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AIXTRON on track for 2008 targets Full Year guidance confirmed, compound common platform systems dominate demand, continued silicon weakness in line with market conditions.

AMD appoints former HP exec Alberto Bozzo to head EMEA region The industry veteran brings more than 20 years of commercial and consumer PC experience.

Will there be blood on the chip market road ahead? “The chip industry marches on, but not for much longer,” comments Future Horizons’ Malcolm Penn.

Concept Engineering and EVE sign partnership agreement EVE customers offered free use of Concept Engineering’s graphical engine; integration between tools planned.

eSilicon accelerates expansion in Europe The company extends its position in European fabless ASIC market.

Intel invests in China Three new investments in China including its first Chinese Cleantech Investments. Intel Capital announces US$20 million investment in Trony that aims to accelerate renewable energy generation and drive China's sustainable development.

SEMATECH acquires TSV RIE tool from TEL The 300 mm TSV RIE tool to be installed at SEMATECH’s 3D R&D centre at UAlbany NanoCollege.

SUSS MicroTec and STS take to the road Both companies announce seminar series in Asia on innovative process solutions for 3D integration.

Powerchip Semiconductor settles litigation with MOSAID Dispute is now resolved with three of four defendants in patent infringement lawsuit.

NXP sells fab in Caen The 150 mm fab is available for immediate operation.

Oerlikon sells Optics business at Balzers The company aims to streamline its global business.

austriamicrosystems lowers expectations The company reports 6% revenue and 10% earnings growth in the third quarter, weakened demand environment expected for remainder of 2008 due to economic headwinds.

NanoIntegris makes SWCNTs available The company announces sale of metallic and semiconducting carbon nanotubes.

Toshiba to launch 43nm SLC NAND flash memory Introducing the industry’s largest density SLC NAND chip at16Gb chip and enhanced SLC line ups.

Seoul Semiconductor wins U.S. lawsuit United States Court awards judgement to Seoul Semiconductor against Nichia.

Verigy establishes office in Israel The semiconductor test company is now officially present in Petach Tikva, Israel.

UMC announces foundry industry’s first 28nm SRAMs Double patterning immersion lithography and advanced strained silicon technology is used to deliver fully functional 28nm chips.

SMIC received U.S. export licenses for 32nm technologies The company can now start flash R&D in its manufacturing facilities.

picoChip makes it to the top three The company ranks in top three fastest growing technology companies in the UK in the 2008 Deloitte Technology Fast 50. picoChip attributes Its 4483% revenue growth to the emergence of the femtocell market.

Freescale enhances its liquidity The company draws $460 million under its revolving credit agreement.

SMIC improves CIS devices The foundry successfully developed 0.11 Micron CIS process technology.

IMS CHIPS and Robert Bosch signed contract Ultra thin chip fabrication capability will be a key enabler in future microelectronics and microsystems applications, such as three dimensional integrated circuits (3D IC) and systems in foil (SiF).

Chinese semiconductor company AMEC raises $58 million Advanced Micro Fabrication Equipment (AMEC), an Asia based semiconductor equipment maker and this year's EuroAsia IC Industry Award's Start Up of the Year recipient, secured $58 million in Series C financing.

Ubiquisys employs Keithley RF test systems The company aims to ramp up its Femtocell production.

Silicon Hive receives US$7 million in new funding The funding comes from from Intel Capital and current investors. The company aims to expand global sales and marketing and grow the HiveGo solution portfolio for mobile phones and mobile internet devices.