric measurement instruments. Its unique task-oriented approach enables users to focus on their real task-at-hand (device characterization), without having to become a specialist in the instrument hardware. This new approach is made simple to use via a touch screen interface, which makes the instrument as easy to use from a rack as from a benchtop.

The modular 10-slot configuration helps reduce cost of test by ensuring that you buy only what you need up front, leaving room to grow as your needs grow or change. This flexibility is a particular advantage for those needing a capacitance measurement unit, which easily can be added to a slot. A unique SMU CMU Unify Unit (SCUU) eliminates cabling confusion when connecting the SMUs and the CMU to your wafer-probing environment. This greatly improves characterization efficiency and accuracy by eliminating the time needed and measurement compensation required when switching between cables.

The flexibility of the Agilent B1500A extends to measurement range as well, by providing extremely high resolution measurements: sub-1 femtoamp and sub 1-microvolt.

Agilent EasyEXPERT software task-oriented approach:

Enables users to be immediately productive and focus on the real task-at-hand (device characterization), without having to become a specialist at using the instrument hardware.

Modular 10-slot hardware configuration, with support for the following module types: HPSMU, MPSMU, HRSMU, MFCMU; Allows you to tailor your measurement solution to meet your precise measurement needs, thereby optimizing cost versus performance.

Support for both IV (SMU-based) and CV (MFCMU-based) measurements; Provides seamless measurements and eliminates the need to purchase a separate capacitance meter to perform medium frequency (1 KHz to 5 MHz) CV measurement.

SMU CMU Unify Unit (SCUU); Takes care of connecting and multiplexing between the MPSMUs/HRSMUs and the MFCMU. Effortless CV and IV measurement, with no need to worry about issues such as cable length, capacitance compensation and capacitance measurement current return path.

ASU: 100 attoamps current measurement resolution and multiplexing with the MFCMU Stable 100 attoamps current resolution via remote sensing meets the most demanding ultra low current measurement requirements, and also allows CV measurements without having to change any cables.

MS Windows PC-based instrument Integrates easily into existing PC-based work environments, allowing easy networking, file sharing and printing.

Touch screen instrument interface, with optional USB keyboard and mouse It is equally easy to use the instrument when it is mounted in an instrument rack or when it is sitting on the benchtop in your lab.

http://www.agilent.com


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Rich feature-set offers the widest range of solutions and flexibility in production parametric testing with the capability to adapt to future process technologies.

With Moore's Law driving the evolution of ever-smaller transistor device structures, and new breakthroughs leading to ever-greater circuit densities, semiconductor manufacturers must perform a larger variety of parametric measurements, and also measure many parameters to greater levels of accuracy, in production. Agilent has responded to these challenges with the Agilent 4070 Series, which offers the widest range of solutions and price-performance points available today for production parametric test systems. The 4070 Series provides the DC and RF measurement capabilities needed to test the 65 nm process technologies of today, as well as the sub-65 nm process technologies of tomorrow.

- Standards-based family with broad feature-set All members of the 4070 Series family provide complete DC parametric test capability, including Flash memory cell testing, capacitance versus voltage (CV) measurement and ring oscillator evaluation. Additionally, you can integrate all models into your SECS/GEM compatible 300 mm automated factory environment.
- Laboratory test capabilities now available for production test Until now, the precise current and voltage measurement resolution needed for advanced 65 nm processes have been available only in a laboratory environment. The Agilent 4070 Series enables you to measure sensitive device parameters during production test.
- Improved throughput and lowered cost of test In the Agilent 4070 series, the high-speed capacitance measurement unit (CMU) is integrated into the test head, enabling you to make extremely fast capacitance measurements in the 1 KHz to 2 MHz frequency range.
- Ultimate flexibility in testing ultra thin oxide structures The Agilent 4070 series supports both HFCV and RFCV techniques, which allows users to choose the best method to characterize CV behavior that fits both their process technology and production test needs.
- Accurate testing for high-speed devices The Agilent 4070 series supports RF S-parameter measurement (PNA/ENA) to accurately characterize these types of high-speed devices.
- Ultra short-pulsed measurement capability eliminates thermal effects The Agilent 4070 series provides ultra short-pulsed IV measurements down to 10 nanoseconds, which enables characterization of highly thermally sensitive devices such as silicon-on-insulator (SOI) transistors and/or charging effect sensitive high-k transistors.

The Agilent 4070 Series offers the widest range of solutions and price-performance points of any production parametric test systems available today. The full breadth of the 4070 Series, 4072A/B, 4073A/B, 4075 and 4076 provides the DC and RF measurement capabilities to test the 65 nm process technologies of today, as well as the sub-65 nm process technologies of tomorrow. More information is available at www.agilent.com/see/parametric.

http://www.agilent.com


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Nikon have introduced the world’s highest NA (1.07), all refractive 4x optical projection lens in its NSR-S609B immersion scanner.

