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	<title>EuroAsia Semiconductor</title>
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	<description>Semiconductor News Views and Events from across Europe, Asia and the rest of the world.  The website also contains a Semiconductor Directory and a specialist MEMS section</description>
	<language>en-gb</language>
	<lastBuildDate>Wed, 20 Jul 2011 11:13:16 GMT</lastBuildDate>
	<copyright>Copyright: (C) EuroAsia Semiconductor</copyright>
			
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        <title>e-forecasting seeing downward semiconductor trend</title>
        <description>European semiconductor industry leading indicator down in May</description>
        <link>http://www.euroasiasemiconductor.com/news_full.php?newsid=74155</link>
		<pubDate>Thu, 14 Jul 2011 10:10:00 GMT</pubDate>
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        <title>3D integration tool nears potential</title>
        <description>Leti and Replisaurus reach next step to ECPR metallization process</description>
        <link>http://www.euroasiasemiconductor.com/news_full.php?newsid=74154</link>
		<pubDate>Thu, 14 Jul 2011 10:10:00 GMT</pubDate>
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        <title>Toshiba and SanDisk Celebrate the Opening of Fab 5</title>
        <description>300mm NAND flash memory fabrication facility in Japan</description>
        <link>http://www.euroasiasemiconductor.com/news_full.php?newsid=74161</link>
		<pubDate>Wed, 13 Jul 2011 10:10:00 GMT</pubDate>
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        <title>imec produces first EUV lithography wafer</title>
        <description>In a major step towards the next generation of scaling imec has presented details of EUV work at Semicon West</description>
        <link>http://www.euroasiasemiconductor.com/news_full.php?newsid=74159</link>
		<pubDate>Wed, 13 Jul 2011 10:10:00 GMT</pubDate>
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        <title>Intermolecular signs</title>
        <description>Intermolecular and GLOBALFOUNDRIES sign broad collaborative development and IP licensing agreement</description>
        <link>http://www.euroasiasemiconductor.com/news_full.php?newsid=74157</link>
		<pubDate>Wed, 13 Jul 2011 10:10:00 GMT</pubDate>
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        <title>Contamination control on semiconductor manufacturing</title>
        <description>CEA-Leti and Entegris to study cross-molecular contamination between wafers and containers in chip industry</description>
        <link>http://www.euroasiasemiconductor.com/news_full.php?newsid=74162</link>
		<pubDate>Tue, 12 Jul 2011 10:10:00 GMT</pubDate>
</item><item>
        <title>Semiconductor companies join SEMATECH’s Albany EUVL mask push</title>
        <description>Industries top companies announce their participation</description>
        <link>http://www.euroasiasemiconductor.com/news_full.php?newsid=74158</link>
		<pubDate>Tue, 12 Jul 2011 10:10:00 GMT</pubDate>
</item><item>
        <title>Applied Materials prepares beyond Moore’s Law</title>
        <description>Applied Materials pushes transistor boundaries with atomic scale manufacturing technology</description>
        <link>http://www.euroasiasemiconductor.com/news_full.php?newsid=74150</link>
		<pubDate>Tue, 12 Jul 2011 10:10:00 GMT</pubDate>
</item><item>
        <title>FD-SOI claims economic advantage</title>
        <description>Report commissioned by Soitec comes to SOI positive conclusions</description>
        <link>http://www.euroasiasemiconductor.com/news_full.php?newsid=74147</link>
		<pubDate>Tue, 12 Jul 2011 10:10:00 GMT</pubDate>
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        <title>IME and tMt strengthen MEMS expertise </title>
        <description>Singapore’s Institute of Microelectronics (IME) has announced JV with Touch Micro-System Technology (tMt),</description>
        <link>http://www.euroasiasemiconductor.com/news_full.php?newsid=74129</link>
		<pubDate>Fri, 08 Jul 2011 10:10:00 GMT</pubDate>
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