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Wacker increases polysilicon production Wacker to set up new polysilicon production facility in the United States

China’s auto electronics to hit brakes According to iSuppli China’s automotive electronics suppliers face slowdown

AMAT joins TSV group Applied Materials joins EMC-3D Equipment and Materials Consortium focusing on developing TSV technology.

Flash 42nm designs Synopsys, Powerchip and Nikon collaborate on 42nm flash memory optimisation

Micron looks to lose 2000 employees Micron Technology releases contingency plan in response to continued decrease in demand.

E-beam consortium established With no new successor to current lithography techniques a consortium has been formed to accelerate development and adoption of design for e-beam technology

Desktop nanoarrays NanoInk launches destop Nanoarray fabrication system

Harvesting MEMS energy Yole Développement release report on MEMS energy harvesting devices looking at the technology and the markets

10 ideas that will change your life MIT announce the always fascinating 10 emerging technologies poised to reshape our world.

Joint venture for 22nm IBM, Applied Materials and UAlbany NanoCollege to Develop Process Modeling Technology for Manufacturing 22nm Chips

Intel visit Middle East Dubai Silicon Oasis Authority holds talks on potential collaboration with Intel

SOI continues to attract IMEC joins the SOI industry consortium

Qimonda seeks buyers Talks with potential buyers intensified as Qimonda’s particular importance for Germany as a high-tech location is highlighted. Meanwhile statutory insolvency payments made to employees.

Investment improves NanoSight Shackleton Ventures completes further investment in NanoSight

MEMSCAP stabilises cash flow MEMSCAP happy with fiscal results despite slight fall in income.

ASE Signs MOU with AMPI Companies to develop a strategic alliance to deliver services for MOSFET, Power IC and Discrete customers

Qimonda has more bad news The USA branch of Qimonda has filed for chapter 11 bankruptcy.

Common lab to further 3-D MEMS Léti and Brewer Science create a common laboratory for new 3-D stacking and MEMS process flows

Rambus review refusal High Court denies FTC antitrust review of Rambus

Investors okay AMD sale AMD shareholders vote on Abu Dhabi investment and agree to the formation of The Foundry Company

WW DRAM cut 32% Q1-09 world wide capacity cut 32%, Taiwanese vendors cut 50% of total capacity as the highest in the world, states DRAMeXchange

Foundry suppliers shoulder burden A Semico report suggests foundry capacity will remain low for 2009

Fire resistant carbon nanotubes Frost and Sullivan release carbon nanotube report

IMEC has plenty for show and tell IMEC's record 26 paper presentations to show SPIE attendees the newest advances in next-generation semiconductor microlithography

JV to develop MEMS solutions SUSS MicroTec and iX-factory join forces for the development of microfluidics and integrated optical MEMS solutions

Launch the full edition in a new window.

TSMC versus GlobalFoundries: Semiconductor Design Enablement!

As mentioned in previous blogs, design enablement is a key enabler to fabless semiconductor design and manufacture, without question. The purpose of this blog (in 500 words) is to compare and contrast two very different design enablement strategies and engage the semiconductor community in a meaningful discussion.

*****Diamond slims down*****Advanced Diamond
Technologies discuss the advances*****

1	TSMC To Invest $319.6 million Into LEDs & Solar Cells

2	Growing for demand

3	SEMI divides to conquer

4	Taiwan Still the Largest Semiconductor Equipment Market

5	Silicon wafers continue to rise

6	Aixtron Expands Its Customer Base With MOCVD Tools In Bulgaria

7	Fairchild reduces debt

8	Lattice loses CEO

9	Too many wafers could spoil the party

10	Bergen University Chooses Plasma-Therm's 790+ for Nano-fabrication Facility

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