A 193nm ArF excimer laser light source, combined with the optional Polano loss-less illumination polarisation system have resulted in the capability to expose <55nm L/S.

Using Nikon’s proprietary nozzle design, it has been proven that the introduction of water between the projection lens and the substrate introduces no immersion specific defectivity and, most importantly, no introduction of bubbles, an issue previously regarded by others as a potential show-stopper for immersion scanners.

Nikon’s innovative new stage concept has allowed the retention of high speed wafer scanning, with stepping and overlay results better than a ‘dry’ system. This coupled with our real-time predictive optical focus sensing, provides greater accuracy and control of the wafer plane, inherent in providing class-leading overlay below 8nm.

Cost of Operation (CoO) is always a concern of today’s fab managers and Nikon have reduced CoO consistently with the introduction of each new generation of ArF scanners. This has been maintained with the NSR-S609B through very high throughput and superior imaging performance to provide the world’s first truly manufacturable immersion scanner.

Nikon have introduced the world’s first hyperNA immersion scanner, this is ready for your fab, in the timescale that you need it and most importantly, in a production ready state for the 55nm processes.

http://www.nikon-precision.com


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IMEC fabricates epitaxial GaN layers on 150mm silicon wafers
IMEC

IMEC claims that it has been able to achieve excellent uniformity results with a sheet resistively as low as 272+5 Ω/square and a standard deviation as small as 1.9% (edge excluded) employing the HEMT structures.

The process overcomes issues associated with the growth of high-quality epitaxial GaN layers of Silicon such as the high lattice mismatch and the large difference in thermal expansion coefficient between Silicon GaN. This was accomplished by using a AIGaN buffer layer to provide compressive stress in the top GaN layer. A proprietary IMEC in-situ SI3N4 passivation layer is then used to achieve the results.

According to IMEC the process could lead to low-cost GaN power devices, replacing expensive sapphire SIC based wafers that are only available on smaller wafer sizes.


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Key Features:

• Characterize devices with up to 8 source-measure units
• Sub-femtoamp resolution measurements with optional preamps
• New pulse and pulse 1-V capabilities for advanced semiconductor testing
• New scope card provides integrated scope and pulse measure functionality
• Familiar, point-and-click Windows® environment and intuitive GUI
• Easy to use for both interactive and automated test
• Real-time plotting and analysis allow users to view results before a test has completed and to take preemptive action as needed.
• Embedded PC provides the additional benefits of a network instrument including mapping network drives and making test results available to the corporate network
• Simultaneously acquires data, analyzes plots, and prints reports
• Ideal for device characterization, device modelling, reliability testing, and failure analysis
• Includes instrument and prober drivers as well as interfaces to popular modelling and circuit simulation software

The easy-to-use Model 4200-SCS performs laboratory grade DC and pulse devise characterization, real-time plotting, and analysis with high precision and sub-femtoamp resolution. It is the best tool available for interactive parametric analysis and device characterization. It offers the most advanced capabilities available in a fully integrated characterization system, including a complete, embedded PC Windows® operating system and mass storage. Its self-documenting, point-and-click interface speeds and simplifies the process of taking data, so users can begin analyzing their results.

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Mattson Technology’s Helios 300 mm RTP system features an advanced model-based temperature control that provides the exceptional within-wafer and wafer-to-wafer uniformity, repeatability and reliability required for achieving superior device performance. The system’s outstanding spike anneal performance, with rapid ramp and cool-down rates, provides the precise closed-loop control required for ultra-shallow junction formation. Helios’ low-temperature processing capabilities enable steady-state operation at temperatures down to 250°C, providing greater temperature uniformity for next-generation NiSi formation. Helios supports the full array of RTP applications, providing excellent processing results for the most advanced annealing processes. The system’s modular, dual-chamber platform is designed for ease of use and high reliability. Helios incorporates proprietary dual-side wafer heating, which reduces pattern-related temperature effect, and a transport mechanism that delivers throughput of over 120 wafers per hour. Helios’ high productivity and small footprint offer significant cost-of-ownership advantages for 90 nm and 65 nm device development and production.

The Helios was designed to address both the technical and economic challenges associated with 300 mm and the most advanced device production requirements. The Helios’ excellent thermal processing performance and dynamic temperature control, high productivity and small footprint offer significant cost-of-ownership advantages and make it the ideal solution for chipmakers seeking a robust, cost-effective RTP system to address applications for 90 nm and 65 nm device development and production. Superior cost of ownership (CoO) provided by dual chamber platform with small footprint and high throughput; proprietary dual-side wafer heating provides superior inherent uniformity and minimal thermal stress to the wafer, inherently minimizing temperature gradient caused by patterns; model-based temperature control (MBC) supports significant reduction in process setup costs; advanced processing performance for USJ and NiSi formation to address the most challenging RTP applications at t he 90 nm technology node and below

http://www.mattson.com


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Mattson Technology’s Aspen III eHighlands dry strip system is designed to meet critical back-end-of-line and front-end-of-line process applications for reliable, high-productivity, low-cost-of-ownership sub-90 nm chip manufacturing.

In advanced back-end-of-line (BEOL) applications, photoresist removal processes represent major challenges to low-k/copper integration because conventional dry cleaning processes introduce damage in low-k materials, leading to adverse changes in the dielectric and the materials’ physical properties. The Aspen III eHighlands was designed to help chipmakers overcome the integration challenges associated with these sensitive materials.

Building upon Mattson’s field-proven Aspen III platform, the eHighlands features Mattson’s proprietary inductively coupled plasma (ICP) source and a bias capability that enables independent control of ion energy and ion density at low pressures and temperatures for improved profile control and k value preservation.

The eHighlands offers a wide process window, enabling chipmakers to handle copper (Cu)/low-k/ultra low-k (ULK) dielectric integration and other BEOL dry strip challenges with a single tool. The eHighlands’ unique “three-in-one” integration scheme, where the low-k strip, barrier layer removal and Cu surface treatment processes are performed in-situ, provides chipmakers with up to 35% lower cost-of-ownership than the "all-in-one" approach used by dielectric etch tools.The eHighlands also provides superior on-wafer performance and significant COO benefits for BEOL photoresist etchback, one of the applications in many dual damascene integration schemes.


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ABC200 Automated Wafer Bonding Cluster for MEMS with submicron alignment
SUSS MicroTec Lithography

The ABC200 is a fully automated Wafer Bonding Cluster for production of different MEMS applications. Wafer Bonding is a key technology in production of MEMS devices, a market well known for a wide variety of products and a minimum of standards. Typically applied in 0-level packaging the ABC200 features high flexibility and modularity to fulfil the mentioned MEMS market requirements. Based on a single field proven platform and user-friendly control software the ABC200 can be configured with different process modules for any bond process. The ABC200 is worldwide the first production system with field proven capabilities of high yield plasma activated wafer bonding with sub-micron post-bond alignment accuracy for very critical MEMS/CMOS integration applications.

http://www.suss.com


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Pav150
SUSS MicroTec Test Systems GmbH

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High-performance CMP slurry product
Hitachi Chemical Co

Hitachi Chemical Co. has a high-performance CMP slurry product for STI (Shallow Trench Isolation) that can decrease scratches from polishing by two-thirds and provide a twofold increase of surface flatness over existing products.

The company has developed a high-performance CMP slurry product that is capable of achieving a two-thirds decrease in polishing scratches and a twofold increase in flatness over the existing levels in the CMP process while maintaining the current polishing speed. It produced a CMP slurry product that adopted cerium oxide (CeO2) particles in 1998 and gained a high reputation for products for STI that required the highest flatness with fewer polishing scratches and faster polishing speeds as their advantage. This high-performance development decreases the size of cerium oxide (Ce02) particles by up to 60% compared to those existing products.


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SSA Barrier Slurry
Rohm & Haas

Rohm & Haas Electronic Materials CMP Technologies has a barrier slurry optimized for low-stress/low-pressure chemical mechanical planarisation (CMP) of copper semiconductor devices. SSA Barrier Slurry, targeted at 90nm 65nm CMP, provides consistent performance, excellent defectivity and a large processing window, leading to improved yields and cost of ownership for low-k applications. Customer-proven in both capped and uncapped integration schemes, SSA Barrier Slurry minimizes micro scratches, improves sheet resistance, and lowers overall defect counts versus conventional slurries.

SSA Barrier Slurry is claimed to be the first slurry to attain tantalum and TEOS (tetraethylortho-silicate) rates above 500A/min at low ph, low wt% particles and very small particles while operating at 1.5 psi. This enables end-users to quickly remove various barrier and dielectric films in a gentle CMP process that protects the integrity of the fragile film stack while maximizing throughput, and minimizing topography, oxide loss and defectivity. The acidic pH of SSA Barrier Slurry allows for a compatible and secure transition between acidic bulk copper CMP slurries and SSA on single-platen CMP platforms. For capped integration schemes, significant reduction in topography can be achieved during the barrier removal step without the compromise of high dielectric loss.


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